THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
First Claim
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1. A composition comprising:
- an epoxy polymeric matrix;
a conductive filler;
a solder material; and
a matrix material modification agent including a viscosity modifying component to reduce the viscosity of the epoxy polymeric matrix;
wherein the composition has a viscosity of 100,000 cps or less at 25°
C.
1 Assignment
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Abstract
A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.
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Citations
20 Claims
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1. A composition comprising:
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an epoxy polymeric matrix; a conductive filler; a solder material; and a matrix material modification agent including a viscosity modifying component to reduce the viscosity of the epoxy polymeric matrix; wherein the composition has a viscosity of 100,000 cps or less at 25°
C. - View Dependent Claims (5, 6, 7, 8, 9, 11, 12, 14)
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2-4. -4. (canceled)
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10. (canceled)
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13. (canceled)
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15-18. -18. (canceled)
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19. A method of producing a thermally transmissive electronic component comprising:
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forming a curable thermal interface material by mixing an epoxy polymeric matrix, a conductive filler, a solder material and a matrix material modification agent including a viscosity modifying component that reduces the viscosity of the epoxy polymeric matrix, wherein the mixture has a viscosity of 100,000 cps or less at 25°
C.;positioning the composition between a first and a second substrate; curing the polymeric matrix; and applying heat to the matrix sufficient to at least partially melt at least a portion of the solder material such that the solder connects to particles in the filler to form a plurality of continuous heat transmissive pathways between the substrates and through the matrix. - View Dependent Claims (20)
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Specification