SENSOR AND SENSOR SYSTEM FOR A CAMERA

• US 20110019048A1
• Filed: 07/26/2010
• Published: 01/27/2011
• Est. Priority Date: 07/27/2009
• Status: Active Grant

• Current Assignee: STMicroelectronics Limited (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Limited (STMicroelectronics NV)
• Inventors: Smith, Stewart, Laflaquiere, Arnaud, Raynor, Jeffrey
• Granted Patent: US 9,059,064 B2
• Time in Patent Office: Days
• US Class Current: 348/302
• CPC Class Codes: H01L 27/1446 in a repetitive configuration
• CPC Class Codes: H01L 27/14603 Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/14689 MOS based technologies
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H04N 23/11 for generating image signals from visible and infrared light wavelengths
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 25/00 Circuitry of solid-state image sensors [SSIS]; Control thereof
• CPC Class Codes: H04N 25/134 based on three different wavelength filter elements

Abstract

A sensor module has first and second sensor arrays formed on a substrate, with the first and second sensor arrays adapted to share common readout circuitry and shared read out for a pair of sensors on a single array.

Claims

1-16. -16. (canceled)

17. A sensor module comprising:

a substrate;

first and second sensor arrays formed on the substrate; and

common readout circuitry coupled to said first and second sensor arrays.

18. The sensor module of claim 17, wherein said first and second sensor arrays have parallel optical axes.

19. The sensor module of claim 17, wherein said first sensor array is configured for use in different light conditions than said second sensor array.

20. The sensor module of claim 17, further comprising first and second optical assemblies cooperating with said first and second sensor arrays to thereby form first and second camera assemblies.

21. The sensor module of claim 20, wherein said first and second optical assemblies each have an optical axis;

wherein said first and second sensor arrays each have an optical axis; and

wherein the optical axes of said first and second sensor arrays are aligned with the optical axes of said first and second optical assemblies, respectively.

22. The sensor module of claim 20, wherein said first camera assembly has a different resolution than said second camera assembly.

23. The sensor module of claim 20, wherein said first sensor array includes a color filter.

24. The sensor module of claim 20, further comprising a phase plate.

25. The sensor module of claim 17, wherein said first and second sensors have first and second pixel pitches, respectively, the first pixel pitch being equal to the second pixel pitch.

26. The sensor module of claim 17, wherein said first and second sensors have first and second pixel pitches, respectively, the first pixel pitch being a multiple of the second pixel pitch.

27. A sensor module comprising:

a substrate;

first and second sensor arrays configured formed on the substrate and having parallel optical axes, said first sensor array being configured for use in different light conditions than said second sensor array; and

common readout circuitry coupled to said first and second sensor arrays.

28. The sensor module of claim 27, further comprising first and second optical assemblies cooperating with said first and second sensor arrays to thereby form first and second camera assemblies.

29. The sensor module of claim 27, wherein said first and second optical assemblies each have an optical axis;

wherein said first and second sensor arrays each have an optical axis; and

wherein the optical axes of said first and second sensor arrays are aligned with the optical axes of said first and second optical assemblies, respectively.

30. The sensor module of claim 27, wherein said first camera assembly has a different resolution than said second camera assembly.

31. The sensor module of claim 27, wherein said first sensor array includes a color filter.

32. A method of manufacturing a camera module comprising:

forming a plurality of dual optical sensors on a first wafer;

forming a plurality of dual optical assemblies on a second wafer;

aligning the first and second wafers such that the plurality of dual optical sensors and the plurality of optical assemblies have aligned optical axes, respectively;

bonding the first and second wafers to thereby form a plurality of camera assemblies; and

separating the plurality of dual camera assemblies.

33. A method of making a sensor module comprising:

forming first and second sensor arrays on a substrate; and

coupling common readout circuitry to the first and second sensor arrays.

34. The method of claim 33, wherein the first and second sensor arrays have parallel optical axes.

35. The method of claim 33, wherein the first sensor array is configured for use in different light conditions than the second sensor array.

36. The method of claim 33, further comprising coupling first and second optical assemblies to the first and second sensor arrays to thereby form first and second camera assemblies.

37. The method of claim 36, wherein the first and second optical assemblies each have an optical axis;

wherein the first and second sensor arrays each have an optical axis; and

wherein the optical axes of said first and second sensor arrays are aligned with the optical axes of said first and second optical assemblies, respectively.

38. A camera module comprising:

a sensor module comprising

a substrate,

first and second sensor arrays formed on the substrate, and

common readout circuitry coupled to said first and second sensor arrays; and

first and second optical assemblies aligned with said first and second sensor arrays.

39. A device comprising:

camera module comprising

a sensor module comprising

a substrate,

first and second sensor arrays formed on the substrate, and

common readout circuitry coupled to said first and second sensor arrays; and

first and second optical assemblies aligned with said first and second sensor arrays.