Thermal Management of a Lighting System

• US 20110050100A1
• Filed: 08/27/2010
• Published: 03/03/2011
• Est. Priority Date: 08/28/2009
• Status: Abandoned Application

• Current Assignee: Firefly LED Lighting Inc.
• Original Assignee: Firefly LED Lighting Inc.
• Inventors: Kernion, William J., Bailey, Joel Brad, Barcik, Stephen J.
• Application Number:
  US12/869,970
• Publication Number:
  US 20110050100A1
• Time in Patent Office: Days
• US Class Current: 315/35
• CPC Class Codes: B29C 48/92 Measuring, controlling or regulating
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 19/0055 by screwing
• CPC Class Codes: F21V 19/04 with provision for changing light source, e.g. turret auxiliary devices for cleaning, placing, or removing incandescent lamps H01K3/32, fluorescent lamps H01J9/006
• CPC Class Codes: F21V 23/0442 activated by means of a sensor, e.g. motion or photodetectors
• CPC Class Codes: F21V 23/0457 the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
• CPC Class Codes: F21V 29/54 using thermoelectric means, e.g. Peltier elements
• CPC Class Codes: F21V 29/673 the fans being used for intake
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21V 29/81 with pins or wires having different shapes, lengths or spacing
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2105/00 Planar light sources
• CPC Class Codes: F21Y 2107/20 on convex supports or substrates, e.g. on the outer surface of spheres
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F21Y 2115/15 : Organic light-emitting diodes [OLED]

Abstract

A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.

Claims

1. A thermal management lighting system, comprising:

a replaceable illumination module, comprising;

one or more solid state lighting elements; and

a printed circuit board, electrically and thermally connected to the one or more solid state lighting elements, wherein the printed circuit board comprises or is connected to a thermal spreading element; and

a base module, wherein the replaceable illumination module is removably coupled to the base module, wherein the base module comprises a heat sink, wherein the heat sink is in thermal contact with the replaceable illumination module via the thermal spreading element, wherein the heat sink dissipates heat generated by the one or more solid state lighting elements during operation.

2. The thermal management lighting system of claim 1, further comprising:

a cover cap affixed to the printed circuit board, wherein the cover cap protects the one or more solid state lighting elements and the circuit board from environmental intrusions and diffuses light from the one or more solid state lighting elements.

3. The thermal management lighting system of claim 2, wherein at least a portion of the cover cap is made of a smart material to block moisture and while supporting convective heat transfer, wherein the smart material comprises one or more of:

a thermally conductive material with thermal conductivity of at least approximately 0.9 W/m-K ;

or

a porous material with a pore density of at least approximately 10⁷ pores/cm².

4. The thermal management lighting system of claim 1, wherein the thermal spreading element is held in thermal contact with the heat sink via a fastening means that maintains a specified interfacial force between the thermal spreading element and the heat sink.

5. The thermal management lighting system of claim 1, further comprising:

a flow baffle, wherein the flow baffle encircles the heat sink and is configured to utilize a temperature differential to promote convective heat transfer away from the heat sink.

6. The thermal management lighting system of claim 1, wherein the heat sink comprises:

at least one extrusion;

wherein the at least one extrusion comprises a plurality of heat fins;

wherein the plurality of heat fins is made of a material with a thermal conductivity of at least approximately 180 W/m-K;

wherein each heat fin comprises a specified nonzero curvature; and

wherein the plurality of heat fins forms a plurality of air flow channels for convectively dissipating heat.

7. The thermal management lighting system of claim 6, wherein the at least one extrusion comprises:

a plurality of stacked extrusions, wherein each stacked extrusion has a respective radius, wherein the plurality of stacked extrusions are ordered in accordance with their respective radii to form a stepwise tapered heat sink.

8. The thermal management lighting system of claim 7, wherein the heat fins of at least one of the plurality of stacked extrusion are not aligned with corresponding heat fins of at least one adjacent stacked extrusion.

9. The thermal management lighting system of claim 6, wherein the at least one extrusion comprises a tapered extrusion.

10. The thermal management lighting system of claim 1, further comprising:

a base connector mechanically coupled to but electrically isolated from the heat sink, wherein the base connector is configured to receive power from a lighting socket during operation; and

a driver circuit coupled to or comprised in the printed circuit board or the base module, wherein the driver circuit is configured to receive power from the base connector and provide the power to the one or more solid state lighting elements via the printed circuit board.

11. The thermal management lighting system of claim 10, wherein the driver circuit comprises a DC driver circuit to convert and modulate AC line voltage for operation of the one or more solid state lighting elements.

12. The thermal management lighting system of claim 11, wherein the DC driver circuit scales current output or voltage output according to AC input voltage.

