DETECTOR AND INSPECTING APPARATUS

• US 20110024623A1
• Filed: 10/06/2010
• Published: 02/03/2011
• Est. Priority Date: 08/12/2005
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: HATAKEYAMA, Masahiro, SUEMATSU, Kenichi, YOSHIKAWA, Shoji, KARIMATA, Tsutomu, NOJI, Nobuharu
• Granted Patent: US 8,431,892 B2
• Time in Patent Office: Days
• US Class Current: 250/310
• CPC Class Codes: H01J 2237/2441 Semiconductor detectors, e.g. diodes
• CPC Class Codes: H01J 2237/2446 Position sensitive detectors
• CPC Class Codes: H01J 37/244 Detectors; Associated components or circuits therefor
• CPC Class Codes: H01J 37/261 Details
• CPC Class Codes: H01J 37/28 with scanning beams H01J37/268, H01J37/292, H01J37/2955 take precedence

Abstract

An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12 for receiving an electron beam emitted from a sample W to capture image data representative of the sample W, and a switching mechanism M for causing the electron beam to be incident on one of the plurality of detectors 11, 12, where the plurality of detectors 11, 12 are disposed in the same chamber MC. The plurality of detectors 11, 12 can be an arbitrary combination of a detector comprising an electron sensor for converting an electron beam into an electric signal with a detector comprising an optical sensor for converting an electron beam into light and converting the light into an electric signal. The switching mechanism M may be a mechanical moving mechanism or an electron beam deflector.

Claims

1. An inspecting apparatus comprising:

a plurality of detectors each for receiving an electron beam emitted from a sample to acquire image data representative of the sample; and

a switching mechanism for causing the electron beam to be incident on one of said plurality of detectors;

wherein said plurality of detectors are disposed within the same vacuum chamber, and wherein said switching mechanism comprises at least one of;

a moving mechanism having a translationally moving mechanism for mechanically moving one of said plurality of detectors; and

a deflector for selectively switching a traveling direction of the electron beam to one of said plurality of detectors and to another of said plurality of detectors.

3. An inspecting apparatus as claimed in claim 1 or 2, wherein said one of said plurality of detectors comprises an EB-CCD.

4. An inspecting apparatus as claimed in claim 3, wherein said EB-CCD is operable to obtain 20-10000 electrons per pixel,

5. An inspecting apparatus as claimed in claim 1 or 2, wherein said another one of said plurality of detectors comprises any one of an EB-TDI and a TDI.

6. An inspecting apparatus as claimed in claim 5, wherein said TDI is operable to obtain 10-1000 electrons per pixel.

7. An inspecting apparatus as claimed in claim 1 or 2, wherein said one of said plurality of detectors comprises an EB-CCD and said another one of said plurality of detectors comprises any one of an EB-TDI and a TDI.

8. An inspecting apparatus as claimed in claim 7, wherein said EB-CCD is operable to obtain 20-10000 electrons per pixel and said TDI is operable to obtain 10-1000 electrons per pixel.

9. An inspecting apparatus as claimed in claim 1 or 2, wherein said moving mechanism comprises an actuator.

10. An inspecting apparatus as claimed in claim 1 or 2, wherein said electron comprises any one of a secondary electron, a reflected electron, a back-scattered electron and an Auger electron.

11. An inspecting apparatus as claimed in claim 1 or 2, wherein said electron comprises a photoelectron.

12. An inspecting apparatus as claimed in claim 1 or 2, further comprising a mapping optical system having a tablet lens which is dual telecentric.

13. An inspecting apparatus as claimed in claim 12, wherein said mapping optical system further comprises an ExB.

14. An inspecting apparatus as claimed in claim 1 or 2, wherein electrons emitted from the sample reach said plurality of detectors at least through a first lens, a first aperture, a second lens, a third lens, a second aperture and a fourth lens.

15. An inspecting apparatus as claimed in claim 1 or 2, further comprising an electric field adjusting lens.

16. An inspecting apparatus as claimed in claim 1 or 2, further comprising an electron source for irradiating electrons to the sample.

17. An inspecting apparatus as claimed in claim 1 or 2, wherein a beam of said electrons has a rectangular or elliptic cross-section.

18. An inspecting apparatus as claimed in claim 1 or 2, further comprising an electromagnetic wave source for irradiating an electromagnetic wave to the sample.

19. An inspecting apparatus as claimed in claim 18, wherein the electromagnetic wave comprises any one of a UV ray, a DUV ray, an X ray and a laser beam.

20. An inspecting apparatus as claimed in claim 1 or 2, further comprising an electron source for irradiating electrons to the sample and an electromagnetic wave source for irradiating an electromagnetic wave to the sample.

21. An inspecting apparatus as claimed in claim 20, wherein the electromagnetic wave comprises any one of a UV ray, a DUV ray, an X ray and a laser beam.

22. An inspecting apparatus as claimed in claim 1 or 2, wherein the sample comprises any one of a wafer and a exposure mask.

23. An inspecting apparatus as claimed in claim 1 or 2, wherein said inspecting apparatus is used for a foreign material inspection.

24. An inspecting apparatus as claimed in claim 1 or 2, wherein said inspecting apparatus is used for defect inspection of a surface of the sample using a scattered beam from the sample.

25. An inspecting apparatus as claimed in claim 1 or 2, wherein said inspecting apparatus is used for pattern defect inspection.

26. An inspecting apparatus as claimed in claim 1 or 2, wherein said one of said plurality of detectors comprises any one of CCDs and EB-CCDs for conducting step-and-repeat inspection.

27. An inspecting apparatus as claimed in claim 1 or 2, wherein inspection is conducted on a cell by cell basis or a die by die basis.

28. An inspecting apparatus as claimed in claim 1 or 2, wherein inspection is conducted to detect misalignment in position of marks on upper and lower layers.

2. An inspecting apparatus comprising:

a plurality of detectors each for receiving an electron beam emitted from a sample to acquire image data representative of the sample; and

a switching mechanism for causing the electron beam to be incident on one of said plurality of detectors;

wherein said plurality of detectors are disposed within the same vacuum chamber, and wherein said switching mechanism comprises at least one of;

a moving mechanism having a rotationally moving mechanism for mechanically moving one of said plurality of detectors; and

a deflector for selectively switching a traveling direction of the electron beam to one of said plurality of detectors and to another of said plurality of detectors.