WIRELESS PROCESS COMMUNICATION ADAPTER WITH IMPROVED ENCAPSULATION

• US 20110053526A1
• Filed: 08/27/2010
• Published: 03/03/2011
• Est. Priority Date: 06/16/2009
• Status: Active Grant

• Current Assignee: Rosemount Incorporated (Emerson Electric Company)
• Original Assignee: Rosemount Incorporated (Emerson Electric Company)
• Inventors: Strei, David Matthew, Vanderaa, Joel David
• Granted Patent: US 9,674,976 B2
• Time in Patent Office: Days
• US Class Current: 455/90.3
• CPC Class Codes: H05K 5/064 sealed by potting, e.g. waterproof resin poured in a rigid casing
• CPC Class Codes: H05K 7/1462 for programmable logic controllers [PLC] for automation or industrial process control

Abstract

A wireless process communication adapter for field devices is provided. The adapter includes a metal housing having a first end and a second end. A chamber is defined between the first and second ends. A radio-frequency transparent radome is coupled to the first end. The second end has a field device coupling configured to attach to a field device. At least one circuit board is disposed within the chamber. The circuit board supports at least wireless process communication circuitry. A plurality of wires is coupled to the at least one circuit board and extends through the field device coupling. A silicone potting fills substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry.

Claims

1. A wireless process communication adapter for field devices, the adapter comprising:

a metal housing having a first end and a second end and defining a chamber therebetween, the first end having an RF transparent radome coupled thereto, the second end having a field device coupling configured to attach to a field device;

at least one circuit board disposed within the chamber, the circuit board supporting at least wireless process communication circuitry;

a plurality of wires coupled to the at least one circuit board and extending through the field device coupling; and

a silicone potting filling substantially all volume within the chamber not occupied by the at least one circuit board and wireless process communication circuitry.

2. The adapter of claim 1, wherein the silicone potting is a two-part silicone potting.

3. The adapter of claim 1, and further comprising a mold-release applied to inner surfaces of the metal housing.

4. The adapter of claim 3, wherein the mold-release is a lecithin mold-release.

5. The adapter of claim 4, and further comprising a foam pad disposed between at least one electrical component on the at least one circuit board and the metal housing.

6. The adapter of claim 5, wherein the foam pad is constructed from polyethylene.

7. The adapter of claim 6, and further comprising a foam jacket surrounding the at least one electrical component.

8. The adapter of claim 1, and further comprising a foam pad disposed between at least one electrical component on the at least one circuit board and the metal housing.

9. The adapter of claim 8, wherein the foam pad is constructed from polyethylene.

10. The adapter of claim 9, and further comprising a foam jacket surrounding the at least one electrical component

11. The adapter of claim 9, wherein the silicone potting is cured at about 50 degrees Celsius.

12. The adapter of claim 1, wherein the silicone potting is cured at about 50 degrees Celsius.

13. A method of making a wireless process communication adapter, the method comprising:

providing a metal housing, a radome, and a field device coupling;

providing at least one circuit board having wireless communication circuitry;

applying a mold release to internal surfaces of the housing;

placing the at least one circuit board within the housing;

affixing the field device coupling to the metal housing;

coupling the radome to the metal housing;

preparing a two-part silicone potting material;

filling the housing with the two-part silicone material; and

curing the two-part silicone.

14. The method of claim 13, wherein curing the two-part silicone is performed at about 50 degrees Celsius.

15. A wireless process communication adapter made with the method of claim 13.