METHOD AND SYSTEM FOR DEPOSITING A METAL OR METALLOID ON CARBON NANOTUBES

• US 20110052805A1
• Filed: 02/20/2009
• Published: 03/03/2011
• Est. Priority Date: 03/11/2008
• Status: Abandoned Application

• Current Assignee: Arkema France (Arkema)
• Original Assignee: Arkema France (Arkema)
• Inventors: Voiry, Damien, Bordere, Serge, Gaillard, Patrice, Cochard, Daniel, Dutilh, Eric
• Application Number:
  US12/920,347
• Publication Number:
  US 20110052805A1
• Time in Patent Office: Days
• US Class Current: 427/217
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C01B 32/168 After-treatment
• CPC Class Codes: C23C 16/18 from metallo-organic compounds
• CPC Class Codes: C23C 16/24 Deposition of silicon only
• CPC Class Codes: C23C 16/325 Silicon carbide
• CPC Class Codes: C23C 16/4417 Methods specially adapted for coating powder
• CPC Class Codes: C23C 16/442 using fluidised bed process

Abstract

The invention relates to a method and a system for depositing a metal or a metalloid on carbon nanotubes (NTC). The method of the invention comprises homogenising an NTC powder in a reactor, and depositing said metal or metalloid on the homogenised NTC powder using a chemical vapor deposition technique implemented inside the reactor from a precursor comprising an alkyl of said metal or metalloid. The method can be used for the production of nanostructured SiC at the surface of the NTC by Si deposition on said NTC.

Claims

1. A process for depositing a metal or metalloid onto carbon nanotubes (CNTs), characterized in that it comprises:

homogenizing a CNT powder in a reactor,

depositing on homogeneous CNT powder metal, chosen from tin, aluminum or copper, or metalloid, chosen from silicon, boron or germanium;

by means of a vapor deposition carried out inside the reactor, at atmospheric pressure and at a temperature below 1000°

C., starting from a precursor formed from an alkyl of the metal or metalloid injected into the reactor in the form of gas.

2. The process as claimed in claim 1, characterized in that the homogeneous CNT powder is obtained by placing the CNTs in a fluidized bed in a reactor while injecting a gas into this reactor.

3. The process as claimed in claim 2, further comprising converting the precursor in the liquid state to the vapor phase by heating and injecting the precursor into the reactor in the form of gas.

4. The process as claimed in claim 1, further comprising introducing the CNTs into the reactor cold, injecting gas to purge the CNTs, placing them in a fluidized bed and thus forming a homogeneous powder, heating the reactor to a predefined temperature of less than 1000°

C., injecting the precursor into the reactor whereby the precursor decomposes at the surface of the CNTs.

5. The process as claimed in claim 4, characterized in that the gas to purge the CNTs is an inert gas, and, when the predefined temperature is reached, the purging with the inert gas is stopped and hydrogen gas is injected.

6. The process as claimed in claim 1, characterized in that the CNTs are introduced into the reactor in a measured amount for batchwise production or continuously for continuous production.

7. The process as claimed in claim 1, characterized in that the precursor is tetramethylsilane (TMS) and silicon is deposited on the CNTs.

8. The process as claimed in claim 7, characterized in that tetramethylsilane (TMS) in vapor form is conveyed by a stream of hydrogen.

9. The process as claimed in claim 1, characterized in that the precursor is trimethylboron or triethylboron and boron is deposited on the CNTs.

14. The process as claimed in claim 1, characterized in that the precursor is trimethylboron or triethylboron and boron is deposited on the CNTs.

15. The process as claimed in claim 1, characterized in that the precursor is diethylgermanium or tetraethylgermanium and germanium is deposited on the CNTs.

16. The process as claimed in claim 1, characterized in that the precursor is trimethylaluminum and aluminum is deposited on the CNTs.

17. The process as claimed in claim 1, characterized in that the precursor is copper acetylacetonate or copper hexafluoroacetylacetonate-2-methyl-2-hexen-3-yne and copper is deposited on the CNTs.

18. The process as claimed in claim 1, characterized in that the precursor is tetramethyltin and tin is deposited on the CNTs

10-13. -13. (canceled)