Methods for Low Cost Manufacturing of Complex Layered Materials and Device

• US 20110028293A1
• Filed: 01/24/2007
• Published: 02/03/2011
• Est. Priority Date: 01/24/2006
• Status: Active Grant

• Current Assignee: MycroLab Diagnostics Pty Ltd.
• Original Assignee: Mycrolab Pty., Ltd.
• Inventors: Atkin, Micah James, Eaton, Gregory Francis
• Granted Patent: US 8,220,704 B2
• Time in Patent Office: Days
• US Class Current: 493/374
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B32B 2038/1891 Using a robot for handling the layers
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2310/14 Corona, ionisation, electrical discharge, plasma treatment
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 38/00 Ancillary operations in connection with laminating processes
• CPC Class Codes: B32B 38/0008 Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation heat treatment B32B38/0036
• CPC Class Codes: B32B 38/162 Cleaning
• CPC Class Codes: B32B 39/00 Layout of apparatus or plants, e.g. modular laminating systems
• CPC Class Codes: B32B 41/00 Arrangements for controlling or monitoring lamination processes; Safety arrangements
• CPC Class Codes: G06F 17/00 Digital computing or data processing equipment or methods, specially adapted for specific functions information retrieval, database structures or file system structures therefor G06F16/00

Abstract

A process for manufacturing a device includes performing a plurality of non-bonding processes during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage. The processes may be performed by a plurality of modules. The modules may be independently controlled and/or monitored. The modules may be interchangeable. One or more modules may receive and/or pass material to another module. The devices that are manufactured may be a layered device, a smart card, a sensor, an actuator, an in vitro diagnostic device, a microfluidic device, or a laminar product. An apparatus for manufacturing device includes at least one web-based manufacturing component and at least one sheet-based manufacturing component. The at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.

Claims

1. A process for manufacturing a device, comprising:

performing at least one web-based manufacturing stage and at least one sheet-based manufacturing stage,

wherein a plurality of non-bonding processes are performed

(a) within at least one or across more than one web-based manufacturing stage; and

(b) within at least one or across more than one sheet-based manufacturing stage.

2. A process according to claim 1, wherein the processes are performed by a plurality of modules.

3. A process according to claim 2, further comprising controlling each module independently.

4. A process according to claim 2, further comprising:

choosing a module from the plurality of modules depending on a production history and a characteristic of the device being manufactured.

5. A process according to claim 2, wherein the plurality of modules are interchangeable.

6. A process according to claim 2, wherein one or more modules are configured to receive and/or pass materials to another module.

7. A process according to claim 1, wherein the device comprises one or more of a layered device;

a smart card;

a sensor;

an actuator;

an in vitro diagnostic device;

a laminar device;

or a microfluidic device.

8. A process according to claim 2, further comprising:

controlling at least one module with a control system.

9. A process according to claim 1, further comprising:

subjecting at least some of the processes to a distributed control system and/or a distributed monitoring system.

10. A process according to claim 1, further comprising:

assembling and/or storing the device on a manufacturing line.

11. A process according to claim 1, further comprising:

directing components of the device according to their identity.

12. A process according to claim 11, further comprising:

attaching a code to the components, wherein the code provides the identity of the components.

13. A process according to claim 11, wherein directing components comprises adding components to other components and/or removing components from other components depending on their identity.

14. A process according to claim 2, wherein at least one module is configured to perform a web-based process and at least one other module is configured to perform a sheet-based process.

15. A process according to claim 1, wherein the device comprises:

a plurality of materials, including polymers, wood, paper, silicon, ceramics, and/or metals; and

/or

a plurality of shapes and/or thicknesses of the materials; and

/or

pre-formed components.

16. A process according to claim 2, wherein the device, or a component thereof, passes at least one module a plurality of times.

17. A process according to claim 2, wherein the device, or a component thereof, may travel in a plurality of directions along a manufacturing line formed by the modules.

18. A process according to claim 1, further comprising:

buffering buffer stock at least one buffering station.

19. A process according to claim 18, further comprising:

inputting buffer stock to a process from the buffering station.

20. A process according to claim 18, further comprising:

outputting buffer stock from a process to the buffering station.

