Substrate for light emitting diode package and light emitting diode package having the same

• US 20110042699A1
• Filed: 12/18/2009
• Published: 02/24/2011
• Est. Priority Date: 08/24/2009
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Sohn, Young Ho, Park, Sung Keun, Kim, Tae Hyun, Lee, Young Ki, Choi, Seog Moon
• Application Number:
  US12/654,431
• Publication Number:
  US 20110042699A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/4848 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented.

Claims

1. A substrate for a light emitting diode (LED) package, the substrate comprising:

a metal plate;

an insulation oxide layer formed on a portion of the surface of the metal plate;

a first conductive pattern formed on one region of the insulation oxide layer and providing a light emitting diode mounting area; and

a second conductive pattern formed on another region of the insulation oxide layer such that it is separated from the first conductive pattern.

2. The substrate of claim 1, wherein a region of the metal plate exposed as the insulation oxide layer is formed on a portion of the metal plate is obtained as the same material as that of the insulation oxide layer is formed and then removed.

3. The substrate of claim 1, wherein the insulation oxide layer is an anode oxide film formed by performing an anodizing process on the metal plate.

4. The substrate of claim 1, further comprising:

first and second external mounting pads formed on the first and second conductive patterns, respectively.

5. The substrate of claim 1, further comprising:

first and second external mounting pads electrically connected with the first and second conductive patterns via a through hole formed at the metal plate.

6. The substrate of claim 5, wherein the metal plate is exposed as the insulation oxide layer is removed from the region where the first and second external mounting pads have not been formed.

7. A driving circuit substrate for a light emitting diode package, the substrate comprising:

a metal plate;

an insulation oxide layer formed on a portion of the surface of the metal plate; and

a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode package mounting area and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from first conductive pattern; and

8. A method for fabricating a metal substrate for a light emitting diode package, the method comprising:

forming an insulation oxide layer on a surface of a metal plate;

forming a first conductive pattern at one region of the insulation oxide layer and providing a light emitting diode package mounting area and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern;

removing the insulation oxide layer from a region where the first and second conductive patterns have not been formed to expose the metal plate.

9. The method of claim 8, wherein the insulation oxide layer is formed by performing an anodizing process on the metal plate.

10. The method of claim 8, further comprising:

forming a through hole at the metal plate and forming first and second external mounting pads electrically connected with the first and second conductive patterns through the through hole.

11. The method of claim 10, further comprising:

removing the insulation oxide layer from a region where the first and second external mounting pads have not been formed to expose the metal plate.

12. A light emitting diode (LED) package comprising:

a metal plate;

an insulation oxide layer formed on a portion of a surface of the metal plate;

a second conductive pattern formed at one region of the insulation oxide layer and providing an LED mounting area and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern;

an LED mounted on the first conductive pattern and electrically connected with the second conductive pattern; and

a transparent resin covering the LED.

13. The package of claim 12, further comprising:

first and second external mounting pads formed on the first and second conductive patterns, respectively.

14. The package of claim 12, further comprising:

first and second reflective films formed on the first and second conductive patterns and first and second external mounting pads penetrating the first and second reflective films.

15. The package of claim 12, further comprising:

first and second external mounting pads formed in a penetrating manner at the metal plate and electrically connected with the first and second conductive patterns.

16. The package of claim 12, further comprising:

first and second external mounting pads formed in a penetrating manner at the metal plate and electrically connected with the first and second conductive patterns, and a reflective film formed on the first and second conductive patterns.