DIRECT WAFER-BONDED THROUGH-HOLE PHOTODIODE

• US 20110042576A1
• Filed: 08/20/2010
• Published: 02/24/2011
• Est. Priority Date: 08/20/2009
• Status: Abandoned Application

• Current Assignee: IceMOS Technology Ltd
• Original Assignee: IceMOS Technology Ltd
• Inventors: WILSON, Robin, MACNAMARA, Cormac
• Application Number:
  US12/860,024
• Publication Number:
  US 20110042576A1
• Time in Patent Office: Days
• US Class Current: 250/370.11
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 27/1446 in a repetitive configuration
• CPC Class Codes: H01L 27/14663 Indirect radiation imagers, e.g. using luminescent members
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 31/105 the potential barrier being of the PIN type
• CPC Class Codes: H01L 31/1804 comprising only elements of Group IV of the Periodic Table
• CPC Class Codes: Y02E 10/547 Monocrystalline silicon PV cells

Abstract

A photodetector array comprises a plurality of photodetectors formed by a high resistivity low doping concentration first semiconductor substrate and a low resistivity high doping concentration second semiconductor substrate. The first and second semiconductor substrates are directly bonded together with a silicon-to-silicon atomic bond at a bond interface, thereby providing a sharp transition from the first substrate to the second substrate. A method of making the photodetector array is also provided.

Claims

1. A photodetector array comprising a plurality of photodetectors formed of:

(a) a high resistivity low doping concentration first semiconductor substrate; and

(b) a low resistivity high doping concentration second semiconductor substrate, wherein the first and second semiconductor substrates are directly bonded together with a silicon-to-silicon atomic bond at a bond interface, thereby providing a sharp transition from the first substrate to the second substrate.

2. The photodetector array of claim 1 further comprising:

a p+ anode formed in the top surface of the first substrate;

an anode contact formed on the bottom surface of the second substrate; and

a plurality of electrically isolated through silicon vias that longitudinally traverse the first and second substrates from the top surface of the first substrate to the bottom surface of the second substrate, the top of each via being in electrical contact with the p+ anode and the bottom of the via being in electrical contact with the anode contact.

3. The photodetector array of claim 2 wherein the vias are filled with low resistance polysilicon.

4. The photodetector array of claim 1 wherein the first substrate is an intrinsic i-type high resistivity low doping concentration silicon substrate, and the second substrate is a n++ low resistivity high doping concentration silicon substrate, the photodetector array further comprising:

a p+ anode formed in the top surface of the first substrate,

wherein the p+ anode, the first substrate and the second substrate forms a P region/intrinsic region/N region (PIN) configuration.

5. The photodetector array of claim 1 wherein the first substrate is an intrinsic i-type high resistivity low doping concentration silicon substrate, and the second substrate is a n+ low resistivity high doping concentration silicon substrate, the photodetector array further comprising:

a p+ anode formed in the top surface of the first substrate, and

a cathode contact diffusion on the backside of the second substrate.

6. The photodetector array of claim 1 wherein the first substrate is an intrinsic i-type high resistivity low doping concentration silicon substrate, and the second substrate is a n++ low resistivity high doping concentration silicon substrate, the photodetector array further comprising:

a p+ anode formed in the top surface of the first substrate,

a n++ diffusion on the backside of the first substrate.

7. The photodetector array of claim 1 wherein the second substrate acts as a cathode, the photodetector array further comprising:

a cathode contact formed on the bottom surface of the second substrate, thereby providing an electrical connection for the second substrate at the bottom of the plurality of photodetectors.

8. The photodetector of claim 1 wherein the plurality of photodetectors define a front lit tile.

9. A radiation detector comprising:

(a) a scintillator layer that converts X-ray radiation to visible light; and

(b) a photodiode array that converts the visible light to an electrical signal, the photodiode array including a plurality of photodetectors formed of;

(i) a high resistivity low doping concentration first semiconductor substrate; and

(ii) a low resistivity high doping concentration second semiconductor substrate, wherein the first and second semiconductor substrates are directly bonded together with a silicon-to-silicon atomic bond at a bond interface, thereby providing a sharp transition from the first substrate to the second substrate.

10. The radiation detector of claim 9 wherein the plurality of photodetectors define a front lit tile.

11. An X-ray CT scanner comprising:

(a) a scintillator layer that converts X-ray radiation to visible light; and

(b) a photodiode array that converts the visible light to an electrical signal, the photodiode array including a plurality of photodetectors formed of;

(i) a high resistivity low doping concentration first semiconductor substrate; and

(ii) a low resistivity high doping concentration second semiconductor substrate, wherein the first and second semiconductor substrates are directly bonded together with a silicon-to-silicon atomic bond at a bond interface, thereby providing a sharp transition from the first substrate to the second substrate.

12. The X-ray CT scanner of claim 11 wherein the plurality of photodetectors define a front lit tile.

13. A method of making a plurality of photodetectors comprises:

(a) providing a high resistivity low doping concentration first semiconductor substrate;

(b) providing a low resistivity high doping concentration second semiconductor substrate; and

(c) bonding the first and second substrates together to form a single structure, wherein a silicon-to-silicon atomic bond is formed at a bond interface, thereby providing a sharp transition from the first substrate to the second substrate.

14. The method of claim 13 wherein the first substrate is an intrinsic i-type high resistivity low doping concentration silicon substrate, and the second substrate is a n++ low resistivity high doping concentration silicon substrate.

15. The method of claim 13 further comprising:

(d) heating the bonded single structure to greater than 1050 degrees Celsius.

16. A photodetector array comprising a plurality of photodetectors having double-sided electrodes, the plurality of photodetectors comprising:

(a) a semiconductor substrate having a top and bottom surface;

(b) a first electrode on the top surface of the substrate;

(c) a second electrode on the bottom surface of the substrate;

(d) a plurality of electrically isolated through silicon vias that longitudinally traverse the substrate from the top surface of the substrate to the bottom surface of the substrate, the vias including continuous electrical connections therethrough, wherein the top of each via is electrically connected to the first electrode, and the bottom of each via is electrically connected to the second electrode, thereby providing the plurality of photodetectors with double-sided electrodes.

17. The photodetector array of claim 16 wherein the first electrode is a p+ anode and the second electrode is an anode contact.

18. The photodetector array of claim 16 wherein the vias are filled with low resistance polysilicon which is used to make the continuous electrical connections through the vias.

19. The photodetector array of claim 16 wherein the semiconductor substrate is formed of:

(i) a high resistivity low doping concentration first semiconductor substrate, and

(ii) a low resistivity high doping concentration second semiconductor substrate, wherein the first and second semiconductor substrates are directly bonded together with a silicon-to-silicon atomic bond at a bond interface, thereby providing a sharp transition from the first substrate to the second substrate.