Electrochromic devices, assemblies incorporating electrochromic devices, and/or methods of making the same

• US 20110048614A1
• Filed: 07/14/2010
• Published: 03/03/2011
• Est. Priority Date: 08/27/2009
• Status: Active Grant

• Current Assignee: Guardian Glass LLC (KOCH Industries Incorporated)
• Original Assignee: Guardian Industries Corporation (KOCH Industries Incorporated)
• Inventors: Veerasamy, Vijayen S.
• Granted Patent: US 8,858,748 B2
• Time in Patent Office: Days
• US Class Current: 156/150
• CPC Class Codes: B32B 17/10045 with at least one intermediate layer consisting of a glass sheet
• CPC Class Codes: B32B 17/10055 with at least one intermediate air space
• CPC Class Codes: B32B 17/10174 Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• CPC Class Codes: B32B 17/10761 containing vinyl acetal
• CPC Class Codes: B32B 17/10981 Pre-treatment of the layers
• CPC Class Codes: E06B 2009/2464 featuring transparency control by applying voltage, e.g. LCD, electrochromic panels
• CPC Class Codes: E06B 3/6722 with adjustable passage of light
• CPC Class Codes: E06B 9/24 Screens or other constructions affording protection against light, especially against sunshine; Similar screens for privacy or appearance; Slat blindsoperating, guiding or securing devices or arrangements for roll-type closures E06B9/56; free-hanging flexible screens A47H23/00
• CPC Class Codes: G02F 1/1508 using a solid electrolyte
• CPC Class Codes: G02F 1/1524 Transition metal compounds
• CPC Class Codes: G02F 1/1525 characterised by a particular ion transporting layer, e.g. electrolyte
• CPC Class Codes: G02F 1/1533 structural features not otherwise provided for
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1062 Prior to assembly

Abstract

Certain example embodiments of this invention relate to electrochromic (EC) devices, assemblies incorporating electrochromic devices, and/or methods of making the same. More particularly, certain example embodiments of this invention relate to improved EC materials, EC device stacks, high-volume manufacturing (HVM) compatible process integration schemes, and/or high-throughput low cost deposition sources, equipment, and factories.

Claims

1. A method of making electrochromic windows, the method comprising:

providing a first glass substrate;

disposing electrochromic device layers on the first substrate comprising at least counter electrode (CE), ion conductor (IC), and electrochromic (EC) layers;

patterning the electrochromic device layers and cutting the first glass substrate with the electrochromic device layers disposed thereon so as to form a plurality of EC device substrates;

providing a plurality of second glass substrates;

laminating or bonding the plurality of EC device substrates to the plurality of second glass substrates, respectively;

providing a plurality of third glass substrates;

forming a plurality of insulating glass (IG) units, respectively comprising first and second substrates in substantially parallel, spaced apart relation to the third glass substrates.

2. The method of claim 1, wherein the plurality of second substrates are thermally tempered.

3. The method of claim 2, wherein the EC device layers are disposed by sputtering.

4. The method of claim 3, wherein the sputtering is ion-beam assisted.

5. The method of claim 2, wherein the EC device layers face the second substrates when assembled in the IG units.

6. The method of claim 2, wherein the EC device layers face the third substrates when assembled in the IG units.

7. The method of claim 2, further comprising providing first and second transparent conductive coatings (TCCs) on opposing sides of the electrochromic device layers.

8. The method of claim 7, wherein each said TCC includes a layer of silver sandwiched by layers of ITO, and further wherein NiCr inclusive or Cu layers are provided between the layer of silver and the layers of ITO.

9. The method of claim 8, wherein the sheet resistance of each said TCC is about 5 ohms/square.

10. The method of claim 2, wherein the IC layer includes LiPON.

11. The method of claim 2, wherein the EC layer comprises WOx.

12. The method of claim 11, wherein the WOx is sub-stoichiometric.

13. The method of claim 12, wherein 2.6<

x<

3.

14. The method of claim 11, wherein the CE layer, the IC layer, and/or the EC layer is/are doped with Mg.

15. The method of claim 14, further comprising providing one or more low-E coatings, the low-E coatings being provided on inner surfaces of the second substrates, on one or both surfaces of the first substrate, and/or on interior surfaces of the third glass substrates.

16. The method of claim 15, further comprising providing UV blocking coatings on inner surfaces of the second substrates.

17. The method of claim 2, wherein the plurality of EC device substrates are laminated or bonded to the plurality of second glass substrates via respective polymer-based layers.

18. A method of making an electrochromic (EC) assembly, the method comprising:

providing first, second, and third glass substrates, wherein the second substrate is thermally tempered and the first substrate is not thermally tempered;

sputtering-depositing a plurality of EC device layers, directly or indirectly, on the first substrate, the plurality of EC device layers comprising a first transparent conductive coating (TCC), a counter electrode (CE) layer, ion conductor (IC) layer, an EC layer, and a second TCC;

laminating or bonding the first and second substrates to one another; and

providing the second and third substrates in substantially parallel and spaced apart relation to one another,

wherein the CE and EC layers are both color changeable when the EC assembly is in operation.

19. A method of making an electrochromic (EC) assembly, the method comprising:

sputtering-depositing a plurality of EC device layers, directly or indirectly, on a first substrate, the plurality of device layers comprising, in order moving away from the first substrate, a first transparent conductive coating (TCC), a cathode layer, an electrolyte layer, an anodically coloring anode layer, and a second TCC; and

connecting the first substrate with the plurality of device layers sputter-deposited thereon to a second substrate such that the first and second substrates are in substantially parallel and spaced apart relation to one another.

20. The method of claim 19, wherein the first and/or second TCCs are silver-based dielectric layer stacks.

21. The method of claim 19, wherein the electrolyte layer comprises LiPON.

22. The method of claim 19, wherein the cathode layer, the electrolyte layer, and/or the anodically coloring anode layer is/are doped with Mg.

23. The method of claim 19, wherein the cathode layer comprises sub-stoichiometric WOx.

24. The method of claim 19, wherein the cathode layer comprises sub-stoichiometric WOx and 2.6<

x<

3.

25. The method of claim 19, wherein the CE and EC layers are both color changeable when the EC assembly is in operation.