SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A semiconductor device, comprising:
- a first region and a second region defined in a main surface of a semiconductor substrate;
a first insulating film formed over the semiconductor substrate so as to cover the first region and the second region;
a plurality of first conductor formed so as to come in contact with a surface of a first portion of the first insulating film located in the first region;
a plurality of magnetic resistor elements formed at the respective first conductor;
a second insulating film formed over the first insulating film so as to fill a gap between the magnetic resistor elements adjacent to each other, and having first wire grooves; and
first wires formed in the first wire grooves, and each electrically coupled to a predetermined one of the magnetic resistor elements,wherein a surface of the first portion of the first insulating film is at a position lower than that of a surface of a second portion of the first insulating film located in the second region.
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Accused Products
Abstract
There are provided a semiconductor device in which short circuit failures in magnetic resistor elements and the like are reduced, and a method of manufacturing the same. An interlayer insulating film in which memory cells are formed is formed such that the upper surface of the portion of the interlayer insulating film located in a memory cell region where the magnetic resistor elements are formed is at a position lower than that of the upper surface of the portion of the interlayer insulating film located in a peripheral region. Another interlayer insulating film is formed so as to cover the magnetic resistor elements. In the another interlayer insulating film, formed are bit lines electrically coupled to the magnetic resistor elements. Immediately below the magnetic resistor elements, formed are digit lines.
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Citations
13 Claims
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1. A semiconductor device, comprising:
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a first region and a second region defined in a main surface of a semiconductor substrate; a first insulating film formed over the semiconductor substrate so as to cover the first region and the second region; a plurality of first conductor formed so as to come in contact with a surface of a first portion of the first insulating film located in the first region; a plurality of magnetic resistor elements formed at the respective first conductor; a second insulating film formed over the first insulating film so as to fill a gap between the magnetic resistor elements adjacent to each other, and having first wire grooves; and first wires formed in the first wire grooves, and each electrically coupled to a predetermined one of the magnetic resistor elements, wherein a surface of the first portion of the first insulating film is at a position lower than that of a surface of a second portion of the first insulating film located in the second region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor device having a first region and a second region in a main surface of a semiconductor substrate, comprising the steps of:
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forming a first insulating film over the semiconductor substrate so as to cover the first region and the second region therewith; setting a surface of a first portion of the first insulating film located in the first region at a position lower than that of a surface of a second portion of the first insulating film located in the second region; forming a plurality of first conductor such that each of the first conductor comes in contact with the surface of the first portion of the first insulating film; forming a plurality of magnetic resistor elements such that the magnetic resistor elements come in contact with respective surfaces of the first conductor; forming a second insulating film over the first insulating film so as to fill a gap between the magnetic resistor elements adjacent to each other therewith; forming wire grooves in the second insulating film; and forming, in the wire grooves, predetermined wires each electrically coupled to a predetermined one of the magnetic resistor elements. - View Dependent Claims (11, 12)
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13. A method of manufacturing a semiconductor device having a first region and a second region in a main surface of a semiconductor substrate, comprising the steps of:
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forming a first insulating film over the semiconductor substrate so as to cover the first region and the second region therewith; setting a surface of a first portion of the first insulating film located in the first region at a position lower than that of a surface of a second portion of the first insulating film located in the second region; forming a plurality of first conductor such that each of the first conductor comes in contact with the surface of the first portion of the first insulating film; forming a plurality of magnetic resistor elements such that the magnetic resistor elements come in contact with respective surfaces of the first conductor; forming a second insulating film over the first insulating film so as to fill a gap between the magnetic resistor elements adjacent to each other therewith; forming a silicon oxynitride film over the second insulating film; forming a third insulating film over the silicon oxynitride film; forming wire grooves in each of the third insulating film and the silicon oxynitride film; and forming, in the wire grooves, predetermined wires each electrically coupled to a predetermined one of the magnetic resistor elements.
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Specification