DEPOSITION OF RUTHENIUM OR RUTHENIUM DIOXIDE
First Claim
1. A method of depositing a ruthenium layer over a substrate, the method comprising:
- supplying triruthenium dodecacarbonyl over a surface of a substrate to form a seed layer over the surface of the substrate; and
conducting deposition over the seed layer, wherein the deposition comprises;
supplying ruthenium tetraoxide over the seed layer.
2 Assignments
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Accused Products
Abstract
Methods of forming ruthenium or ruthenium dioxide are provided. The methods may include using ruthenium tetraoxide (RuO4) as a ruthenium precursor. In some embodiments for forming ruthenium, methods include forming a seed layer, and forming a ruthenium layer on the seed layer, using RuO4. In other embodiments, methods include performing atomic layer deposition cycles, which include using RuO4 and another ruthenium-containing co-precursor. In yet other embodiments, methods include adsorbing a reducing agent over a substrate, and supplying RuO4 to be reduced to ruthenium by the adsorbed reducing agent. In other embodiments for forming ruthenium dioxide, methods may include providing an initial seed layer formed of, for example, an organic compound, and supplying RuO4 over the seed layer.
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Citations
33 Claims
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1. A method of depositing a ruthenium layer over a substrate, the method comprising:
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supplying triruthenium dodecacarbonyl over a surface of a substrate to form a seed layer over the surface of the substrate; and conducting deposition over the seed layer, wherein the deposition comprises;
supplying ruthenium tetraoxide over the seed layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for forming a ruthenium thin film on a substrate, the method comprising:
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loading a substrate into a reactor; and conducting a plurality of deposition cycles on the substrate, at least one of the cycles comprising; supplying triruthenium dodecacarbonyl to the reactor during a first time period; and supplying ruthenium tetraoxide to the reactor during a second time period between the first time period and an immediately subsequent deposition cycle. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for forming a ruthenium thin film on a substrate, the method comprising:
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loading a substrate including a surface into a reactor; supplying a reducing agent to the reactor during a first time period such that at least a portion of the reducing agent is adsorbed on the surface of the substrate; supplying ruthenium tetraoxide to the reactor during a second time period after the first time period; and supplying a reducing agent to the reactor during a third time period after the second time period. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for forming a ruthenium dioxide thin film on a substrate, the method comprising:
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loading a substrate including a surface into a reactor; supplying an organic compound to the reactor during a first time period such that a layer of the organic compound is formed on the surface of the substrate; and supplying ruthenium tetraoxide to the reactor during a second time period after the first time period. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33)
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Specification