ELECTRONIC EQUIPMENT AND METHOD FOR CONNECTING ELECTRONIC CIRCUIT SUBSTRATE
First Claim
Patent Images
1. Electronic equipment comprising:
- a first electronic circuit substrate;
a second electronic circuit substrate;
a first coil connected to said first electronic circuit substrate; and
a second coil connected to said second electronic circuit substrate, wherein;
power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected,wherein said first coil has;
a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and
a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate,and wherein said second coil has;
a second power coil that receives power transmitted by said first power coil; and
a second communication coil that communicates with said first communication coil.
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Abstract
Wireless power supply and information communication are achieved between electronic circuit substrates in the electronic equipment, and the size of the circuitry for achieving the above is reduced. There are provided a first electronic circuit substrate, a second electronic circuit substrate, a first coil connected to the first electronic circuit substrate, and a second coil connected to the second electronic circuit substrate. Power is transmitted from the first coil to the second coil by electromagnetic induction so that the first electronic circuit substrate and the second electronic circuit substrate are electrically connected.
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Citations
30 Claims
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1. Electronic equipment comprising:
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a first electronic circuit substrate; a second electronic circuit substrate; a first coil connected to said first electronic circuit substrate; and a second coil connected to said second electronic circuit substrate, wherein; power is transmitted from said first coil to said second coil by electromagnetic induction so that said first electronic circuit substrate and said second electronic circuit substrate are electrically connected, wherein said first coil has; a first power coil that transmits power from said first electronic circuit substrate to said second electronic circuit substrate; and a first communication coil that communicates between said first electronic circuit substrate and said second electronic circuit substrate, and wherein said second coil has; a second power coil that receives power transmitted by said first power coil; and a second communication coil that communicates with said first communication coil. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 18, 19, 20, 21, 22, 23)
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Specification