HIGH PERFORMANCE PROBE SYSTEM

• US 20110025361A1
• Filed: 07/27/2010
• Published: 02/03/2011
• Est. Priority Date: 05/08/2002
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Miller, Charles A.
• Granted Patent: US 8,614,590 B2
• Time in Patent Office: Days
• US Class Current: 324/756.05
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC'"'"'s I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC'"'"'s pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC'"'"'s pads.

Claims

1. An apparatus for providing signal paths between

an integrated circuit (IC) tester and a plurality of IC pads on a surface of an IC to be tested through which the IC can communicate with external circuits via signals, the apparatus comprising:

a substantially flexible substrate;

a first signal path formed on the flexible substrate and conductively linked to a first point on the flexible substrate;

means for providing a conductive link between the

first signal path and the IC tester;

a conductive first probe for contacting the first point on the flexible substrate and for contacting a first IC pad of the plurality of IC pads;

a rigid substrate;

a first structural member linking a second point on the flexible substrate proximate to the first point so as to substantially inhibit freedom of movement of the first point relative to the rigid substrate.

2-71. -71. (canceled)