Methods for Low Cost Manufacturing of Complex Layered Materials and Device
First Claim
1. A process for manufacturing a device, comprising:
- performing at least one web-based manufacturing stage and at least one sheet-based manufacturing stage,wherein a plurality of non-bonding processes are performed(a) within at least one or across more than one web-based manufacturing stage; and
(b) within at least one or across more than one sheet-based manufacturing stage.
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Accused Products
Abstract
A process for manufacturing a device includes performing a plurality of non-bonding processes during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. The processes may be performed by a plurality of modules. The modules may be independently controlled and/or monitored. The modules may be interchangeable. One or more modules may receive and/or pass material to another module. The devices that are manufactured may be a layered device, a smart card, a sensor, an actuator, an in vitro diagnostic device, a microfluidic device, or a laminar product. An apparatus for manufacturing device includes at least one web-based manufacturing component and at least one sheet-based manufacturing component. The at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.
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Citations
96 Claims
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1. A process for manufacturing a device, comprising:
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performing at least one web-based manufacturing stage and at least one sheet-based manufacturing stage, wherein a plurality of non-bonding processes are performed (a) within at least one or across more than one web-based manufacturing stage; and (b) within at least one or across more than one sheet-based manufacturing stage. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 63, 88)
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60. A process for manufacturing a multi-layer device comprising at least one web-based manufacturing stage and at least one sheet-based manufacturing stage, wherein one or more processes are performed on one or more web-based stages provided that such processes are not graphical printing nor cutting the device for final part separation.
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61. A process for manufacturing a microfluidic device, comprising:
performing at least one non-bonding and non-final separating process during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. - View Dependent Claims (62)
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64. An apparatus for manufacturing devices, comprising:
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at least one web-based manufacturing component; and at least one sheet-based manufacturing component, wherein the at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes. - View Dependent Claims (65, 66)
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67. An apparatus for manufacturing a microfluidic device, comprising:
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at least one web-based manufacturing component; and at least one sheet-based manufacturing component, wherein the at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes. - View Dependent Claims (68, 69)
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70. A web-based manufacturing module for manufacturing a device, comprising
a reel configured to transfer a web; -
a reel-to-reel operative means for performing a manufacturing process on the web in relation to an aspect of the device; and an interaction means for enabling interaction of the web with at least one sheet processing module.
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71. A sheet processing module for manufacturing a device, comprising:
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a sheet operative means for perform a manufacturing process on a sheet in relation to an aspect of the device; and an interaction means for enabling interaction of the sheet with at least one reel-to-reel processing module.
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- 72. A process for manufacturing a multi-layered device wherein embossing is combined with at least one other process to replicate structure.
- 76. A process for manufacturing a multi-layered device comprising optical alignment of components.
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80. A process for manufacturing a multi-layered device comprising incorporating at least one conductive element into the device and wherein the conductive element is incorporated by stamping.
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81. A process for manufacturing a multi-layered device comprising incorporating at least one conductive element into the device and wherein multi-layered circuits are formed on multiple layers of non-conductive material bonded together.
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82. A process for forming an interconnect and/or a via between conductive elements on a device, comprising stamping a part of a conductive material through a non-conductive layer.
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83. A process for forming an interconnect and/or via between conductive elements on a device comprising forming a first conductive layer on a substrate, adding one or more non-conductive materials onto the first conductive layer, selectively removing the non-conductive material, and forming a second conductive layer onto the non-conductive material at least partially overlapping the area of selectively removed non-conductive material.
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84. A process for manufacturing a smart card comprising positioning electrodes so as to at least partially overlay a smart card carrier module.
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85. A process for manufacturing a microfluidic device, comprising:
directing components of the device according to their identity. - View Dependent Claims (86, 87)
- 89. A multilayered device comprising at least one stress-relieving structure to decrease substrate stress.
- 94. A multi-layered or multi-component device wherein the device comprises at least one folded element and where features are aligned on either side of at least one fold.
Specification