WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME

• US 20110031513A1
• Filed: 07/13/2010
• Published: 02/10/2011
• Est. Priority Date: 08/04/2009
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: CHEN, LUNG-HSIN, LIN, CHIH-YUNG, HSIEH, MIN-TSUN, LIN, SHEN-BO, YEH, CHING-LIEN
• Application Number:
  US12/835,727
• Publication Number:
  US 20110031513A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided.

Claims

1. A waterproof surface-mount device (SMD) light emitting diode (LED) module, comprising:

a leadframe, comprising a plurality of leads;

at least one LED chip fixed on one of the leads;

a waterproof protective film covering the LED chip and a portion of the leadframe and exposing portions of the leads for electrically connecting to an external device; and

a sealing material formed on the leadframe to cover the LED chip.

2. The SMD LED module of claim 1, wherein the leadframe comprises a carrier supporting the LED chip, and the waterproof protective film covers the carrier and a boundary between the carrier and the leads.

3. The SMD LED module of claim 2, wherein the leadframe further comprises a reflective cup surrounding the LED chip, and the waterproof protective film covers the reflective cup and a boundary between the reflective cup and the leads.

4. The SMD LED module of claim 1, wherein the waterproof protective film is located between the sealing material and the LED chip.

5. The SMD LED module of claim 1, wherein the sealing material is located between the waterproof protective film and the LED chip.

6. The SMD LED module of claim 1, wherein the sealing material comprises a phosphor.

7. The SMD LED module of claim 1, wherein the waterproof protective film covers a top surface of the leadframe on which the LED chip is located.

8. The SMD LED module of claim 7, wherein the waterproof protective film covers a bottom surface of the leadframe opposite to the top surface.

9. The SMD LED module of claim 1, wherein a thickness of the waterproof protective film is in a range from about 1 micrometer to about 20 micrometers.

10. The SMD LED module of claim 1, wherein the waterproof protective film is selected from a group consisting of poly-para-xylylene (parylene), polyimide (PI), semi-crystalline parylene-based, metal nitride, aluminum oxide (Al₂O₃), polymethylmethactylate (PMMA), a compound of PI and Al₂O₃, and diamond-like carbon (DLC).

11. A waterproof LED module, comprising:

a substrate;

a plurality of LED components disposing on the substrate; and

a waterproof protective film overlaying on the substrate and the plurality of LED components.

12. The waterproof LED module of claim 11, wherein a thickness of the waterproof protective film is in a range from about 1 micrometers to about 20 micrometers

13. The waterproof LED module of claim 11, wherein the waterproof protective film is selected from a group consisting of poly-para-xylylene (parylene), polyimide (PI), semi-crystalline parylene-based, metal nitride, aluminum oxide (Al₂O₃), polymethylmethactylate (PMMA), a compound of PI and Al₂O₃, and diamond-like carbon (DLC).

14. A method of manufacturing a waterproof surface-mount device (SMD) light emitting diode (LED) module, comprising:

providing a leadframe, the leadframe comprising a plurality of leads;

covering a portion of the leadframe with a tape

fixing an LED chip on at least one of the leads;

electrically connecting the leads with the LED chip; and

providing a waterproof protective film enveloping the LED chip.

15. The method of claim 14, further comprising removing the tape to expose the portion of the leadframe after the waterproof protective film is provided enveloping the LED chip.

16. The method of claim 14 further comprising a step of sealing the LED chip with a sealing material after the waterproof protective film is provided enveloping the LED chip.

17. The method of claim 14 further comprising a step of sealing the LED chip with a sealing material before the waterproof protective film is provided enveloping the LED chip.

18. The method of claim 14, wherein the waterproof protective film covers a top surface of the leadframe on which the LED chip is located.

19. The method of claim 17, wherein the waterproof protective film covers a bottom surface of the leadframe opposite to the top surface.

20. The method of claim 14, wherein a thickness of the waterproof protective film is in a range from about 1 micrometer to about 20 micrometers.