Z-Directed Components for Printed Circuit Boards

• US 20110017502A1
• Filed: 07/23/2009
• Published: 01/27/2011
• Est. Priority Date: 07/23/2009
• Status: Abandoned Application

• Current Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Original Assignee: Lexmark International Incorporated (Ninestar Corporation)
• Inventors: Hall, Paul Kevin, Oglesbee, Robert Aaron, Fessler, John Thomas, Hardin, Keith Bryan, Nally, Brian Lee
• Application Number:
  US12/508,131
• Publication Number:
  US 20110017502A1
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10893 Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator
• CPC Class Codes: H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive soldering leadless components having an array of bottom contacts H05K3/3436; BGA components H05K2201/10734
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Abstract

A design for a Z-directed component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Z-directed components include high frequency signal pass throughs, capacitors, diodes, transistors, transmission lines, delay lines. Methods for mounting Z-directed components are also provided.

Claims

1. A Z-directed component for mounting in a printed circuit board (PCB) having a mounting hole having a depth D therein, comprising:

a body having a top surface, a bottom surface and side surface, a length L, a cross-sectional shape that is insertable into the mounting hole in the PCB, and a portion thereof comprising an insulators.

2. The Z-directed component of claim 1 further comprising a conductor extending through at least a portion of the length L of the body with the conductor in electrical connection with one of the top and bottom surfaces of the body.

3. The Z-directed component of claim 2 wherein one of the top and bottom surfaces further comprises a conductive trace electrically connected to an end of the conductor adjacent thereto and extending therefrom to an edge of the body.

4. The Z-directed component of claim 2 wherein the side surface further comprises a channel therein extending from at least one of the top surface and bottom surface toward the opposite surface.

5. The Z-directed component of claim 4 wherein the channel extends between the top and bottom surfaces.

6. The Z-directed component of claim 4 wherein the channel has a cross-sectional shape that is one of C-shape, V-shape, U-shape, semi-circular, and semi-elliptical.

7. The Z-directed component of claim 4 wherein the channel comprises at least two channels one of which extends between the top and bottom surface and the other of which extends from one of the top surface and bottom surface toward the opposite surface.

8. The Z-directed component of claim 7 wherein the other channel extends between the top and bottom surface.

9. The Z-directed component of claim 4 wherein the body further comprises an electrical component interconnecting the channel with the conductor wherein the electrical component is integrally formed by a material comprising a portion of the body.

10. The Z-directed component of claim 4 wherein the body further comprises an electrical component interconnecting the channel with the conductor wherein the electrical component is integrated into a material comprising a portion of the body.

11. The Z-directed component of claim 4 wherein the surface of the channel is plated with an electrically conductive material.

12. The Z-directed component of claim 1 wherein the body further comprises a plurality of conductors extending therethrough from one of the top surface, the bottom surface and both surfaces toward the other surface.

13. The Z-directed component of claim 12 wherein for each end of the plurality of conductors extending from one of the top surface, the bottom surface and both the top and bottom surfaces adjacent the top surface and bottom surface, a plurality of conductive traces each electrically connecting to a corresponding one of the ends of the plurality of conductors adjacent thereto and extending therefrom to an edge of the body.

14. The Z-directed component of claim 1 wherein the body is further comprised of one or more regions with each of the one or more regions comprised of a material selected from a group comprising a conductive material, a resistive material, a magnetic material, a dielectric material, a semiconductive material and combinations thereof.

15. The Z-directed component of claim 1 further comprising;

at least one O-ring; and

at least one circumferential channel provided in the side surface for receiving the at least one O-ring.

16. The Z-directed component of claim 1 wherein the conductor comprises a region intermediate the ends comprising a material selected from a group comprising a conductive material, a resistive material, a magnetic material, a dielectric material, a semiconductive material and combinations thereof.

17. The Z-directed component of claim 1 wherein the length L of the body is one of:

less than the depth D, equal to the depth D, greater than the depth D.

18. A Z-directed component for mounting in a printed circuit board (PCB) having a mounting hole having a depth D therein, comprising:

a body comprised of an electrically insulative material, the body having a top surface, a bottom surface and side surface, a length L, and a cross-sectional shape that is insertable into the mounting hole in the PCB;

at least one conductor extending through at least a portion of the length L of the body with the at least one conductor in electrical connection with one of the top and bottom surfaces of the body;

one of the top and bottom surfaces further comprising a conductive trace electrically connected an end of the at least one conductor adjacent thereto and extending therefrom to an edge of the body; and

the side surface further comprising at least two channels therein, each of the at least two channels extending from at least one of the top surface and bottom surface toward the opposite surface.

19. The Z-directed component of claim 18 wherein each of the at least two channels extends between the top and bottom surfaces.

20. The Z-directed component of claim 18 wherein the body further comprises an electrical component interconnecting at least two of the at least one conductor and the at least two channels wherein the electrical component is integrally formed by a material comprising a portion of the body.

21. The Z-directed component of claim 20 wherein the electrical component interconnects each of the at least two channels with the at least one conductor.

22. The Z-directed component of claim 18 wherein the body further comprises an electrical component interconnecting at least two of the at least one conductor and the at least two channels wherein the electrical component is integrated into a material comprising a portion of the body.

23. The Z-directed component of claim 22 wherein the electrical component interconnects the at least one conductor and the at least two channels.

24. The Z-directed component of claim 20 wherein the electrical component is one of a resistor, a capacitor, an inductor, a transformer, an integrated circuit, a diode, a transistor, a mosfet, a zener diode, a surge suppressor, a diac, a varactor, and combinations thereof

25. The Z-directed component of claim 22 wherein the electrical component is one of a resistor, a capacitor, an inductor, a transformer, an integrated circuit, a diode, a transistor, a mosfet, a zener diode, a surge suppressor, a diac, a varactor, and combinations thereof.

26. The Z-directed component of claim 18 wherein the body further comprises a locating feature selected from one of an axial projection having a locating surface, a recess having a locating surface, a visual marker, and a magnetic marker.

27. The Z-directed component of claim 18 wherein the body further comprises a connection feature selected from one of a conductive pad, a pogo-pin, and a spring.