Thermal Management Of LED-Based Lighting Systems

• US 20110019417A1
• Filed: 10/04/2010
• Published: 01/27/2011
• Est. Priority Date: 04/16/2006
• Status: Active Grant

• Current Assignee: Current Lighting Solutions, LLC (f/k/a GE Lighting Solutions, LLC) (American Industrial Partners)
• Original Assignee: Albeo Technologies (Savant Systems, LLC)
• Inventors: Bisberg, Jeff, Van Laanen, Peter
• Granted Patent: US 8,011,799 B2
• Time in Patent Office: Days
• US Class Current: 362/249.02
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED-based lighting system includes a printed circuit board (“PCB”) having conductors on a front-side thereof, one or more LEDs mounted with the conductors, and a structural element. The PCB is mounted with the conductors near to the structural element so that heat dissipation from the LEDs is primarily through the conductors and the structural element. A method of dissipating heat generated by an LED-based lighting system includes configuring a PCB with conductors on a front-side of the PCB, such that when one or more LEDs mounted to the conductors generates heat, the heat dissipates from the one or more LEDs to the conductors. The method also includes integrating a structural element such that at least portions of the conductors face the structural element, and the heat dissipates from the conductors to the structural element.

Claims

1. An LED (light-emitting diode)-based lighting system, comprising:

a PCB (printed circuit board) having conductors on a front-side thereof, the conductors occupying at least 50% of a front-side area of the PCB;

one or more LEDs mounted on the front-side of the PCB and in thermal contact with the conductors; and

a structural element having the PCB mounted with the conductors in thermal contact therewith so that heat generated by the one or more LEDs dissipates through the structural element via the conductors.

2. The system of claim 1, the conductors occupying at least 70% of a front-side area of the PCB.

3. The system of claim 1, the conductors providing electrical connectivity to at least one of the LEDs.

4. The system of claim 1, further comprising a dielectric film between the PCB and the structural element.

5. An LED (light-emitting diode)-based lighting system, comprising:

a PCB (printed circuit board) having conductors on a front-side thereof, the conductors having a weight per area of at least 2.0 oz/ft² to facilitate heat dissipation;

one or more LEDs mounted on the front-side of the PCB and in thermal contact with the conductors; and

a structural element having the PCB mounted with the conductors in thermal contact therewith so that heat generated by the one or more LEDs dissipates to the structural element via the conductors.

6. The system of claim 5, the conductors having a weight per area of at least 2.5 oz/ft².

7. An LED (light-emitting diode)-based lighting system, comprising:

a PCB (printed circuit board) having conductors on a front-side thereof;

one or more LEDs mounted on the front-side of the PCB and in thermal contact with the conductors; and

a structural element having the PCB mounted with the conductors in contact therewith so that a majority of the heat generated by the one or more LEDs dissipates through the structural element via the conductors, as compared to other heat dissipation paths.

8. An LED (light-emitting diode)-based lighting system, comprising:

a PCB (printed circuit board) having conductors on both a front-side and a back-side thereof;

the front-side of the PCB having one or more LEDs mounted thereon and in thermal contact with the front-side conductors, with no electrical components other than the LEDs mounted on the front-side of the PCB, such that the PCB presents a planar surface except at the LEDs;

the back-side of the PCB having one or more electrical components mounted thereon; and

a structural element coupled with the PCB, with the conductors on the front-side of the PCB in thermal contact with the structural element, such that heat generated by the one or more LEDs dissipates through the structural element via the conductors.

9. An LED (light-emitting diode)-based lighting system, comprising:

a PCB (printed circuit board) with a first number of LEDs mounted thereon, the first number being two or greater; and

a structural element that forms a second number of apertures, the second number being greater than or equal to the first number, the structural element mounted with the PCB such that light from each one of the LEDs passes through a corresponding one of the apertures, and each of the apertures has at most one LED emitting light therethrough.

10. The system of claim 9, the second number being equal to the first number.