21. A process according to claim 1, further comprising:

providing a plurality of production arms.

22. A process according to claim 21, wherein at least one production arm comprises a plurality of processes.

23. A process according to claim 1, wherein the device is a diagnostic device.

24. A process according to claim 23, wherein the diagnostic device is a microfluidic device.

25. A process according to claim 1, wherein the device comprises a folded device and optionally a folded microfluidic device.

26. A process according to claim 1, further comprising:

using the at least one web-based process and the at least one sheet process at different stages of the manufacture depending on characteristics of the process required at each stage.

27. A process according to claim 1, wherein one of the non-bonding processes comprises machining a pattern on a plurality of layers.

28. A process according to claim 27, further comprising using one or more sacrificial layers for the machining.

29. A process according to claim 28, wherein the machining is double sided.

30. A process according to claim 1, wherein embossing is combined with at least one other process to replicate structure.

31. A process according to claim 30, wherein the at least one other process comprises using cut-outs.

32. A process according to claim 30, wherein the at least one other process comprises using undercuts.

33. A process according to claim 30, wherein the at least one other process comprises laser processing.

34. A process according to claim 1, wherein one of the non-bonding processes comprising optical aligning.

35. A process according to claim 34, wherein the optical aligning comprises using diffractive optics.

36. A process according to claim 34, wherein the optical aligning comprises using interference patterns

37. A process according to claim 36, wherein the interference patterns are moire patterns.

38. A process according to claim 1, wherein one of the non-bonding processes comprises incorporating at least one conductive element into the device.

39. A process according to claim 38, wherein the conductive element conducts heat and/or electricity.

40. A process according to claim 38, wherein the device comprises a smart card and one of the non-bonding processes comprises positioning electrodes so as to at least partially overlay a smart card carrier module.

41. A process according to claim 38, wherein the conductive element is incorporated by hot foil stamping.

42. A process according to claim 38, wherein the conductive element is incorporated by interdiffusion.

43. A process according to claim 38, wherein the conductive element is incorporated by printing.

44. A process according to claim 38, wherein the conductive element is incorporated by stamping.

45. A process according to claim 38, wherein multi-layered circuits are formed on multiple layers of non-conductive material bonded together.

46. A process according to any one of the preceding claims, further comprising a process for forming an interconnect and/or a via, comprising stamping a part of a conductive material through a non-conductive layer.

47. A process according to any one of the preceding claims, further comprising a process for forming an interconnect and/or via comprising forming a first conductive layer on a substrate, adding one or more non-conductive materials onto the first conductive layer, selectively removing the non-conductive material, and forming a second conductive layer onto the non-conductive material at least partially overlapping the area of selectively removed non-conductive material.

48. A process according to claim 1, wherein one of the non-bonding processes comprises incorporating at least one waveguide into the device.

49. A process according to claim 48, wherein the waveguide is incorporated by surface coating.

50. A process according to claim 48, wherein the waveguide is incorporated by filling at least one preformed structure.

51. A process according to claim 48, wherein the waveguide is incorporated by inserting at least one preformed component.

52. A process according to claim 1, further comprising a bonding process.

53. A process according to claim 52, wherein the bonding process comprises using at least one structural layer to reduce structure deformation.

54. A process according to claim 52, wherein the bonding process comprises mechanical interlocking.

55. A process according to claim 52, wherein the bonding process comprises modifying a surface of a web or sheet.

56. A process according to any one of the preceding claims comprising multi-layer laminating.

57. A process according to any one of the preceding claims, wherein material from the one or more web-based processes is joined to the same side of the same part, component or of the device.

58. A process according to any one of the preceding claims comprising multi-layer laminating.

59. A process according to any one of the preceding claims, wherein material from the one or more web-based processes is joined to the same side of the same part, component, or device.

63. A process according to claim 61 or 62, further comprising any one or more of the elements claimed in claims 2 to 60.

88. A device manufactured according to a process or using an apparatus as claimed in any one of the preceding claims.

60. A process for manufacturing a multi-layer device comprising at least one web-based manufacturing stage and at least one sheet-based manufacturing stage, wherein one or more processes are performed on one or more web-based stages provided that such processes are not graphical printing nor cutting the device for final part separation.

