SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER, SIGNAL POST AND CAVITY

• US 20110049558A1
• Filed: 07/10/2010
• Published: 03/03/2011
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W.C., Lim, Sangwhoo, Wang, Chia-Chung
• Granted Patent: US 8,212,279 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/642 : characterized by the shape

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes first and second openings;

a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions; and

a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;

wherein a cavity in the thermal post faces in the upward direction;

wherein the semiconductor device extends into the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends laterally from the thermal post to or beyond the terminal and is sandwiched between the base and the pad;

wherein the conductive trace is located outside the cavity; and

wherein the thermal post extends into the first opening, the signal post extends into the second opening, the posts have the same thickness and are coplanar with one another, and the base and the terminal have the same thickness and are coplanar with one another.

2. The assembly of claim 1, wherein the semiconductor device is located within the cavity.

3. The assembly of claim 1, wherein the semiconductor device is an LED chip.

4. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a wire bond that extends outside the cavity and is thermally connected to the heat spreader using a die attach.

5. The assembly of claim 1, wherein the adhesive contacts the posts, the base and the terminal.

6. The assembly of claim 1, wherein the adhesive covers and surrounds the posts in the lateral directions.

7. The assembly of claim 1, wherein the adhesive conformally coats sidewalls of the posts.

8. The assembly of claim 1, wherein the adhesive is coplanar with tops of the posts.

9. The assembly of claim 1, wherein the adhesive extends laterally from the thermal post beyond the terminal.

10. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

11. The assembly of claim 1, wherein the thermal post is integral with the base and the signal post is integral with the terminal.

12. The assembly of claim 1, wherein the thermal post is coplanar with the adhesive at the base and the signal post is coplanar with the adhesive at the terminal.

13. The assembly of claim 1, wherein the thermal post has a diameter that decreases as it extends upwardly from the base to its flat top, and the signal post has a diameter that decreases as it extends upwardly from the terminal to its flat top.

14. The assembly of claim 1, wherein the conductive trace is spaced from the heat spreader and the terminal and the signal post contact the adhesive.

15. The assembly of claim 1, wherein the terminal is adjacent to and extends below the signal post and extends laterally from the signal post in the lateral directions.

16. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes first and second openings;

a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a dielectric layer, wherein first and second apertures extend through the substrate; and

a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and extends above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;

wherein a cavity in the thermal post faces in the upward direction;

wherein the semiconductor device is located within the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base and the terminal, extends between the thermal post and the substrate, extends between the signal post and the substrate, extends laterally from the thermal post to or beyond the terminal and is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer, between the base and the dielectric layer and between the terminal and the dielectric layer;

wherein the substrate is mounted on the adhesive and extends above the base and the terminal;

wherein the conductive trace is located outside the cavity; and

wherein the thermal post extends into the first opening and the first aperture, the signal post extends into the second opening and the second aperture, the posts have the same thickness and are coplanar with one another, and the base and the terminal have the same thickness and are coplanar with one another.

17. The assembly of claim 16, wherein the semiconductor device is an LED chip.

18. The assembly of claim 16, wherein the semiconductor device is electrically connected to the pad using a wire bond that extends within and outside the cavity and is thermally connected to the thermal post using a die attach that is located within the cavity.

19. The assembly of claim 16, wherein the adhesive contacts the posts, the base and the terminal.

20. The assembly of claim 16, wherein the adhesive covers and surrounds the posts in the lateral directions.

21. The assembly of claim 16, wherein the adhesive conformally coats sidewalls of the posts.

22. The assembly of claim 16, wherein the adhesive is coplanar with tops of the posts.

23. The assembly of claim 16, wherein the adhesive extends laterally from the thermal post beyond the terminal.

24. The assembly of claim 16, wherein the adhesive extends to peripheral edges of the assembly.

25. The assembly of claim 16, wherein the posts are coplanar with the adhesive above and below the dielectric layer.

26. The assembly of claim 16, wherein the thermal post has a diameter that decreases as it extends upwardly from the base to its flat top, and the signal post has a diameter that decreases as it extends upwardly from the terminal to its flat top.

27. The assembly of claim 16, wherein the cavity extends into the first opening and the first aperture.

28. The assembly of claim 16, wherein the base covers the thermal post in the downward direction, supports the substrate and is spaced from peripheral edges of the assembly.

29. The assembly of claim 16, wherein the conductive trace is spaced from the heat spreader, the pad contacts the dielectric layer, the terminal contacts the adhesive and is spaced from the dielectric layer and the signal post contacts the adhesive and is spaced from the dielectric layer.

30. The assembly of claim 16, wherein the substrate is a laminated structure.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes first and second openings;

a heat spreader that includes a thermal post and a base, wherein the thermal post is adjacent to and integral with the base and extends above the base in an upward direction and the base extends below the thermal post in a downward direction opposite the upward direction and extends laterally from the thermal post in lateral directions orthogonal to the upward and downward directions;

a substrate that includes a dielectric layer, wherein first and second apertures extend through the substrate;

a conductive trace that includes a pad, a terminal and a signal post, wherein the signal post extends below the pad and extends above the terminal and an electrically conductive path between the pad and the terminal includes the signal post;

wherein a cavity in the thermal post faces in the upward direction;

wherein the semiconductor device is located within the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the thermal post and thereby thermally connected to the base;

wherein the adhesive is mounted on and extends above the base and the terminal, extends into a first gap in the first aperture between the thermal post and the substrate and into a second gap in the second aperture between the signal post and the substrate, extends across the dielectric layer in the gaps, extends laterally from the thermal post to or beyond the terminal, extends to peripheral edges of the assembly, covers and surrounds the posts in the lateral directions and is sandwiched between the thermal post and the dielectric layer, between the signal post and the dielectric layer, between the base and the dielectric layer and between the terminal and the dielectric layer;

wherein the substrate is mounted on the adhesive and extends above the base and the terminal;

wherein the conductive trace is located outside the cavity; and

wherein the thermal post extends into the first opening and the first aperture, the signal post extends into the second opening and the second aperture, the posts have the same thickness and are coplanar with one another and extend through the dielectric layer, and the base and the terminal have the same thickness and are coplanar with one another and are located below the dielectric layer.

32. The assembly of claim 31, wherein the semiconductor device is an LED chip, is mounted on the thermal post using a die attach, is electrically connected to the pad using a wire bond that extends within and outside the cavity and is thermally connected to the thermal post using the die attach.

33. The assembly of claim 31, wherein the adhesive contacts the posts and the dielectric layer in the gaps and contacts the base, the terminal and the dielectric layer outside the gaps, and the dielectric layer contacts the pad and is spaced from the posts, the base and the terminal.

34. The assembly of claim 31, wherein the posts are coplanar with the adhesive above and below the dielectric layer.

35. The assembly of claim 31, wherein the thermal post has a diameter that decreases as it extends upwardly from the base to its flat top, the signal post has a diameter that decreases as it extends upwardly from the terminal to its flat top and the cavity extends into the first opening and the first aperture.