DISPLAY APPARATUS

• US 20110032209A1
• Filed: 05/28/2010
• Published: 02/10/2011
• Est. Priority Date: 08/06/2009
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: KIM, Eun-Ah
• Granted Patent: US 8,743,078 B2
• Time in Patent Office: Days
• US Class Current: 345/174
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H10K 50/865 comprising light absorbing layers, e.g. light-blocking layers
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 59/8792 comprising light absorbing layers, e.g. black layers

Abstract

A display apparatus having an improved optical efficiency and a touch panel function, the display apparatus including a substrate; a display unit formed on the substrate and including a plurality of pixels; an encapsulation substrate disposed facing the display unit to encapsulate the display unit; an electrostatic capacitive pattern layer formed on the encapsulation substrate; and a black matrix layer formed between the substrate and the encapsulation substrate, and disposed to surround the plurality of pixels, wherein the plurality of pixels are disposed to correspond to the electrostatic capacitive pattern layer.

Claims

1. A display apparatus comprising:

a substrate;

a display unit formed on the substrate and including a plurality of pixels;

an encapsulation substrate disposed facing the display unit to encapsulate the display unit;

an electrostatic capacitive pattern layer formed on the encapsulation substrate; and

a black matrix layer formed between the substrate and the encapsulation substrate, and disposed to surround the plurality of pixels,

wherein the plurality of pixels are disposed to correspond to the electrostatic capacitive pattern layer.

2. The display apparatus of claim 1, wherein the electrostatic capacitive pattern layer comprises a plurality of patterns, and

wherein the black matrix layer comprises:

a first black matrix layer disposed in a space between the plurality of patterns of the electrostatic capacitive pattern layer; and

a second black matrix layer formed on the electrostatic capacitive pattern layer.

3. The display apparatus of claim 1, wherein the electrostatic capacitive pattern layer is formed on a surface of the encapsulation substrate facing the display unit.

4. The display apparatus of claim 1, wherein the electrostatic capacitive pattern layer comprises:

a first pattern layer; and

a second pattern layer that is electrically insulated from the first pattern layer.

5. The display apparatus of claim 4, wherein the first pattern layer extends in a direction, and the second pattern layer extends in another direction that is substantially perpendicular to the direction of the first pattern layer.

6. The display apparatus of claim 4, wherein the first pattern layer comprises a plurality of first pad units and a plurality of first connection units connecting adjacent ones of the plurality of first pad units to each other, and the second pattern layer comprises a plurality of second pad units and a plurality of second connection units connecting adjacent ones of the plurality of second pad units to each other.

7. The display apparatus of claim 6, wherein each of the plurality of first pad units and each of the plurality of second pad units have a diamond shape.

8. The display apparatus of claim 6, wherein outlines of the plurality of first pad units and the plurality of second pad units have a stepped shape so as to correspond to outlines of the plurality of pixels.

9. The display apparatus of claim 6, further comprising a first insulating layer formed to cover the first pattern layer and the plurality of second pad units,

wherein the plurality of second connection units connect adjacent ones of the plurality of second pad units via a plurality of contact holes formed in the first insulating layer.

10. The display apparatus of claim 9, further comprising a second insulating layer formed on the first insulating layer so as to cover the plurality of second connection units.

11. The display apparatus of claim 1, wherein the electrostatic capacitive pattern layer comprises a transmissive conductive layer.

12. The display apparatus of claim 1, wherein the electrostatic capacitive pattern layer comprises one of the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium oxide (IO), Ga-doped oxide (GZO), zinc oxide (ZnO), Al-doped oxide (AZO), fluorine doped tin oxide (FTO), antimony doped tin oxide (ATO) and In₂O₃.

13. The display apparatus of claim 1, wherein each of the plurality of pixels comprises a plurality of sub-pixels.

14. The display apparatus of claim 1, wherein the display unit comprises an organic light emitting device.

15. A method of adding an electrostatic capacitive-type touch panel function in a display apparatus including a substrate, a display unit, and an encapsulation substrate, the method comprising:

forming an electrostatic capacitive pattern layer on the encapsulation substrate;

forming a black matrix layer on the electrostatic capacitive layer;

forming an insulating layer on the black matrix layer;

forming the display unit including a plurality of pixels to emit light, the display unit being formed on the substrate; and

disposing the encapsulation substrate on the display unit so that the electrostatic capacitive pattern layer faces the display unit.

16. The method of claim 15, wherein the display unit comprises an organic light emitting device.

17. The method of claim 15, wherein the electrostatic capacitive pattern layer comprises:

a first pattern layer extending in a first direction; and

a second pattern layer extending in a second direction substantially perpendicular to the first pattern layer,

wherein the second pattern layer is electrically insulated from the first pattern layer.

18. The method of claim 17, wherein the first pattern layer comprises a plurality of first pad units and a plurality of first connection units connecting adjacent ones of the plurality of first pad units to each other, and the second pattern layer comprises a plurality of second pad units and a plurality of second connection units connecting adjacent ones of the plurality of second pad units to each other.

19. The method of claim 18, wherein the plurality of first pad units and the plurality of second pad units have a diamond shape.

20. The method of claim 18, wherein outlines of the plurality of first pad units and the plurality of second pad units have a stepped shape so as to correspond to outlines of the plurality of pixels.

21. The method of claim 18, further comprising a first insulating layer formed to cover the first pattern layer and the plurality of second pad units,

wherein the plurality of second connection units connect adjacent ones of the plurality of second pad units via a plurality of contact holes formed in the first insulating layer.

22. The method of claim 21, further comprising a second insulating layer formed on the first insulating layer so as to cover the plurality of second connection units.

23. The method of claim 17, wherein the black matrix layer comprises a first black matrix layer disposed in spaces between the first pattern layer and the second pattern layer.

24. The method of claim 17, wherein the black matrix layer comprises a second black matrix layer disposed on the first pattern layer and the second pattern layer.

25. The method of claim 15, wherein the electrostatic capacitive pattern layer comprises one of the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium oxide (IO), Ga-doped oxide (GZO), zinc oxide (ZnO), Al-doped oxide (AZO), fluorine doped tin oxide (FTO), antimony doped tin oxide (ATO) and In₂O₃.