METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND AN ADHESIVE BETWEEN THE BASE AND A TERMINAL
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Abstract
A method of making a semiconductor chip assembly includes providing a thermal post, a signal post, a base and a terminal, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer and downward between the base and the terminal, solidifying the adhesive, providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
70 Claims
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1-35. -35. (canceled)
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36. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post, a base, a terminal, an adhesive and a conductive layer, wherein the thermal post is adjacent to the base, extends above the base in an upward direction, extends into a first opening in the adhesive and is aligned with a first aperture in the conductive layer, the signal post is adjacent to the terminal, extends above the terminal in the upward direction, extends into a second opening in the adhesive and is aligned with a second aperture in the conductive layer, the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, the terminal extends below the signal post in the downward direction and extends laterally from the signal post in the lateral directions, the adhesive is mounted on and extends above the base and the terminal, is sandwiched between the base and the conductive layer and between the terminal and the conductive layer and is non-solidified, and the conductive layer is mounted on and extends above the adhesive;
thenflowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer; flowing the adhesive into and downward in a slot between the base and the terminal; solidifying the adhesive; providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer; mounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes the signal post; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method of making a semiconductor chip assembly, comprising:
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providing a metal plate that includes a thermal post, a signal post, a base and a terminal, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the signal post is adjacent to and integral with the terminal and extends above the terminal in the upward direction, the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, the terminal extends below the signal post in the downward direction and extends laterally from the signal post in the lateral directions and a slot extends through the metal plate between the base and the terminal, thereby providing edges of the base and the terminal that face towards one another; providing an adhesive, wherein first and second openings extend through the adhesive; providing a conductive layer, wherein first and second apertures extend through the conductive layer; mounting the adhesive on the base and the terminal, including inserting the thermal post into the first opening and the signal post into the second opening, wherein the adhesive extends above the base and the terminal, the thermal post extends into the first opening and the signal post extends into the second opening; mounting the conductive layer on the adhesive, including aligning the thermal post with the first aperture and the signal post with the second aperture, wherein the conductive layer extends above the adhesive and the adhesive is sandwiched between the base and the conductive layer and between the terminal and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the terminal towards the conductive layer, thereby moving the thermal post upward in the first aperture, moving the signal post upward in the second aperture and applying pressure to the molten adhesive between the base and the conductive layer and between the terminal and the conductive layer, wherein the pressure forces the molten adhesive to flow into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, and the pressure forces the molten adhesive to flow into and downward in the slot between the base and the terminal; applying heat to solidify the molten adhesive, thereby mechanically attaching the posts, the base and the terminal to the conductive layer;
thenproviding a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer and an electrically conductive path between the pad and the terminal includes the signal post; removing selected portions of the metal plate, thereby providing additional edges of the base and the terminal;
thenmounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55)
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56. A method of making a semiconductor chip assembly, comprising:
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providing a thermal post, a signal post, a base, a terminal, an adhesive and a substrate, wherein the thermal post is adjacent to the base, extends above the base in an upward direction, extends into a first opening in the adhesive and is aligned with a first aperture in the substrate, the signal post is adjacent to the terminal, extends above the terminal in the upward direction, extends into a second opening in the adhesive and is aligned with a second aperture in the substrate, the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, the terminal extends below the signal post in a downward direction opposite the upward direction and extends laterally from the signal post in the lateral directions, the adhesive is mounted on and extends above the base and the terminal, is sandwiched between the base and the substrate and between the terminal and the substrate and is non-solidified, and the substrate is mounted on and extends above the adhesive, wherein the substrate includes a conductive layer and a dielectric layer and the conductive layer extends above the dielectric layer;
thenflowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the substrate and in a second gap located in the second aperture between the signal post and the substrate; flowing the adhesive into and downward in a slot between the base and the terminal, wherein the slot provides edges of the base and the terminal that face towards one another; solidifying the adhesive;
thenproviding a conductive trace that includes a pad, the terminal and the signal post, wherein the pad extends above the signal post and includes a selected portion of the conductive layer; providing additional edges of the base and the terminal;
thenmounting a semiconductor device on a heat spreader that includes the thermal post and the base, wherein the semiconductor device overlaps the thermal post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal, wherein an electrically conductive path between the pad and the terminal includes the signal post; and thermally connecting the semiconductor device to the thermal post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65)
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66. A method of making a semiconductor chip assembly, comprising:
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providing a metal plate that includes a thermal post, a signal post, a base and a terminal, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, the signal post is adjacent to and integral with the terminal and extends above the terminal in the upward direction, the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions, the terminal extends below the signal post in the downward direction and extends laterally from the signal post in the lateral directions and a slot extends through the metal plate between the base and the terminal, thereby providing edges of the base and the terminal that face towards one another; providing an adhesive, wherein first and second openings extend through the adhesive; providing a substrate that includes a first conductive layer and a dielectric layer, wherein first and second apertures extend through the substrate; mounting the adhesive on the base and the terminal, including inserting the thermal post into the first opening and the signal post into the second opening, wherein the adhesive extends above the base and the terminal, the thermal post extends through the first opening and the signal post extends through the second opening; mounting the substrate on the adhesive, including aligning the thermal post with the first aperture and the signal post with the second aperture, wherein the substrate extends above the adhesive, the first conductive layer extends above the dielectric layer and the adhesive is sandwiched between the base and the substrate and between the terminal and the substrate and is non-solidified;
thenapplying heat to melt the adhesive; moving the base and the terminal towards and the substrate, thereby moving the thermal post upward in the first aperture, moving the signal post upward in the second aperture and applying pressure to the molten adhesive between the base and the substrate and between the base and the terminal, wherein the pressure forces the molten adhesive to flow into and upward in a first gap located in the first aperture between the thermal post and the substrate and in a second gap located in the second aperture between the signal post and the substrate, and the pressure forces the molten adhesive to flow into and downward in the slot between the base and the terminal; applying heat to solidify the molten adhesive, thereby mechanically attaching the posts, the base and the terminal to the substrate;
thendepositing a second conductive layer on the posts, the adhesive and the first conductive layer;
thenproviding a pad that includes a selected portion of the conductive layers, including removing selected portions of the conductive layers, wherein the pad is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the signal post and an electrically conductive path between the pad and the terminal includes the signal post; providing a cap on the thermal post that includes a selected portion of the second conductive layer, including removing selected portions of the second conductive layer, wherein the cap is above and adjacent to and covers in the upward direction and extends laterally in the lateral directions from a top of the thermal post and a thermally conductive path between the cap and the base includes the thermal post; removing selected portions of the metal plate, thereby providing additional edges of the base and the terminal;
thenmounting a semiconductor device on the cap, wherein the semiconductor device overlaps the thermal post and a heat spreader includes the thermal post, the base and the cap; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (67, 68, 69, 70)
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Specification