MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION

• US 20110042124A1
• Filed: 12/03/2008
• Published: 02/24/2011
• Est. Priority Date: 12/05/2007
• Status: Abandoned Application

• Current Assignee: Mitsubishi Plastics Incorporated (Mitsubishi Chemical Group Corp.)
• Original Assignee: Mitsubishi Plastics Incorporated (Mitsubishi Chemical Group Corp.)
• Inventors: Matsui, Jun, Yamada, Shingetsu
• Application Number:
  US12/745,651
• Publication Number:
  US 20110042124A1
• Time in Patent Office: Days
• US Class Current: 174/157
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/4617 characterized by laminating only or mainly similar single-sided circuit boards
• CPC Class Codes: H05K 3/4632 : laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
• CPC Class Codes: H05K 3/4688 : Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602
• CPC Class Codes: H05K 3/4697 : having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

The present invention provides a multilayer wiring substrate comprising: a plurality of wiring substrate laminated each other; and a cavity portion. In the multilayer wiring substrate, a wiring substrate 1 being arranged along the bottom face of the cavity portion and a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1, the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material having a predetermined properties, the wiring substrate 2 being provided with a cavity hole. Thus, it is possible to provide a multilayer wiring substrate having a cavity portion and even a function of reflector.

Claims

1. A multilayer wiring substrate comprising:

a plurality of wiring substrates laminated to each other; and

a cavity portion,

in the multilayer wiring substrate, at least one layer of a wiring substrate 1 being arranged at least along the bottom face of the cavity portion and at least one layer of a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1,

the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material which comprises an inorganic filler thermoplastic resin composition as a main component and which has an average reflectance of 70% or more in a wavelength range of 400-800 nm and a decreasing rate in reflectance of 10% or less in a wavelength range of 470 nm after thermal treatment at 200°

C. for 4 hours,

the wiring substrate 2 being provided with a cavity hole.

3. The multilayer wiring substrate having a cavity portion according to claim 1,

wherein the wiring substrates 1 and 2 are independently either a wiring substrate where a conductive pattern is formed on at least one surface of the insulating base material and an interlayer wiring is formed in the insulating base material to connect electrically in the thickness direction, or another wiring substrate where an interlayer wiring only is formed in the insulating base material to connect electrically in the thickness direction.

6. The multilayer wiring substrate having a cavity portion according to claim 1, wherein the refractive index of the inorganic filler in the thermoplastic resin composition is 1.6 or more.

7. The multilayer wiring substrate having a cavity portion according to claim 6, wherein the inorganic filler is titanium oxide.

8. The multilayer wiring substrate having a cavity portion according to claim 6, wherein the thermoplastic resin composition further comprising an inorganic filler having an average diameter of 15 μ

m or less and an average aspect ratio of 30 or more.

9. The multilayer wiring substrate having a cavity portion according to claim 1, wherein the wiring substrate 2 comprises a plurality of wiring substrates and the plurality of wiring substrates respectively have a cavity hole of different size from each other, and the diameter of the cavity hole is expanded toward the upper layer side.

10. The multilayer wiring substrate having cavity portions according to claim 1, wherein the thermoplastic resin composition is a mixed composition which comprises a polyarylketone resin and an amorphous polyetherimide resin and which has a crystal melting peak temperature of 260°

C. or more.

2. A multilayer wiring substrate comprising:

a plurality of wiring substrates laminated to each other; and

a cavity portion,

in the multilayer wiring substrate, at least one layer of a wiring substrate 1 being arranged at least along the bottom face of the cavity portion and at least one layer of a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1,

the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material which comprises an inorganic filler thermoplastic resin composition as a main component and which has an average reflectance of 70% or more in a wavelength range of 400-800 nm and a decreasing rate in reflectance of 10% or less in a wavelength range of 470 nm after thermal treatment at 200°

C. for 4 hours, and which further comprises an adhesive layer comprising a thermosetting resin composition as a main component and being arranged at least one surface of the insulating base material,

the wiring substrate 2 being provided with a cavity hole.

4. The multilayer wiring substrate having a cavity portion according to claim 4, wherein the interlayer wiring comprises a conductive paste composition.

