THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF

• US 20110038124A1
• Filed: 04/18/2009
• Published: 02/17/2011
• Est. Priority Date: 04/21/2008
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Dankers, Lea, Burnham, Kikue S., Weiser, Martin William
• Application Number:
  US12/988,104
• Publication Number:
  US 20110038124A1
• Time in Patent Office: Days
• US Class Current: 361/717
• CPC Class Codes: C08K 3/10 Metal compounds
• CPC Class Codes: C08L 2666/54 Inorganic substances
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: H01L 2224/29109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29305 Gallium [Ga] as principal constituent
• CPC Class Codes: H01L 2224/29309 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/29311 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29324 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29347 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/29393 with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/294 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29439 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29498 with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83801 : Soldering or alloying
• CPC Class Codes: H01L 2224/83851 : being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/3737 : Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/42 : Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/31 : Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01043 : Technetium [Tc]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01054 : Xenon [Xe]
• CPC Class Codes: H01L 2924/01064 : Gadolinium [Gd]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/0134 : Quaternary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/0503 : 13th Group
• CPC Class Codes: H01L 2924/05032 : AlN
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.

Claims

1. A composition comprising:

an epoxy polymeric matrix;

a conductive filler;

a solder material; and

a matrix material modification agent including a viscosity modifying component to reduce the viscosity of the epoxy polymeric matrix;

wherein the composition has a viscosity of 100,000 cps or less at 25°

C.

5. The composition according to claim 1, wherein the conductive filler is at least one selected from the group consisting of tin, bismuth, indium, bismuth-tin alloy, silver metals and indium-tin alloy.

6. The composition according to claim 1, comprising about 60 vol % to about 80 vol % of the conductive filler, based on the volume of the composition.

7. The composition according to claim 1, wherein the solder material is at least one selected from the group consisting of indium-tin alloys, indium-silver alloys, indium-bismuth alloys, tin-indium-bismuth alloys, indium-tin-silver-zinc alloys, indium-based alloys, tin-silver-copper alloys, tin-bismuth alloys, gallium compounds and gallium alloys.

8. The composition according to claim 1, comprising about 20 vol % to about 50 vol % of the solder, based on the volume of the composition.

9. The composition according to claim 1, wherein the matrix material modification agent further includes an end capping agent.

11. The composition of claim 1, wherein the matrix material modification agent is at least one selected from the group consisting of tBPGE and AGE.

12. The composition according to claim 11, wherein the matrix material modification agent is about 0 vol % to about 20 vol % tBPGE and about 0 vol % to about 5 vol % AGE, based on the volume of the composition.

14. A thermally transmissive electronic component comprising:

a first substrate;

a second substrate; and

a cured composition formed from the composition according to claim 1 positioned between the first and second substrates.

2-4. -4. (canceled)

10. (canceled)

13. (canceled)

15-18. -18. (canceled)

19. A method of producing a thermally transmissive electronic component comprising:

forming a curable thermal interface material by mixing an epoxy polymeric matrix, a conductive filler, a solder material and a matrix material modification agent including a viscosity modifying component that reduces the viscosity of the epoxy polymeric matrix, wherein the mixture has a viscosity of 100,000 cps or less at 25°

C.;

positioning the composition between a first and a second substrate;

curing the polymeric matrix; and

applying heat to the matrix sufficient to at least partially melt at least a portion of the solder material such that the solder connects to particles in the filler to form a plurality of continuous heat transmissive pathways between the substrates and through the matrix.

20. The method according to claim 19, wherein the matrix is cured and the solder at least partially melted with heat between about 120°

C. and about 170°

C.