SUBSTRATE HOLDER, SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD USING THE SAME
First Claim
Patent Images
1. A substrate holder comprising:
- a ring-shaped stage configured to receive an edge portion of a substrate thereon;
a sidewall connected to a lower surface of the stage for supporting the lower surface of the stage; and
an exhaust hole formed in the sidewall.
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Accused Products
Abstract
Provided are a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method. Particularly, there are provided a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method that are adapted to improve process efficiency and etch uniformity at the back surface of a substrate.
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Citations
64 Claims
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1. A substrate holder comprising:
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a ring-shaped stage configured to receive an edge portion of a substrate thereon; a sidewall connected to a lower surface of the stage for supporting the lower surface of the stage; and an exhaust hole formed in the sidewall. - View Dependent Claims (2, 3, 32, 33, 34, 35, 36, 37, 38, 39)
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4-31. -31. (canceled)
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40. A substrate supporting apparatus comprising:
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an electrode unit; a buffer member disposed at an outer circumference of the electrode unit; a substrate holder disposed on the buffer member for spacing a substrate apart from the electrode unit by supporting an edge portion of the substrate; and an elevating member configured to move the electrode unit and the substrate holder upward and downward. - View Dependent Claims (41, 42, 43)
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44. A substrate processing apparatus comprising:
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a chamber; a shield member disposed in the chamber; an electrode facing the shield member; and a substrate holder disposed between the shield member and the electrode, wherein the substrate holder comprises; a ring-shaped stage configured to receive an edge portion of a substrate thereon; a sidewall connected to a lower surface of the stage for supporting the lower surface of the stage; and an exhaust hole formed in the sidewall. - View Dependent Claims (45, 46, 47, 48)
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49. A substrate processing apparatus comprising:
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a chamber; a shield member disposed in the chamber; an electrode unit facing the shield member; a substrate holder disposed between the shield member and the electrode for supporting an edge portion of a substrate; a buffer member connecting the electrode unit and the substrate holder; and an elevating member connected to a lower portion of the electrode unit, wherein the substrate holder comprises; a ring-shaped stage configured to receive the edge portion of the substrate thereon; a sidewall connected to a lower surface of the stage for supporting the lower surface of the stage; and an exhaust hole formed in the sidewall. - View Dependent Claims (50, 51, 52, 53, 54)
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55. A substrate processing apparatus comprising:
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a gas distribution plate configured to uniformly distribute reaction gas supplied from an outer source; a hard stopper protruding downward from a lower edge portion of the gas distribution plate; a lower electrode configured to interact with an upper electrode to form an electric field for exciting reaction gas supplied through the gas distribution plate into a plasma state; and a side baffle vertically protruding from an edge portion of the lower electrode for uniformly exhausting plasma reaction gas therethrough in a lateral direction and making contact with the hard stopper when the lower electrode is lifted to limit the lifting of the lower electrode. - View Dependent Claims (56, 57, 58, 59, 60, 61)
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62. A substrate processing method comprising:
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carrying a substrate into a chamber; loading the substrate onto a substrate holder; simultaneously lifting the substrate holder and an electrode unit disposed under the substrate holder; processing the substrate; and carrying the substrate out of the chamber. - View Dependent Claims (63, 64)
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Specification