5. The multilayer wiring substrate having a cavity portion according to claim 4, wherein the conductive paste composition comprises a conductive powder and a binder component, wherein the mass ratio of the conductive powder to the binder component is from 90/10 to 98/2,

the conductive powder comprises a first alloy particle and a second metal particle, wherein the first alloy particle is a non-lead solder particle having a melting point of from 130°

C. to 260°

C., the second metal particle is at least one selected from the group consisting of Au, Ag, and Cu, and the mass ratio of the first alloy particle to the second metal particle is from 76/24 to 90/10,

the binder component is a mixture of thermosetting polymerizable monomers and the melting point of the non-lead solder particle is within the range of setting temperature of the binder component,

storage elastic modulus of the thermoplastic resin composition constituting the insulating base material at the melting point of the non-lead solder particle is from 10 MPa to 5 GPa.

11. A method for fabricating a multilayer wiring substrate having a cavity portion by laminating a plurality of wiring substrates, comprising:

A) laminating one or more layers of wiring substrate 1 arranged on the bottom of a cavity portion;

B) laminating one or more layers of wiring substrate 2 arranged on the wiring substrate 1; and

C) integrating these laminated wiring substrates by thermocompression bonding, wherein the wiring substrate 1 and/or the wiring substrate 2 respectively comprise an insulating base material which comprises an inorganic filler thermoplastic resin composition as a main component and which has an average reflectance of 70% or more in the wavelength range of 400-800 nm and a decreasing rate in reflectance of 10% or less in a wavelength range of 470 nm after thermal treatment at 200°

C. for 4 hours, and the wiring substrate 2 further comprises a cavity hole.

12. A method for fabricating a multilayer wiring substrate having a cavity portion by laminating a plurality of wiring substrates, comprising:

forming a wiring substrate 1 comprising;

an insulating base material 1, an adhesive layer comprising a thermosetting resin composition as a main component and being provided on at least one surface of the insulating base material 1, and a conductive pattern provided on the adhesive layer and/or the insulating base material 1;

forming a monolayer wiring substrate 2 or sequentially forming a multilayer wiring substrate 2 by once or repeatedly;

superposing on the wiring substrate 1 an insulating base material 2 where an adhesive layer comprising a thermosetting resin composition as a main component is provided on at least one surface and in which a cavity hole is formed;

superposing a copper foil on the insulating base material 2;

integrating these layers by thermocompression bonding; and

then, etching the copper foil to produce a conductive pattern,

wherein the insulating base material 1 and/or the insulating base material 2 independently comprise an inorganic filler thermoplastic resin composition as a main component and which have an average reflectance of 70% or more in a wavelength range of 400-800 nm and a decreasing rate in reflectance of 10% or less in a wavelength range of 470 nm after thermal treatment at 200°

C. for 4 hours.

13. A method for fabricating a multilayer wiring substrate having a cavity portion by laminating a plurality of wiring substrate, comprising:

sequentially forming two or more wiring substrates 1 by once or repeatedly;

forming a wiring substrate 1 comprising;

an insulating base material 1, an adhesive layer comprising a thermosetting resin composition as a main component and being provided on at least one surface of the insulating base material 1, and a conductive pattern provided on the adhesive layer and/or the insulating base material 1;

superposing on the wiring substrate 1 an insulating base material 1 where an adhesive layer comprising a thermosetting resin composition as a main component is provided on at least one surface;

superposing a copper foil on the insulating base material 1;

integrating these layers by thermocompression bonding; and

then, etching the copper foil to produce a conductive pattern,

further, forming a monolayer wiring substrate 2 or sequentially forming a multilayer wiring substrate 2 by once or repeatedly;

superposing on the wiring substrate 1 an insulating base material 2 where an adhesive layer comprising a thermosetting resin composition as a main component is provided on at least one surface and in which a cavity hole is formed;

superposing a copper foil on the insulating base material 2;

integrating these layers by thermocompression bonding; and

then, etching the copper foil to produce a conductive pattern,

wherein the insulating base material 1 and/or the insulating base material 2 independently comprise an inorganic filler thermoplastic resin composition as a main component and have an average reflectance of 70% or more in a wavelength range of 400-800 nm and a decreasing and 21-27 rate in reflectance of 10% or less in a wavelength range of 470 nm after thermal treatment at 200°

C. for 4 hours.