13. The thermal management lighting system of claim 11, wherein the DC driver circuit converts power of incoming AC power to provide intensity control via pulse width modulation (PWM).

14. The thermal management lighting system of claim 13, wherein the PWM is scaled by a function of AC input voltage or alternate control input.

15. The thermal management lighting system of claim 10, wherein the driver circuit is an AC driver circuit.

16. The thermal management lighting system of claim 15, wherein the AC driver circuit comprises:

a diode rectifier to directly drive the one or more solid state lighting elements, wherein each of the one or more solid state lighting elements comprises a single or multiple junction solid state lighting element.

17. The thermal management lighting system of claim 1, wherein the one or more solid state lighting elements comprise one or more of:

one or more AC solid state lighting elements;

or one or more DC solid state lighting elements.

18. The thermal management lighting system of claim 1, further comprising:

a wavelength sensor component for modulating color temperature output from the replaceable illumination module, wherein the wavelength sensor component is comprised in or electrically coupled to the replaceable illumination module.

19. The thermal management lighting system of claim 1, further comprising:

an intensity sensor component for modulating light intensity output from the replaceable illumination module, wherein the intensity sensor component is comprised in or electrically coupled to the replaceable illumination module.

20. The thermal management lighting system of claim 1, further comprising an active cooling element coupled to or comprised in the replaceable illumination module, wherein the active cooling element comprises one or more of:

a thermoelectric cooler;

a phase-change device;

a fan;

a piezoelectric fan;

a voice coil based flipper fan;

a synthetic jet cooler;

or

an acoustically-driven cooler.

21. The thermal management lighting system of claim 1, further comprising:

a passive cooling element coupled to or comprised in the replaceable illumination module, wherein the passive cooling element comprises one or more of;

a heat pipe;

a Venturi effect device;

or

a convective flow device.

22. The thermal management lighting system of claim 1, further comprising:

at least one temperature sensor comprised in or coupled to the replaceable illumination module or the heat sink, wherein the temperature sensor is configured for use in sensing, feedback, and control of temperature in the replaceable illumination module.

23. The thermal management lighting system of claim 1, further comprising:

at least one sensor, comprised in or coupled to the replaceable illumination module or the heat sink, wherein the at least one sensor is configured to couple to an automated control network for regulation of color output, light-intensity output, or temperature in the replaceable illumination module by the automated control network.

24. The thermal management lighting system of claim 23, wherein the at least one sensor is configured to wirelessly couple to the automated control network.

25. The thermal management lighting system of claim 1, wherein the one or more solid state lighting elements comprise one or more of:

a direct current light emitting diode;

an alternating current light emitting diode;

a multicolor light emitting diode;

a solid state light source;

an organic light emitting diode;

or

a flexible-circuit light emitting diode.

26. A method, comprising:

providing a lighting device, wherein the lighting device comprises;

a first replaceable illumination module, comprising;

one or more solid state lighting elements; and

a printed circuit board, electrically and thermally connected to the one or more solid state lighting elements, wherein the printed circuit board comprises or is connected to a thermal spreading element; and

a base module, comprising a heat sink thermally connected to the first replaceable illumination module via the thermal spreading element, wherein the heat sink dissipates heat generated by the one or more solid state lighting elements during operation;

removing the first replaceable illumination module from the lighting device, including detaching the first replaceable illumination module from the base module; and

installing a second replaceable illumination module in the lighting device, including attaching the second replacement illumination module to the base module, wherein, after said installing the second replaceable illumination module, the lighting device is configured to provide illumination using the second replacement illumination module.

27. A method, comprising:

removing a lighting device from a lighting socket, wherein the lighting device comprises a first replaceable illumination module and a base module coupled to the first replaceable illumination module, wherein the base module comprises a heat sink, wherein the base module further comprises a base connector for coupling to the lighting socket;

removing the first replaceable illumination module from the base module;

connecting a second replaceable illumination module to the base module;

after said connecting the second replaceable illumination module to the base module, installing the lighting device into the lighting socket;

wherein the light device is configured to provide illumination using the second replaceable illumination module.

28. A method, comprising:

providing a lighting device in a lighting socket, wherein the lighting device comprises a first replaceable illumination module and a base module coupled to the first replaceable illumination module, wherein the base module comprises a heat sink, wherein the base module further comprises a base connector coupled to the lighting socket;

removing the first replaceable illumination module, wherein the base module remains connected to the lighting socket after said removing;

connecting a second replaceable illumination module to the base module after said removing;

after said connecting the second replaceable illumination module to the base module, wherein the lighting device is configured to provide illumination using the second replaceable illumination module.