POLYOL COMPOUND FOR PHOTORESIST
First Claim
1. A polyol compound for photoresists, comprising at least one aliphatic group and at least one aromatic group bound to each other alternately, the aromatic group having at least one aromatic ring and two or more hydroxyl groups bound to the aromatic ring.
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Abstract
A polyol compound for photoresists has at least one aliphatic group and at least one aromatic group bound to each other alternately, in which the aromatic group has at least one aromatic ring and two or more hydroxyl groups bound to the aromatic ring. The polyol compound for photoresists can be prepared through an acid-catalyzed reaction, such as a Friedel-Crafts reaction, between an aliphatic polyol and an aromatic polyol. The aliphatic polyol is preferably an alicyclic polyol. The aromatic polyol is preferably hydroquinone.
By protecting phenolic hydroxyl group(s) thereof with a protecting group capable of leaving with an acid, the polyol compound for photoresists gives a compound for photoresists. A photoresist composition containing this compound can form a resist pattern which shows less line edge roughness (LER), excels in resolution and etching resistance, and is fine and sharp.
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Citations
17 Claims
- 1. A polyol compound for photoresists, comprising at least one aliphatic group and at least one aromatic group bound to each other alternately, the aromatic group having at least one aromatic ring and two or more hydroxyl groups bound to the aromatic ring.
- 14. A process for the production of a polyol compound for photoresists, the process comprising the step of carrying out an acid-catalyzed reaction between an aliphatic polyol and an aromatic polyol to give a polyol compound containing at least one aliphatic group and at least one aromatic group bound to each other alternately, the aromatic group having at least one aromatic ring and two or more hydroxyl groups bound to the aromatic ring.
Specification