PLATING FILM, PRINTED WIRING BOARD, AND MODULE SUBSTRATE
First Claim
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1. A plating film comprising:
- a nickel plating layer containing phosphorus; and
a gold plating layer formed on the nickel plating layer;
wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, andwherein (3×
σ
×
100)/X is 10 or less, where X and σ
are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively.
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Abstract
The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×σ×100)/X is 10 or less, where X and σ are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substrate 100 having the plating film 50.
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Citations
6 Claims
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1. A plating film comprising:
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a nickel plating layer containing phosphorus; and a gold plating layer formed on the nickel plating layer; wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×
σ
×
100)/X is 10 or less, where X and σ
are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification