Micromechanical system

• US 20110056295A1
• Filed: 08/09/2010
• Published: 03/10/2011
• Est. Priority Date: 09/04/2009
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Classen, Johannes
• Granted Patent: US 8,689,633 B2
• Time in Patent Office: Days
• US Class Current: 73/514.32
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A micromechanical system includes a first movable element, which is connected to a substrate via a first spring element, and a second movable element, which is connected to the substrate via a second spring element. The first movable element and the second movable element are movable in relation to the substrate independent of one another. Furthermore, the first movable element and the second movable element are situated one above the other in at least some sections in a direction perpendicular to the substrate surface.

Claims

1. A micromechanical sensor, comprising:

a substrate;

a first movable element connected to the substrate by a first spring element; and

a second movable element connected to the substrate by a second spring element;

wherein the first movable element and the second movable element are independently movable in relation to the substrate, and wherein the first movable element and the second movable element are situated one above the other perpendicular to the substrate surface in at least some sections.

2. The micromechanical system as recited in claim 1, wherein the first movable element and the second movable element are electrically insulated from one another.

3. The micromechanical system as recited in claim 2, further comprising:

a detection device configured to detect at least one of a deflection of the first movable element and a deflection of the second movable element in relation to the substrate.

4. The micromechanical system as recited in claim 3, wherein:

The first movable element has a first electrically conductive electrode;

the detection device includes a first fixed electrode connected rigidly to the substrate;

the second movable element has a second electrically conductive electrode; and

The detection device includes a second fixed electrode rigidly connected to the substrate.

5. The micromechanical system as recited in claim 3, further comprising:

a third movable element connected to the substrate by a third spring element, wherein the third movable element is movable in relation to the substrate independent of the first movable element and the second movable element, and wherein the second movable element and the third movable element are situated one above the other perpendicular to the substrate surface in at least some sections.

6. A method for manufacturing a micromechanical system having a first movable element connected to a substrate by a first spring element, and a second movable element connected to the substrate by a second spring element, the first movable element and the second movable element being independently movable in relation to the substrate, the method comprising:

depositing and structuring a first insulation layer on the substrate;

depositing and structuring a first conductive layer;

depositing and structuring a second insulation layer;

depositing a second conductive layer and structuring the first movable element in the second conductive layer;

depositing and structuring a third insulation layer;

depositing a third conductive layer and structuring the second movable element in the third conductive layer, at least one section of the second movable element being situated above the first movable element in a direction perpendicular to the surface of the substrate; and

removing the second insulation layer beneath the first movable element and the third insulation layer beneath the second movable element.

7. The method as recited in claim 6, further comprising the following steps after depositing and structuring the third conductive layer:

depositing and structuring a fourth insulation layer;

depositing a fourth conductive layer and structuring a third movable element in the fourth conductive layer, at least one section of the third movable element being situated above the second movable element in a direction perpendicular to the surface of the substrate; and

removing the fourth insulation layer beneath the third movable element.