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MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME

  • US 20110042824A1
  • Filed: 08/17/2010
  • Published: 02/24/2011
  • Est. Priority Date: 08/20/2009
  • Status: Active Grant
First Claim
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1. A multi-chip module comprising:

  • a package board;

    a plurality of chips horizontally disposed on the package board, electrically connected with the package board, respectively provided with via holes penetrating through the plurality of chips, and respectively provided with circuits at surfaces facing the package board; and

    a wiring board disposed on an opposite side to the package board across the plurality of chips, and including a wiring pattern electrically connecting adjacent chips one another,wherein the circuit is electrically connected to the wiring pattern through the via holes.

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