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SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND LEAD FRAME THEREOF

  • US 20110049693A1
  • Filed: 09/02/2010
  • Published: 03/03/2011
  • Est. Priority Date: 09/02/2009
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a first semiconductor chip that includes a first multilayer interconnect layer and a first inductor formed in said first multilayer interconnect layer; and

    a second semiconductor chip that includes a second multilayer interconnect layer and a second inductor formed in said second multilayer interconnect layer,wherein said first semiconductor chip and said second semiconductor chip are overlapped with each other in a direction in which said first multilayer interconnect layer and said second multilayer interconnect layer are opposed to each other,said first inductor and said second inductor are overlapped when seen in a plan view,said first semiconductor chip and said second semiconductor chip include non-opposed areas which are not opposed to each other,said first multilayer interconnect layer includes a first external connection terminal in said non-opposed area, andsaid second multilayer interconnect layer includes a second external connection terminal in said non-opposed area.

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