NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
First Claim
1. A nonvolatile semiconductor memory device comprising:
- a memory unit; and
a control unit,the memory unit including a first memory string, a first wiring, a second memory string, and a second wiring,the first memory string including a first memory cell group and a first select transistor,the first memory cell group including a plurality of first memory transistors connected in series,each of the plurality of first memory transistors including a channel formed in a first semiconductor layer, including a first control gate, and allowing data of the each of the plurality of first memory transistors to be electrically rewritten,the first select transistor being provided on one end side of the first memory cell group, including a channel formed in the first semiconductor layer, and including a first select gate,the first wiring being connected to the first semiconductor layer on a side of the first select transistor opposite to the first memory cell group,the second memory string including a second memory cell group and a second select transistor,the second memory cell group including a plurality of second memory transistors connected in series,each of the plurality of second memory transistors including a channel formed in a second semiconductor layer electrically isolated from the first semiconductor layer, including a control gate electrically connected to the first control gate, and allowing data of the each of the plurality of second memory transistors to be electrically rewritten,the second select transistor being provided on one end side of the second memory cell group, including a channel formed in the second semiconductor layer, and including a select gate connected to the first select gate,the second wiring being connected to the second semiconductor layer on a side of the second select transistor opposite to the second memory cell group,in a selective erase operation for performing at least one of injection of a hole into a charge retention layer of a selected cell transistor in the selective erase operation of the first memory transistors and extraction of an electron from the charge retention layer of the selected cell transistor in the selective erase operation, the control unit being configured to;
apply a first voltage to the first wiring,apply a second voltage lower than the first voltage to a selected cell gate of the first control gate of the selected cell transistor in the selective erase operation,apply a third voltage not higher than the first voltage and higher than the second voltage to a non-selected cell gate in the selective erase operation of the first control gate of the first memory transistors other than the selected cell transistor in the selective erase operation,apply the first voltage or a fourth voltage not higher than the first voltage and not lower than the third voltage to the first select gate, andapply the second voltage or a fifth voltage higher than the second voltage and not higher than the third voltage to the second wiring or set the second wiring in a floating state.
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Accused Products
Abstract
A nonvolatile semiconductor memory device includes: a memory unit; and a control unit. The memory unit includes: first and second memory strings including first and second memory transistors with first and second select gates, respectively; and first and second wirings connected thereto. In a selective erase operation of a selected cell transistor of the first memory transistors, the control unit applies V1 voltage to the first wiring, applies V2 voltage lower than V1 to a selected cell gate of the selected cell transistor, applies V3 voltage not higher than V1 and higher than V2 to a non-selected cell gate of the first memory transistors, applies V1 or V4 voltage not higher than V1 and not lower than V3 to the first select gate, and applies V2 or V4 voltage higher than V2 and not higher than V3 to the second wiring or sets the second wiring in a floating state.
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Citations
20 Claims
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1. A nonvolatile semiconductor memory device comprising:
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a memory unit; and a control unit, the memory unit including a first memory string, a first wiring, a second memory string, and a second wiring, the first memory string including a first memory cell group and a first select transistor, the first memory cell group including a plurality of first memory transistors connected in series, each of the plurality of first memory transistors including a channel formed in a first semiconductor layer, including a first control gate, and allowing data of the each of the plurality of first memory transistors to be electrically rewritten, the first select transistor being provided on one end side of the first memory cell group, including a channel formed in the first semiconductor layer, and including a first select gate, the first wiring being connected to the first semiconductor layer on a side of the first select transistor opposite to the first memory cell group, the second memory string including a second memory cell group and a second select transistor, the second memory cell group including a plurality of second memory transistors connected in series, each of the plurality of second memory transistors including a channel formed in a second semiconductor layer electrically isolated from the first semiconductor layer, including a control gate electrically connected to the first control gate, and allowing data of the each of the plurality of second memory transistors to be electrically rewritten, the second select transistor being provided on one end side of the second memory cell group, including a channel formed in the second semiconductor layer, and including a select gate connected to the first select gate, the second wiring being connected to the second semiconductor layer on a side of the second select transistor opposite to the second memory cell group, in a selective erase operation for performing at least one of injection of a hole into a charge retention layer of a selected cell transistor in the selective erase operation of the first memory transistors and extraction of an electron from the charge retention layer of the selected cell transistor in the selective erase operation, the control unit being configured to; apply a first voltage to the first wiring, apply a second voltage lower than the first voltage to a selected cell gate of the first control gate of the selected cell transistor in the selective erase operation, apply a third voltage not higher than the first voltage and higher than the second voltage to a non-selected cell gate in the selective erase operation of the first control gate of the first memory transistors other than the selected cell transistor in the selective erase operation, apply the first voltage or a fourth voltage not higher than the first voltage and not lower than the third voltage to the first select gate, and apply the second voltage or a fifth voltage higher than the second voltage and not higher than the third voltage to the second wiring or set the second wiring in a floating state. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A nonvolatile semiconductor memory device comprising:
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a memory unit; and a control unit, the memory unit including a first memory string, a first wiring, a first other wiring, and a first base wiring, the first memory string including a first memory cell group, a first other memory cell group, a first select transistor, a first other select transistor, and a first connecting portion transistor, the first memory cell group including a plurality of first memory transistors connected in series, each of the plurality of first memory transistors including a channel formed in a first semiconductor layer provided in contact with a first base semiconductor layer, including a first control gate, and allowing data of the each of the plurality of first memory transistors to be electrically rewritten, the first select transistor being provided on one end side of the first memory cell group, including a channel formed in the first semiconductor layer, and including a first select gate, the first other select transistor being provided on a side of the first memory cell group opposite to the first select transistor, including a channel formed in the first semiconductor layer, and including a first other select gate, the first connecting portion transistor being provided between the first memory cell group and the first other select transistor, including a channel formed in the first semiconductor layer, and including a first connecting portion gate, the first other memory cell group being provided between the first other select transistor and the first connecting portion transistor and including a plurality of first other memory transistors connected in series, each of the plurality of first other memory transistors including a channel formed in the first semiconductor layer, including a first other control gate, and allowing data of the each of the plurality of first other memory transistors to be electrically rewritten, the first wiring being connected to the first semiconductor layer on a side of the first select transistor opposite to the first memory cell group, the first other wiring being connected to the first semiconductor layer on a side of the first other select transistor opposite to the first other memory cell group, the first base wiring being connected to the first base semiconductor layer, in a selective erase operation for performing at least one of injection of a hole into a charge retention layer of a selected cell transistor in the selective erase operation of the first memory transistors and extraction of an electron from the charge retention layer of the selected cell transistor in the selective erase operation, the control unit being configured to; apply a first voltage to the first wiring and the first other wiring or set the first wiring and the first other wiring in a floating state, apply a second voltage lower than the first voltage to a selected cell gate of the first control gate of the selected cell transistor in the selective erase operation, apply a third voltage lower than the first voltage and higher than the second voltage to a non-selected cell gate in the selective erase operation of the first control gate of the first memory transistors other than the selected cell transistor in the selective erase operation, apply the third voltage to the first other control gate, apply a tenth voltage lower than the first voltage and higher than the second voltage to the first select gate and the first other select gate, apply an eleventh voltage lower than the first voltage and higher than the second voltage to the first connecting portion gate, and apply the first voltage to the first base wiring. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification