MICROMECHANICAL YAW-RATE SENSOR

• US 20110023600A1
• Filed: 07/13/2010
• Published: 02/03/2011
• Est. Priority Date: 07/21/2009
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Hauer, Joerg, WREDE, Martin, Balslink, Thorsten, Meisel, Daniel Christoph, Geckeler, Carsten, Ohms, Torsten, Frey, Jens, Classen, Johannes, Kuhlmann, Burkhard
• Granted Patent: US 8,490,483 B2
• Time in Patent Office: Days
• US Class Current: 73/504.13
• CPC Class Codes: G01C 19/5712 the devices involving a micromechanical structure
• CPC Class Codes: G01C 19/5747 each sensing mass being connected to a driving mass, e.g. driving frames

Abstract

A micromechanical yaw-rate sensor comprising a first yaw-rate sensor element, which outputs a first sensor signal, which contains information about a rotation around a first rotational axis, a second yaw-rate sensor element, which outputs a second sensor signal, which contains information about a rotation around a second rotational axis, which is perpendicular to the first rotational axis, a drive, which drives the first yaw-rate sensor element, and a coupling link, which mechanically couples the first yaw-rate sensor element and the second yaw-rate sensor element to one another, so that driving of the first yaw-rate sensor element also causes driving of the second yaw-rate sensor element.

Claims

1. A micromechanical yaw-rate sensor, comprising:

a first yaw-rate sensor element which outputs a first sensor signal containing information about a rotation around a first rotational axis;

a second yaw-rate sensor element which outputs a second sensor signal containing information about a rotation around a second rotational axis, the second rotational axis being perpendicular to the first rotational axis;

a coupling link which mechanically couples the first yaw-rate sensor element and the second yaw-rate sensor element to one another; and

a drive which drives the first yaw-rate sensor element, driving of the first yaw-rate sensor element by the drive also causing driving of the second yaw-rate sensor element due to the mechanical coupling by the coupling link.

3. The micromechanical yaw-rate sensor as recited in claim 1, wherein the first yaw-rate sensor element is a linear oscillator and has a first oscillating body, which can be set into a linear oscillation perpendicular to the first rotational axis in relation to a substrate, and wherein the second yaw-rate sensor element is a rotational oscillator having a second oscillating body which can be set into a rotational oscillation movement in an oscillation plane which is parallel to the second rotational axis in relation to the substrate.

4. The micromechanical yaw-rate sensor as recited in claim 3, wherein the first yaw-rate sensor element is a linear oscillator and has a first oscillating body, which can be set into a linear oscillation perpendicular to the first rotational axis in relation to a substrate, and wherein the second yaw-rate sensor element is a rotational oscillator having a second oscillating body which can be set into a rotational oscillation movement in an oscillation plane which is parallel to the second rotational axis in relation to the substrate.

5. The micromechanical yaw-rate sensor as recited in claim 3, wherein the second yaw-rate sensor element outputs a third sensor signal, the third sensor signal containing information about a rotation around a third rotational axis which is parallel to the oscillation plane and nonparallel to the second rotational axis.

6. The micromechanical yaw-rate sensor as recited in claim 3, wherein the first yaw-rate sensor element has two linear oscillators, and the rotational oscillator is situated between the two linear oscillators.

7. The micromechanical yaw-rate sensor as recited in claim 3, wherein the first yaw-rate sensor element and the second yaw-rate sensor element are integrated in a single semiconductor chip.

8. The micromechanical yaw-rate sensor as recited in claim 7, wherein the oscillators of the yaw-rate sensor elements are structured in the semiconductor material of the semiconductor chip, and coupling webs manufactured from the semiconductor material are provided as the coupling link.

9. The micromechanical yaw-rate sensor as recited in claim 1, further comprising:

a multiplexer;

a signal processing unit; and

a demultiplexer;

wherein the first and the second yaw-rate sensor element each output at least one sensor signal containing information about a rotation around a rotational axis, to the multiplexer, the multiplexer supplying one of the sensor signals to the signal processing unit at various times, the signal processing unit subjecting the supplied sensor signal to processing and outputting it to the demultiplexer, and the demultiplexer has multiple outputs, and switches the processed sensor signal to different outputs at various times.

10. The micromechanical yaw-rate sensor as recited in claim 9, wherein the signal processing unit includes a demodulator, which demodulates the supplied sensor signal, and a low-pass filter, which subjects the demodulated sensor signal to low-pass filtering.

11. The micromechanical yaw-rate sensor as recited in claim 1, wherein the first yaw-rate sensor element and the second yaw-rate sensor element have a congruent mirror plane.

2. A micromechanical yaw-rate sensor, comprising:

a first yaw-rate sensor element which outputs a first sensor signal containing information about a rotation around a first rotational axis;

a second yaw-rate sensor element which outputs a second sensor signal containing information about a rotation around a second rotational axis, the second rotational axis being perpendicular to the first rotational axis;

a coupling link which mechanically couples the first yaw-rate sensor element and the second yaw-rate sensor element to one another; and

a drive which drives the coupling link, driving of the coupling link by the drive also causing driving of the first yaw-rate sensor element and the second yaw-rate sensor element.