Replaceable Illumination Module
First Claim
1. A replaceable illumination module, comprising:
- one or more solid state lighting elements;
one or more beam conditioning optical elements proximate to the one or more solid state lighting elements, wherein the one or more beam conditioning optical elements are configured to modify light output from the one or more solid state lighting elements to produce a specified beam;
a printed circuit board, electrically and thermally connected to the one or more solid state lighting elements;
a thermal spreading element comprised in or coupled to the printed circuit board, wherein the thermal spreading element is configured to dissipate heat from the one or more solid state lighting elements; and
a connector coupled to the thermal spreading element, wherein the connector is configured to removably couple the replaceable illumination module to a base module that comprises a heat sink, wherein the connector electrically couples the base module to the replaceable illumination module.
1 Assignment
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Accused Products
Abstract
A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.
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Citations
20 Claims
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1. A replaceable illumination module, comprising:
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one or more solid state lighting elements; one or more beam conditioning optical elements proximate to the one or more solid state lighting elements, wherein the one or more beam conditioning optical elements are configured to modify light output from the one or more solid state lighting elements to produce a specified beam; a printed circuit board, electrically and thermally connected to the one or more solid state lighting elements; a thermal spreading element comprised in or coupled to the printed circuit board, wherein the thermal spreading element is configured to dissipate heat from the one or more solid state lighting elements; and a connector coupled to the thermal spreading element, wherein the connector is configured to removably couple the replaceable illumination module to a base module that comprises a heat sink, wherein the connector electrically couples the base module to the replaceable illumination module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for operation of a replaceable illumination module, comprising:
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receiving power to an electrical connector of the replaceable illumination module from an external power source; providing power to a printed circuit board of the replaceable illumination module via the connector, wherein the printed circuit board connects to one or more solid state lighting elements of the replaceable illumination module, and wherein the circuit board comprises or is connected to a thermal spreading element, wherein the thermal spreading element comprises an interface surface for thermally connecting to a heat sink; providing power via the printed circuit board to the one or more solid state lighting elements; emitting light via the one or more solid state lighting elements, wherein the one or more solid state lighting elements further produce heat; transforming at least a portion of the emitted light from the one or more solid state lighting elements via one or more beam conditioning optical elements comprised in the replaceable illumination module; and conducting heat from the one or more solid state lighting elements via the thermal spreading element to the heat sink via the interface surface. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification