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PLATING FILM, PRINTED WIRING BOARD, AND MODULE SUBSTRATE

  • US 20110048774A1
  • Filed: 08/26/2010
  • Published: 03/03/2011
  • Est. Priority Date: 09/02/2009
  • Status: Active Grant
First Claim
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1. A plating film comprising:

  • a nickel plating layer containing phosphorus; and

    a gold plating layer formed on the nickel plating layer;

    wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, andwherein (3×

    σ

    ×

    100)/X is 10 or less, where X and σ

    are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively.

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