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LOW-K DIELECTRICS OBTAINABLE BY TWIN POLYMERIZATION

  • US 20110046314A1
  • Filed: 04/28/2009
  • Published: 02/24/2011
  • Est. Priority Date: 04/28/2008
  • Status: Active Grant
First Claim
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1. A dielectric layer with a permittivity of 3.5 or less comprising a dielectric obtained by a process comprising polymerizing at least one twin monomer comprisinga) a first monomer unit which comprises a metal or semimetal, andb) a second monomer unit which is connected to the first monomer unit via a chemical bond,wherein the polymerization involves polymerizing the twin monomer with breakage of the chemical bond and formation of a first polymer comprising the first monomer unit and of a second polymer comprising the second monomer unit, and wherein the first and the second monomer unit polymerize via a common mechanism.

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