×

HEAT DISSIPATION DEVICE

  • US 20110048682A1
  • Filed: 11/17/2009
  • Published: 03/03/2011
  • Est. Priority Date: 08/31/2009
  • Status: Abandoned Application
First Claim
Patent Images

1. A heat dissipation device, comprising:

  • a heat sink defining a through hole therein; and

    a heat pipe having an outer diameter slightly larger than a diameter of the through hole of the heat sink and being fixedly engaging in the through hole via interference fit, the heat pipe comprising a tube defining an interspace therein, a first wick formed on an inner surface of the tube, working fluid received in the interspace of the tube, and a retaining structure received in the interspace of the tube and abutting the first wick on the tube to enhance a rigidity of the tube, and a second wick being formed on an outer surface of the retaining structure.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×