SUSPENDED LEAD FRAME ELECTRONIC PACKAGE

• US 20110042137A1
• Filed: 08/18/2009
• Published: 02/24/2011
• Est. Priority Date: 08/18/2009
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Eskridge, Mark
• Application Number:
  US12/543,290
• Publication Number:
  US 20110042137A1
• Time in Patent Office: Days
• US Class Current: 174/536
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

An apparatus and method for packaging an electronic device that mechanically isolates the electronic device from its supporting substrate, eliminating transfer of mechanical stress from the substrate to the device. The apparatus includes a plurality of elongated members that extend from a frame support to a center opening, where the ends of the elongated members together support the electronic device. The shape, material and orientation of the elongated members combine to both support the electronic device and absorb mechanical force transmitted from the substrate to the support frame. In one example, the absorbing portion is substantially perpendicular to the direction of the transmitted force and the transmitted force is absorbed by mechanical displacement of one end of the perpendicular portion. The apparatus and method are particularly effective in eliminating the negative effects of thermal expansion mismatch between the electronic device and its supporting substrate.

Claims

1. An electronic package assembly comprising:

an electronic device;

a frame; and

a plurality of elongated members extending between the electronic device and the frame;

wherein the frame supports the elongated members, wherein at least two elongated members support the electronic device at least partially within a cavity of the frame, and wherein at least one elongated member is configured to absorb a shear force transmitted from the frame.

2. The assembly of claim 1, further comprising a substrate, wherein a first face of the frame is bonded to a first face of the substrate.

3. The assembly of claim 2, wherein the at least two elongated members extend from a second face of the frame to a first face of the electronic device, wherein the second face of the frame is on a side of the frame opposite the first face of the frame, and wherein the first face of the electronic device faces the first face of the substrate.

4. The assembly of claim 1, wherein the at least one of the elongated members includes a segment oriented at an acute angle to the direction of the transmitted shear force.

5. The assembly of claim 1, wherein the at least one of the elongated members includes a segment oriented substantially perpendicular to the direction of the transmitted shear force.

6. The assembly of claim 1, wherein at least one of the elongated members is made of metal.

7. The assembly of claim 1, wherein at least an end portion of at least one elongated member is treated with a material to enhance electrical connectivity.

8. The assembly of claim 7, wherein the material is at least one of aluminum thin film and electrolytic gold.

9. The assembly of claim 1, wherein the plurality of elongated members are linked to one another by a perimeter support.

10. The assembly of claim 1, wherein at least one of the elongated members extends beyond an exterior edge of the frame and wraps around the exterior edge of the frame toward a second face of the substrate.

11. The assembly of claim 1, further comprising a lid, wherein the lid is bonded to the second face of the frame.

12. The assembly of claim 1, wherein the electronic device includes a semiconducting circuit.

13. The assembly of claim 1, wherein the electronic device includes a micro-electromechanical system (MEMS) sensor.

14. The assembly of claim 1, wherein the electronic device includes an accelerometer.

15. An electronic package assembly comprising:

a substantially planar electronic device;

a planar substrate;

a planar frame;

wherein the planar frame has first and second major faces on opposite sides of the frame as one another;

wherein the frame provides a cavity defined by two planes coinciding with the first and second major faces, and an interior edge of the frame;

wherein the frame'"'"'s first face is mounted to a face of the planar substrate; and

wherein the electronic device lies at least partially within the cavity and includes a first face facing the substrate; and

a plurality of elongated members;

wherein the frame'"'"'s second face supports ends of the elongated members;

wherein the elongated members extend between the first face of the electronic device and the second face of the frame;

wherein the elongated members suspend the electronic device at least partially within the defined cavity; and

wherein at least one elongated member includes a segment oriented substantially perpendicular to the direction of the transmitted shear force, thereby absorbing mechanical stress transmitted from the frame.