LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER
First Claim
1. A method for fabricating a light emitting device comprising:
- providing a plurality of light emitting diode (LED) dies on a submount wafer;
molding a first silicone layer over each LED die on the wafer;
forming a flexible phosphor layer separately from the wafer;
laminating the phosphor layer over the wafer such that the phosphor layer directly contacts and conforms to an outer surface of the first silicone layer, the phosphor layer wavelength-converting light emitted from the LED dies; and
molding a second silicone layer over the phosphor layer.
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Accused Products
Abstract
A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.
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Citations
15 Claims
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1. A method for fabricating a light emitting device comprising:
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providing a plurality of light emitting diode (LED) dies on a submount wafer; molding a first silicone layer over each LED die on the wafer; forming a flexible phosphor layer separately from the wafer; laminating the phosphor layer over the wafer such that the phosphor layer directly contacts and conforms to an outer surface of the first silicone layer, the phosphor layer wavelength-converting light emitted from the LED dies; and molding a second silicone layer over the phosphor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A light emitting device comprising:
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a light emitting diode (LED) die mounted on a submount; a first silicone layer coating the LED die, wherein the first silicone layer has a substantially hemispherical shape over the LED die; a phosphor layer laminated over the first silicone layer to conform to an outer surface of the first silicone layer, the phosphor layer extending beyond the LED die over the submount, the phosphor layer comprising phosphor powder infused in silicone; and a second silicone layer molded over the phosphor layer. - View Dependent Claims (14, 15)
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Specification