61. A process for manufacturing a microfluidic device, comprising:

performing at least one non-bonding and non-final separating process during at least one web-based manufacturing stage and during at least one sheet-based manufacturing stage.

62. A process according to claim 61, wherein the at least one non-bonding and non-final separating process is performed by a module.

64. An apparatus for manufacturing devices, comprising:

at least one web-based manufacturing component; and

at least one sheet-based manufacturing component, wherein the at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.

65. An apparatus according to claim 64, wherein the device comprises one of a layered device;

a smart card;

a sensor;

an actuator;

an in vitro diagnostic device; and

/or a microfluidic device.

66. An apparatus according to claim 65, wherein the device is a laminar product.

67. An apparatus for manufacturing a microfluidic device, comprising:

at least one web-based manufacturing component; and

at least one sheet-based manufacturing component, wherein the at least one web-based manufacturing component and the at least one sheet-based manufacturing component are configured to perform a plurality of non-bonding processes.

68. An apparatus according to claim 67, wherein the at least one web-based component and the at least one sheet-based component comprise modules.

69. An apparatus according to claim 67, wherein the device is a folded microfluidic device.

70. A web-based manufacturing module for manufacturing a device, comprising

a reel configured to transfer a web;

a reel-to-reel operative means for performing a manufacturing process on the web in relation to an aspect of the device; and

an interaction means for enabling interaction of the web with at least one sheet processing module.

71. A sheet processing module for manufacturing a device, comprising:

a sheet operative means for perform a manufacturing process on a sheet in relation to an aspect of the device; and

an interaction means for enabling interaction of the sheet with at least one reel-to-reel processing module.

72. A process for manufacturing a multi-layered device wherein embossing is combined with at least one other process to replicate structure.

73. A process according to claim 72, wherein the at least one other process comprises using cut-outs.

74. A process according to claim 72, wherein the at least one other process comprises using undercuts.

75. A process according to claim 72, wherein the at least one other process comprises laser processing.

76. A process for manufacturing a multi-layered device comprising optical alignment of components.

77. A process according to claim 76, wherein the optical aligning comprises using diffractive optics.

78. A process according to claim 76, wherein the optical aligning comprises using interference patterns

79. A process according to claim 78, wherein the interference patterns are moire patterns.

80. A process for manufacturing a multi-layered device comprising incorporating at least one conductive element into the device and wherein the conductive element is incorporated by stamping.

81. A process for manufacturing a multi-layered device comprising incorporating at least one conductive element into the device and wherein multi-layered circuits are formed on multiple layers of non-conductive material bonded together.

82. A process for forming an interconnect and/or a via between conductive elements on a device, comprising stamping a part of a conductive material through a non-conductive layer.

83. A process for forming an interconnect and/or via between conductive elements on a device comprising forming a first conductive layer on a substrate, adding one or more non-conductive materials onto the first conductive layer, selectively removing the non-conductive material, and forming a second conductive layer onto the non-conductive material at least partially overlapping the area of selectively removed non-conductive material.

84. A process for manufacturing a smart card comprising positioning electrodes so as to at least partially overlay a smart card carrier module.

85. A process for manufacturing a microfluidic device, comprising:

directing components of the device according to their identity.

86. A process according to claim 85, further comprising:

attaching a code to the components, wherein the code provides the identity of the components.

87. A process according to claim 85, wherein directing components comprises adding components to other components and/or removing components from other components depending on their identity.

89. A multilayered device comprising at least one stress-relieving structure to decrease substrate stress.

90. A device according to claim 89 wherein the structure relieves stress in a plurality of adjacent devices.

91. A device according to claim 89 wherein the structure relieves stress within the device.

92. A device according to any one of claims 89 to 91 wherein the structure relieves stress during manufacture, transport or use.

93. A device according to any one of claims 89 to 92 wherein the device is a microfluidic device.

94. A multi-layered or multi-component device wherein the device comprises at least one folded element and where features are aligned on either side of at least one fold.

95. A device according to claim 94 wherein the device is a microfluidic device.

96. A device according to claim 94 wherein the device comprises an electronic circuit.