PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT

• US 20110051384A1
• Filed: 02/02/2007
• Published: 03/03/2011
• Est. Priority Date: 02/02/2006
• Status: Abandoned Application

• Current Assignee: Arno Kriechbaum, Johannes Stahr, Sabine Liebfahrt, Wolfgang Bauer
• Original Assignee: Arno Kriechbaum, Johannes Stahr, Sabine Liebfahrt, Wolfgang Bauer
• Inventors: Bauer, Wolfgang, Liebfahrt, Sabine, Stahr, Johannes, Kriechbaum, Arno
• Application Number:
  US12/162,016
• Publication Number:
  US 20110051384A1
• Time in Patent Office: Days
• US Class Current: 361/762
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/274 by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 2224/27436 Lamination of a preform, e.g. foil, sheet or layer
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/92 Specific sequence of method steps
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/12033 : Gunn diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2203/0191 : Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/4652 : Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence

Abstract

A printed circuit board element (1) comprising at least one component (2) embedded between a base (4) and a cover layer (6), which component (2) is adhered to the base (4) by means of an adhesive film section (3).

Claims

1. A printed circuit board element (1) comprising at least one prefabricated electric or electronic component (2), in particu-lar a chip, embedded between a base (4) and a cover layer (6), characterised in that the component (2) is adhered to the base (4) by means of an adhesive film section (3).

2. The printed circuit board element according to claim 1, characterised in that the component (2) is a thinned component.

3. The printed circuit board element according to claim 2, characterised in that the thinned component (2) has a thickness of from 10 μ

m to 70 μ

m, in particular approximately 50 μ

m.

4. The printed circuit board element according to claim 1, characterised in that the adhesive film section (3) has a thickness in the order of 10 μ

m, approximately 12 μ

m, e.g.

5. The printed circuit board element according to claim 1, characterised in that the adhesive film section (3) is thermo-setting.

6. The printed circuit board element according to claim 1, characterised in that the component (2) is contacted through the cover layer (6) including a synthetic resin layer.

7. The printed circuit board element according to claim 6, characterised in that metallized laser bores (8) are provided in the cover layer (6) for contacting the component (2).

8. A method for embedding at least one electric or electronic component (2), in particular a chip, in a printed circuit board element (1), wherein the component (2) is adhered to a base (4), whereupon a cover layer (6) is applied on top of the base (4) together with the component (2) by pressure, characterised in that the component (2) is adhered to the base (4) by means of an adhesive film section (3).

9. The method according to claim 8, characterised in that the adhesive film section (3) is separately applied to the base (4) prior to application of the component (2).

10. The method according to claim 9, characterised in that the adhesive film section (3) is pressed and pre-cured during its attachment.

11. The method according to claim 10, characterised in that the adhesive film section (3) is positioned and pressed on as well as, preferably, pre-cured by means of a positioning and pressing tool (17).

12. The method according to claim 11, characterised in that the positioning and pressing tool (17) is heated.

13. The method according to claim 10, characterised in that the adhesive film section (3), after having been positioned on the base (4), is pressed thereto, the base (4) being heated from the other side.

14. The method according to claim 13, characterised in that the component is additionally heated.

15. The method according to claim 9, characterised in that an adhesive film section (3) with cover films (3d, 3e) provided on both sides is used, and before application on the base (4), the one, lower cover film (3d) is pulled off, whereas the other, upper cover film (3e) is pulled off only after the attachment of the adhesive film section (3) and prior to the attachment of the component (2).

16. The method according to claim 8, characterised in that the adhesive film section (3) is previously adhered to the component (2) to its side facing the base (4), and is applied to the base (4) together with the component (2).

17. The method according to claim 16, characterised in that an adhesive film (19) is previously attached to a wafer (18) containing a plurality of components (2), whereupon the components (2) together with adhesive film sections (3) are separated from each other and are each attached to the associated base (4).

18. The method according to claim 8, characterised in that a strip-shaped adhesive film (19) is used from which the individual adhesive film sections (3) are separated, e.g. by cutting or by punching.

19. The method according to claim 8, characterised in that the base (4) together with the component (2) glued thereto is heated for a complete curing of the adhesive of the adhesive film section (3).

20. The method according to claim 19, characterised in that complete curing of the adhesive is carried out in a reactive at-mosphere.

21. The method according to claim 19, characterised in that complete curing of the adhesive is carried out in an inert atmosphere.

22. The method according to claim 19 of 21, characterised in that complete curing of the adhesive is carried out in a nitro-gen atmosphere.