HEAT DISSIPATING MODULE OF LIGHT EMITTING DIODE

• US 20110019415A1
• Filed: 12/01/2009
• Published: 01/27/2011
• Est. Priority Date: 07/24/2009
• Status: Abandoned Application

• Current Assignee: Wei-Ting Chen
• Original Assignee: Wei-Ting Chen
• Inventors: CHEN, WEI-TING
• Application Number:
  US12/628,444
• Publication Number:
  US 20110019415A1
• Time in Patent Office: Days
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A LED heat dissipating module includes a plurality of flat light emitting diodes, a circuit board having a plurality of perforations, a plurality of thermally-conductive structures, and a thermally-conductive metallic slice disposed on the backside of the circuit board. The thermally-conductive structures are penetrated through the perforations and in contact with the flat light emitting diodes and the thermally-conductive metallic slice. The heat energy generated from the flat light emitting diodes is conducted from the thermally-conductive structures to the thermally-conductive metallic slice, and then exhausted out of the LED heat dissipating module from the thermally-conductive metallic slice.

Claims

1. A LED heat dissipating module, comprising:

a circuit board having a plurality of perforations;

a plurality of light emitting diodes disposed on a surface of said circuit board and corresponding to respective perforations, wherein said perforations are covered by corresponding light emitting diodes;

a plurality of thermally-conductive structures connected with respective light emitting diodes and inserted into corresponding perforations for conducting heat energy that is generated from said light emitting diodes; and

a thermally-conductive metallic slice having a plurality openings corresponding to said perforations of said circuit board such that said thermally-conductive structures are permitted to be penetrated through corresponding openings, wherein said thermally-conductive metallic slice is disposed on a backside of said circuit board and in contact with said thermally-conductive structures for conducting said heat energy that is generated from said light emitting diodes and removing said heat energy.

2. The LED heat dissipating module according to claim 1 wherein said openings are aligned with said perforations of said circuit board such that said thermally-conductive structures are penetrated through corresponding perforations and corresponding openings.

3. The LED heat dissipating module according to claim 1 wherein said thermally-conductive metallic slice is a tin board or a gold-plated board.

4. The LED heat dissipating module according to claim 1 further comprising a heat sink, which is in contact with said thermally-conductive metallic slice and said thermally-conductive structures for facilitating dissipating said heat energy.

5. The LED heat dissipating module according to claim 4 wherein said heat sink is made of aluminum.

6. The LED heat dissipating module according to claim 1 wherein said circuit board is made of epoxy glass fiber sheet (FR4) material.

7. The LED heat dissipating module according to claim 1 wherein said light emitting diodes are surface mount device LEDs (SMD LEDs) that are mounted on said circuit board according to a surface mount technology (SMT).

8. The LED heat dissipating module according to claim 7 wherein each of said SMD LEDs is a 5050 SMD LED having a dimension of 5 mm×

5 mm.

9. The LED heat dissipating module according to claim 1 wherein said thermally-conductive structures are thermal greases or thermal adhesives.