ELECTROCHEMICAL DEVICE AND PACKAGING STRUCTURE THEREOF

• US 20110045327A1
• Filed: 05/07/2009
• Published: 02/24/2011
• Est. Priority Date: 05/08/2008
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Kobayashi, Motoki, Ishida, Katsuei, Yawata, Kazushi, Hagiwara, Naoto
• Granted Patent: US 8,765,277 B2
• Time in Patent Office: Days
• US Class Current: 429/82
• CPC Class Codes: H01G 11/12 Stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/18 against thermal overloads, e.g. heating, cooling or ventilating
• CPC Class Codes: H01G 11/74 Terminals, e.g. extensions of current collectors
• CPC Class Codes: H01G 11/76 specially adapted for integration in multiple or stacked hybrid or EDL capacitors
• CPC Class Codes: H01G 11/82 Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
• CPC Class Codes: H01G 9/10 Sealing, e.g. of lead-in wires
• CPC Class Codes: H01M 10/613 Cooling or keeping cold
• CPC Class Codes: H01M 10/647 Prismatic or flat cells, e.g. pouch cells
• CPC Class Codes: H01M 10/658 by thermal insulation or shielding
• CPC Class Codes: H01M 50/124 having a layered structure
• CPC Class Codes: H01M 50/1245 characterised by the external coating on the casing
• CPC Class Codes: H01M 50/126 comprising three or more layers
• CPC Class Codes: H01M 50/143 Fireproof; Explosion-proof
• CPC Class Codes: H01M 50/176 for prismatic or rectangular cells H01M50/181 takes precedence
• CPC Class Codes: H01M 50/24 adapted for protecting batteries from their environment, e.g. from corrosion thermal insulation H01M10/658
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02E 60/13 Energy storage using capacitors
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.

Claims

1. An electrochemical device which is mounted by soldering for use, comprising:

a package;

an electric storage element which is sealed into the package;

at least a pair of terminals, each having one end which is electrically connected to the electric storage element and another end which is led out of the package; and

heat transfer suppressing means which covers the entire package and bases of led-out portions of the terminals so as to suppress heat transfer from the outside to the package.

2. The electrochemical device according to claim 1, wherein the heat transfer suppressing means includes a thermal insulation material layer having a thermal conductivity lower than a thermal conductivity of the package.

3. The electrochemical device according to claim 2, wherein the heat transfer suppressing means includes the thermal insulation material layer and a cover sheet which covers the thermal insulation material layer.

4. The electrochemical device according to claim 3, wherein the cover sheet is adhered to the surface of the thermal insulation material layer using an adhesive.

5. The electrochemical device according to claim 3, wherein an air discharge hole is formed on the cover sheet.

6. The electrochemical device according to claim 2, further comprising a deformation-suppressing member which is interposed between the package and the thermal insulation material layer while being covered by the thermal insulation material layer, wherein the deformation-suppressing member has a rigidity higher than that of the package, and covers the package and the bases of led-out portions of the terminals.

7. The electrochemical device according to claim 1, wherein the heat transfer suppressing means includes the cover sheet which covers the package, and an air layer disposed between the cover sheet and the package.

8. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 1 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.

9. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 2 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.

10. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 3 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.

11. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 4 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.

12. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 5 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.

13. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 6 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.

14. A packaging structure for an electrochemical device comprising:

a substrate which has a land formed on the surface thereof; and

an electrochemical device according to claim 7 which is mounted on the substrate, wherein tips of led-out portions of the terminals are connected to the land using a solder.