LED LAMP

• US 20110044043A1
• Filed: 12/17/2009
• Published: 02/24/2011
• Est. Priority Date: 08/21/2009
• Status: Abandoned Application

• Current Assignee: National Tsing Hua University
• Original Assignee: National Tsing Hua University
• Inventors: WONG, Shwin-Chung
• Application Number:
  US12/640,631
• Publication Number:
  US 20110044043A1
• Time in Patent Office: Days
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 8/08 with a standard F21S6/00 takes precedence
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/77 with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence

Abstract

An LED lamp includes at least a flat-plate heat pipe arranged within a flat sealing container, wherein the upper and the lower surfaces of the flat-plate heat pipe respectively contact with the internal walls of the top plate and the base plate of the sealing container. At least one LED module is configured on the base plate. The heat generated by the LED module transfers through the base plate to the flat-plate heat pipe, and vaporizes the working fluid therein, so that the heat is spread with the vapor motion, and is then released to the atmosphere through the large area including the external wall of the sealing container and the fin structure thereon. The sealing container provides structural strength of the lamp and protects the flat-plate heat pipe from corrosion by water and contaminants in the environment.

Claims

1. An LED lamp, comprising:

a sealing container including a base plate, a top plate and a plurality of sides, between which an enclosure is formed, wherein the base plate has at least one defined LED module mounting section;

at least one flat-plate heat pipe arranged within said enclosure and having an upper surface and a lower surface respectively contacting with the internal wall of said top plate and the internal wall of said base plate; and

at least one LED module including a substrate and at least one LED device, wherein the substrate is attached to the external wall of said LED module mounting section.

2. The LED lamp as in claim 1, further comprising a heat dissipating fin structure configured at least on the external wall of said top plate of said sealing container.

3. The LED lamp as in claim 2, wherein said heat dissipating fin structure includes an extension out of said sealing container.

4. The LED lamp as in claim 2, wherein the external wall of said sealing container and the external surfaces of said heat dissipating fin structure are treated to increase the radiative emissivity thereof.

5. The LED lamp as in claim 1, further comprising a first interface material arranged between said substrate and the external wall of said base plate.

6. The LED lamp as in claim 5, wherein said first interface material is selected from the group consisting of solder, thermal pad, thermal grease, thermal paste, and thermal tape.

7. The LED lamp as in claim 1, further comprising a second interface material arranged between a portion of the internal wall of said base plate and a portion of the lower surface of said flat-plate heat pipe.

8. The LED lamp as in claim 7, wherein said second interface material is selected from the group consisting of solder, thermal pad, thermal grease, thermal paste, and thermal tape.

9. The LED lamp as in claim 1, further comprising a third interface material arranged between the internal wall of said top plate and the upper surface of said flat-plate heat pipe.

10. The LED lamp as claimed in claim 9, wherein the third interface material is selected from the group consisting of solder, thermal pad, thermal grease, thermal paste, and thermal tape.

11. The LED lamp as in claim 1, wherein said LED module mounting section is thicker than other sections of said base plate.

12. The LED lamp as in claim 1, wherein said substrate is fixed to said base plate by soldering or screwing.

13. The LED lamp as in claim 1, further comprising a spacer arranged in said enclosure, wherein one end of the spacer is set on the internal wall of said top plate and the other end of the spacer is set on the internal wall of said base plate.

14. The LED lamp as in claim 13, wherein a plurality of through holes are configured to penetrate the said top plate, said spacer, and said base plate.

15. The LED lamp as in claim 1, wherein at least one thermally conductive via is configured in said LED module mounting section and is to be engaged with said substrate of said LED module.

16. The LED lamp as in claim 1, wherein said enclosure is formed within said base plate, said top plate and said plurality of sides of said sealing container by adhesive bonding, soldering, screwing, or being partially in an integral unit.

17. The LED lamp as in claim 1, wherein said sealing container is in a shape of a flat plate or a curved plate.

18. The LED lamp as in claim 1, further comprising a lamp post for mounting said sealing container at one end of said lamp post.

19. The LED lamp as in claim 1, further comprising a lampshade above said sealing container, and said lampshade comprising a plurality of air vents.

20. The LED lamp as in claim 1 further comprising a seal cover or a sealing material covering the interface between said base plate and said substrate of said LED module.