FLEXIBLE CIRCUIT MODULE

• US 20110019370A1
• Filed: 07/27/2009
• Published: 01/27/2011
• Est. Priority Date: 07/27/2009
• Status: Abandoned Application

• Current Assignee: Gainteam Holdings Limited
• Original Assignee: Gainteam Holdings Limited
• Inventors: Koh, Wei-hu
• Application Number:
  US12/510,157
• Publication Number:
  US 20110019370A1
• Time in Patent Office: Days
• US Class Current: 361/749
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73104 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/7565 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81444 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81895 between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/9211 Parallel connecting processes
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/92225 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3164 the coating being a foil
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0108 : Transparent
• CPC Class Codes: H05K 2201/10159 : Memory
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/1311 : Foil encapsulation, e.g. of mounted components
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

This disclosure pertains to a flexible circuit module and related methods of manufacturing and applications for such a flexible circuit module. In one exemplary embodiment, the flexible circuit module comprises a flexible substrate, at least one flexible chip element, and a flexible top layer disposed over the flexible substrate and the flexible chip element. According to an aspect, a flexible circuit module is used in flexible electronic devices. According to another aspect, a flexible circuit module is attached to the inner surface of an electronic device and connected to the device main board. According to another aspect, a flexible circuit module is used in the place of a current PCB in a PCBA. According to another aspect, a flexible circuit module is rolled up and used inside an electronic device. According to another aspect, a flexible circuit module is molded.

Claims

1. A flexible circuit module, the module comprising:

a flexible substrate;

at least one flexible chip disposed on a top surface of the flexible substrate; and

a flexible top layer laminated to the top surface of the flexible substrate, wherein the at least one flexible chip is disposed in between the flexible substrate and the flexible top layer; and

wherein the flexible top layer forms a conformal layer on the entire top surface of the flexible substrate.

2. The module of claim 1, wherein the flexible top layer is chemically bonded to the top surface of the flexible substrate.

3. The module of claim 1, wherein the at least one flexible chip is partially embedded in the flexible substrate.

4. The module of claim 1, wherein the at least one flexible chip comprises a memory chip.

5. The module of claim 1, further comprising at least one passive chip.

6. The module of claim 1, further comprising at least one memory controller.

7. The module of claim 1, further comprising at least one surface mount component.

8. The module of claim 1, wherein the flexible substrate comprises at least one connecting pad.

9. The module of claim 1, wherein the flexible top layer is transparent.

10. The module of claim 1, wherein the flexible top layer is made of a polymer material.

11. The module of claim 1, wherein the flexible top layer cooperates with the flexible substrate to provide a hermetic seal for the at least one flexible chip.

12. The module of claim 1, wherein the at least one flexible chip has a thickness that is less than 25 micrometers thick.

13. The module of claim 1, wherein at least one input/output interface of the at least one flexible chip is connected to at least one connecting pad of the flexible substrate.

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24. (canceled)

25. A flexible circuit module, the module comprising:

a flexible substrate;

at least one flexible chip disposed on a top surface of the flexible substrate; and

a flexible top layer laminated to a portion of the top surface of the flexible substrate, wherein the at least one flexible chip is disposed in between the flexible substrate and the flexible top layer; and

wherein the flexible top layer forms a conformal layer on the at least one flexible chip, and wherein the flexible top layer cooperates with the flexible substrate to provide a hermetic seal for the at least one flexible chip, thereby sealing the at least one flexible chip from the environment.

26. The module of claim 25, wherein the flexible top layer is chemically bonded to the top surface of the flexible substrate.

27. The module of claim 25, wherein the at least one flexible chip comprises a memory chip.

28. The module of claim 25, further comprising at least one passive chip.

29. The module of claim 25, further comprising at least one memory controller.

30. The module of claim 25, further comprising at least one surface mount component.

31. The module of claim 25, wherein the flexible substrate comprises at least one connecting pad.

32. The module of claim 25, wherein the flexible top layer is transparent.

33. The module of claim 25, wherein the flexible top layer is made of a polymer material.

34. The module of claim 25, wherein the at least one flexible chip has a thickness that is less than 25 micrometers thick.

35. The module of claim 25, wherein at least one input/output interface of the at least one flexible chip is connected to at least one connecting pad of the flexible substrate.