Method of Producing Covers for Electronics
First Claim
Patent Images
1. A process of making covers for electronics, comprising the steps of:
- forming a cover group having a plurality of covers where the covers are connected by interspaced portions; and
separating the covers from the group.
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Abstract
A process of making parts for electronics including forming a plurality of covers in a cover group where the covers are connected by interspaced portions. An electrically conductive material may be applied to the bottom side of the group for shielding electro-magnetic interference, electrostatic discharge, radio frequency interference, or other unwanted exterior disturbance, discharge, or interference. The covers are separated from the cover group.
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Citations
20 Claims
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1. A process of making covers for electronics, comprising the steps of:
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forming a cover group having a plurality of covers where the covers are connected by interspaced portions; and separating the covers from the group. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A process of making covers for electronics, comprising the steps of:
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forming a plurality of covers in a cover group where the covers are connected by interspaced portions; applying an electrically conductive material to the one side of the group; and separating the covers from the group. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A process of making parts for electronics, comprising the steps of:
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forming a plurality of parts in a group where the parts are connected by interspaced portions; applying an electrically conductive material to the bottom side of the group; and separating the parts from the group.
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Specification