WIRELESS PROCESS COMMUNICATION ADAPTER WITH IMPROVED ENCAPSULATION
First Claim
1. A wireless process communication adapter for field devices, the adapter comprising:
- a metal housing having a first end and a second end and defining a chamber therebetween, the first end having an RF transparent radome coupled thereto, the second end having a field device coupling configured to attach to a field device;
at least one circuit board disposed within the chamber, the circuit board supporting at least wireless process communication circuitry;
a plurality of wires coupled to the at least one circuit board and extending through the field device coupling; and
a silicone potting filling substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry.
1 Assignment
0 Petitions
Accused Products
Abstract
A wireless process communication adapter for field devices is provided. The adapter includes a metal housing having a first end and a second end. A chamber is defined between the first and second ends. A radio-frequency transparent radome is coupled to the first end. The second end has a field device coupling configured to attach to a field device. At least one circuit board is disposed within the chamber. The circuit board supports at least wireless process communication circuitry. A plurality of wires is coupled to the at least one circuit board and extends through the field device coupling. A silicone potting fills substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry.
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Citations
15 Claims
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1. A wireless process communication adapter for field devices, the adapter comprising:
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a metal housing having a first end and a second end and defining a chamber therebetween, the first end having an RF transparent radome coupled thereto, the second end having a field device coupling configured to attach to a field device; at least one circuit board disposed within the chamber, the circuit board supporting at least wireless process communication circuitry; a plurality of wires coupled to the at least one circuit board and extending through the field device coupling; and a silicone potting filling substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of making a wireless process communication adapter, the method comprising:
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providing a metal housing, a radome, and a field device coupling; providing at least one circuit board having wireless communication circuitry; applying a mold release to internal surfaces of the housing; placing the at least one circuit board within the housing; affixing the field device coupling to the metal housing; coupling the radome to the metal housing; preparing a two-part silicone potting material; filling the housing with the two-part silicone material; and curing the two-part silicone. - View Dependent Claims (14, 15)
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Specification