SYSTEMS AND METHODS FOR COMPOSITE STRUCTURES WITH EMBEDDED INTERCONNECTS

• US 20110024165A1
• Filed: 10/27/2009
• Published: 02/03/2011
• Est. Priority Date: 07/31/2009
• Status: Abandoned Application

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Olden, Thomas A., Wrigglesworth, Walter
• Application Number:
  US12/606,462
• Publication Number:
  US 20110024165A1
• Time in Patent Office: Days
• US Class Current: 174/257
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/0323 Carbon
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/092 Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/4632 laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
• CPC Class Codes: H05K 3/465 by applying an insulating layer having channels for the next circuit layer
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

Claims

1. A composite interconnect assembly comprising:

a body structure comprising a composite material;

a conductive trace embedded within the body structure;

a contact region defined on the body structure such that the conductive trace is exposed and is configured to mechanically and electrically connect to an external electronic component.

2. The composite interconnect assembly of claim 1, wherein the body is generally planar.

3. The composite interconnect assembly of claim 2, wherein the body structure has a thickness of less than approximately 1.5 mm.

4. The composite interconnect assembly of claim 1, wherein the body structure is generally tubular.

5. The composite interconnect assembly of claim 1, wherein the composite material is a carbon graphite material.

6. The composite interconnect assembly of claim 1, wherein the conductive trace comprises copper.

7. The composite interconnect assembly of claim 1, wherein the contact region is an opening in the body structure extending to the conductive trace.

8. The composite interconnect assembly of claim 1, wherein the contact region is a bond pad substantially flush with the body structure.

9. The composite interconnect assembly of claim 1, wherein the contact region is a through-hole structure.

10. The composite interconnect assembly of claim 1, further comprising a plurality of conductive traces configured within multiple levels.

11. The composite interconnect assembly of claim 1, wherein the body structure comprises at least two layers.

12. A method of making a composite interconnect assembly, comprising:

forming a body structure comprising a composite material;

embedding a conductive trace within the body structure;

defining a contact region on the body structure such that the conductive trace is exposed and is configured to mechanically and electrically connect to an external electronic component.

13. The method of claim 12, including forming the body generally planar.

14. The method of claim 12, including forming the body structure such that it has a thickness of less than approximately 1.5 mm.

15. The method of claim 12, including forming the body structure generally tubular.

16. The method of claim 12, wherein the composite material is a carbon graphite material.

17. The method of claim 12, wherein the conductive trace comprises copper.

18. The method of claim 12, wherein the contact region is an opening in the body structure extending to the conductive trace.

19. The method of claim 12, further including forming a plurality of conductive traces within multiple levels of the body structure.

20. A composite interconnect assembly comprising:

a body structure comprising a composite material having a plurality of levels;

a plurality of conductive traces embedded within the plurality of levels;

a plurality of contact regions defined on a surface of the body structure such that at least a portion of the plurality of conductive traces are exposed and are configured to mechanically and electrically connect to an external electronic component.