REMOTE PLASMA SOURCE SEASONING

• US 20110045676A1
• Filed: 08/18/2009
• Published: 02/24/2011
• Est. Priority Date: 08/18/2009
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Jeon, Soo, Liang, Qiwei, Yang, Jang-Gyoo, Tran, Toan Q., Park, Soonam, Lubomirsky, Dmitry
• Granted Patent: US 7,989,365 B2
• Time in Patent Office: Days
• US Class Current: 438/771
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/4404 Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32862 In situ cleaning of vessels and/or internal parts
• CPC Class Codes: Y10S 438/905 Cleaning of reaction chamber

Abstract

Methods of seasoning a remote plasma system are described. The methods include the steps of flowing a silicon-containing precursor into a remote plasma region to deposit a silicon containing film on an interior surface of the remote plasma system. The methods reduce reactions with the seasoned walls during deposition processes, resulting in improved deposition rate, improved deposition uniformity and reduced defectivity during subsequent deposition.

Claims

1. A method of forming a silicon-containing layer on a surface of a substrate within a processing region, the method comprising:

cleaning an interior surface of a remote plasma region, wherein the cleaning operation comprises;

flowing a cleaning gas into the remote plasma region, and forming a cleaning plasma in the remote plasma region; and

treating the interior surface, wherein the treating operation comprises;

flowing a first silicon-containing precursor into the remote plasma region, and

forming a treatment plasma in the remote plasma region to deposit a protective silicon-containing film on the interior surface.

2. The method of claim 1 further comprising:

depositing the silicon-containing layer on the substrate, wherein the depositing operation comprises;

flowing an oxygen-containing precursor into the remote plasma region,

forming a deposition plasma in the remote plasma region,

flowing deposition plasma effluents into the processing region,

flowing a second silicon-containing precursor into the processing region, and

forming the silicon-containing layer from the deposition plasma effluents and the second silicon-containing precursor.

3. The method of claim 1, wherein the silicon-containing layer comprises silicon oxide.

4. The method of claim 2, wherein the first silicon-containing precursor is the same as the second silicon-containing precursor.

5. The method of claim 1, wherein the first silicon-containing precursor is a silicon-and-oxygen-containing precursor.

6. The method of claim 1, wherein the silicon-containing precursor comprises at least one of silane, disilane, TSA, TMOS, DSA, TEOS, OMCTS and TMDSO.

7. The method of claim 1, wherein the cleaning gas comprises fluorine.

8. The method of claim 1, wherein the cleaning gas comprises nitrogen trifluoride (NF₃).

9. The method of claim 1, wherein the first silicon-containing precursor flows into the processing chamber before flowing into the remote plasma region.

10. The method of claim 1, wherein the deposition plasma effluents comprise oxygen radicals (O).

11. The method of claim 1, wherein the presence of the treating operation reduces a number of added particles during the depositing operation.

12. The method of claim 1, wherein the presence of the treating operation increases a deposition rate during the depositing operation.

13. The method of claim 1, wherein a pressure in the remote plasma region is between about 2 Torr and about 10 Torr.

14. The method of claim 1, wherein the operation of flowing a first silicon-containing precursor is completed before the operation of forming a treatment plasma and a valve between the processing region and a vacuum pump is closed during the operation of forming a treatment plasma.

15. A method of treating an aluminum-containing interior surface of a remote plasma source prior to depositing a silicon-containing layer on a substrate within a processing region, the method comprising:

flowing a halogen-containing gas into the remote plasma region;

forming a cleaning plasma in the remote plasma region which results in exposed portions of the aluminum-containing interior surface;

flowing a first silicon-containing precursor into the remote plasma region; and

forming a treatment plasma in the remote plasma region to deposit a silicon-containing film on the aluminum-containing interior surface.

16. The method of claim 15 further comprising:

depositing the silicon-containing layer on the substrate, wherein the depositing operation comprises;

flowing an oxygen-containing precursor into the remote plasma region,

forming a deposition plasma in the remote plasma region,

flowing deposition plasma effluents into the processing chamber,

flowing a second silicon-containing precursor into the processing chamber, and

forming the silicon-containing layer from the deposition plasma effluents and the second silicon-containing precursor.

17. The method of claim 15, wherein the halogen-containing gas comprises nitrogen trifluoride (NF₃).

18. The method of claim 15, wherein the silicon-containing film is predominantly silicon.

19. The method of claim 15, wherein the silicon-containing film comprises silicon oxide.

20. A method of forming a silicon oxide layer on the surface of a substrate within a processing region, the method comprising:

cleaning an interior surface of a plasma region, wherein the cleaning operation comprises;

flowing a cleaning gas into the plasma region, and

forming a cleaning plasma in the plasma region;

seasoning the interior surface of the plasma region, wherein the treating operation comprises;

flowing a first silicon-containing precursor into the plasma region, and

forming a seasoning plasma in the plasma region to deposit a protective silicon-containing film on the interior surface; and

depositing the silicon oxide layer on the substrate, wherein the depositing operation comprises;

flowing an oxygen-containing precursor into the plasma region,

forming a deposition plasma in the plasma region,

flowing deposition plasma effluents into the processing region,

flowing a second silicon-containing precursor into the processing region, and

forming the silicon oxide film from the deposition plasma effluents and the second silicon-containing precursor.

21. The method of claim 20, wherein the plasma region is a remote plasma region.

22. The method of claim 20, wherein the plasma region is within the processing chamber but separated from the processing region by a showerhead.

23. The method of claim 20, wherein the first silicon-containing precursor is the same as the second silicon-containing precursor.