×

MICROMACHINED DEVICES AND FABRICATING THE SAME

  • US 20110031565A1
  • Filed: 08/03/2010
  • Published: 02/10/2011
  • Est. Priority Date: 08/04/2009
  • Status: Active Grant
First Claim
Patent Images

1. A method for fabricating a device, comprising:

  • providing a first wafer having at least one via;

    bonding a second wafer having a substantially uniform thickness to the first wafer; and

    etching the bonded second wafer to form a micro-electromechanical-systems (MEMS) layer.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×