Package-on-Package (POP) Optical Proximity Sensor
First Claim
1. An optical proximity sensor, comprising:
- an infrared light emitter mounted atop a first substrate;
a light detector mounted atop a second substrate, andan integrated circuit mounted atop a third substrate and encapsulated by an overmolding material, the integrated circuit comprising light emitter driving and light detecting circuits, the third substrate further comprising at least first and second sets of wire bond pads electrically connected to the integrated circuit and not covered by the overmolding material;
wherein the first and second substrates are mounted atop the overmolding compound, the light emitter is electrically connected to the light emitter driving circuit through the first set of wire bond pads, the light detector is electrically connected to the light detecting circuit through the second set of wire bond pads, a first molded infrared light pass component is disposed over and covers the light emitter, a second molded infrared light pass component is disposed over and covers the light detector, and a molded infrared light cut component is disposed between and over portions of the third substrate and the first and second infrared light pass components.
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Accused Products
Abstract
Various embodiments of a package-on-package optical sensor comprising three distinct different packages are disclosed. The three different packages are combined to form the optical proximity sensor, where the first package is a light emitter package, the second package is a light detector package, and the third package is an integrated circuit package. First and second infrared light pass components are molded or casted atop the light emitter package and the light detector package after they have been mounted atop the integrated circuit package. An infrared light cut component is then molded or casted between and over portions of the light emitter package and the light detector package.
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Citations
22 Claims
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1. An optical proximity sensor, comprising:
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an infrared light emitter mounted atop a first substrate; a light detector mounted atop a second substrate, and an integrated circuit mounted atop a third substrate and encapsulated by an overmolding material, the integrated circuit comprising light emitter driving and light detecting circuits, the third substrate further comprising at least first and second sets of wire bond pads electrically connected to the integrated circuit and not covered by the overmolding material; wherein the first and second substrates are mounted atop the overmolding compound, the light emitter is electrically connected to the light emitter driving circuit through the first set of wire bond pads, the light detector is electrically connected to the light detecting circuit through the second set of wire bond pads, a first molded infrared light pass component is disposed over and covers the light emitter, a second molded infrared light pass component is disposed over and covers the light detector, and a molded infrared light cut component is disposed between and over portions of the third substrate and the first and second infrared light pass components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of making an optical proximity sensor, comprising:
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mounting an infrared light emitter atop a first substrate; mounting a light detector atop a second substrate; mounting an integrated circuit atop a third substrate comprising at least first and second sets of wire bond pads electrically connected to the integrated circuit, the integrated circuit comprising light emitter driving and light detecting circuits; at least partially encapsulating the integrated circuit with an overmolding material such that the wire bond pads are covered by the overmolding material; mounting the first and second substrates atop the overmolding compound; electrically connecting the light emitter to the light emitter driving circuit through the first set of wire bond pads; electrically connecting the light detector to the light detecting circuit through the second set of wire bond pads; molding or casting a first infrared light pass component the light emitter; molding or casting a second infrared light pass component over the light detector, and molding or casting an infrared light cut component between and over portions of the third substrate and the first and second infrared light pass components. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification