ULTRA HIGH SPEED SIGNAL TRANSMISSION/RECEPTON

• US 20110057291A1
• Filed: 05/08/2008
• Published: 03/10/2011
• Est. Priority Date: 05/08/2007
• Status: Active Grant

• Current Assignee: Scanimetrics, Inc.
• Original Assignee: Scanimetrics, Inc.
• Inventors: Slupsky, Steven, Sellathamby, Christopher V., Moore, Brian
• Granted Patent: US 8,362,587 B2
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: G08C 17/04 using magnetically coupled devices
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04B 5/26 using coils

Abstract

An interconnect for transmitting an electric signal between electronic devices includes a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element. The first coupling element is mounted on and is electrically connected to a first electronic device having a first integrated circuit. The second coupling element may be mounted on and electrically connected to the first electronic device, and electrically connected to an interconnect on a second electronic device, or the second coupling element may be mounted on and electrically connected to the second electronic device.

Claims

1-64. -64. (canceled)

65. An interconnect for transmitting an electric signal between electronic devices, comprising:

a first inductive coil inductively coupled to, and immediately juxtaposed to, a second inductive coil;

the first inductive coil being mounted on and electrically connected within a layer of a first integrated circuit in a first electronic device, and the second inductive coil being mounted on and electrically connected within a layer of a second integrated circuit in a second electronic device, each of the first electronic device and the second electronic device having a first face and a second face parallel to the layers of the first and second integrated circuits, the first face of the first electronic device being immediately adjacent to the first face of the second electronic device;

the first inductive coil and the second inductive coil being separated by a dielectric barrier;

at least one signal converter connected to at least one of the first inductive coil and the second inductive coil, the signal converter comprising one of a RF carrier wave modulator, a RF carrier wave demodulator, an ultra wide band pulse to digital modulator and an ultra wide band pulse to digital demodulator.

66. The interconnect of claim 65, wherein the dielectric barrier comprises at least one of a solid dielectric material and air.

67. The interconnect of claim 65, wherein the dielectric barrier comprises a shield component for shielding against external signals.

68. The interconnect of claim 65, wherein the first inductive coil is embedded in the corresponding electronic device.

69. The interconnect of claim 65, wherein the second inductive coil is recessed from the first face of the second electronic device.

70. The interconnect of claim 65, wherein at least one of the first inductive coil and the second inductive coil is monolithically formed in the corresponding electronic device.

71. The interconnect of claim 70, wherein the RF carrier is a continuous wave.

72. The interconnect of claim 65, wherein at least one of the first inductive coil and the second inductive coil are connected to a differential input or a differential output in the corresponding integrated circuit.

73. The interconnect of claim 65, further comprising a third inductive coil electromagnetically coupled to, and immediately juxtaposed to, a fourth inductive coil, the third inductive coil being electrically connected to the second inductive coil, such that the second and the third inductive coils are interstitial elements.

74. The interconnect of claim 65, wherein the first inductive coil and the second inductive coil are connected to components in the corresponding integrated circuit that permit bi-directional communication.

75. The interconnect of claim 65, wherein the first inductive coil and the second inductive coil are connected by a resistance of more than 100,000 ohms to provide DC restoration.

76. The interconnect of claim 65, wherein the integrated circuit of at least one of the electronic devices is positioned at least partially between the second face and the corresponding inductive coil.

77. The interconnect of claim 65, wherein the first electronic device and the second electronic device are mounted to a common substrate.

78. The interconnect of claim 65, wherein at least one of the first electronic device and the second electronic device are mounted to a movable substrate.

79. A method of transmitting an electric signal between a first electronic device and a second electronic device, comprising the steps of:

providing a first coupling element electrically connected to and embedded within the first electronic device;

providing a second coupling element electrically connected to and embedded within the second electronic device, the second coupling element being immediately juxtaposed to the first coupling element, the first coupling element and the second coupling element being separated by a dielectric barrier;

providing the first electronic device with a coupling device electrically connected to the first coupling element;

operating the coupling device to drive the first coupling element with one of a modulated RF carrier wave and an ultra-wideband pulse to electromagnetically couple the first coupling element and the second coupling element.

80. The method of claim 79, wherein the modulated RF carrier wave is a modulated continuous wave.

81. The method of claim 80, wherein the modulated RF carrier wave has a frequency, or the ultra-wideband pulse has a frequency content, sufficient to electromagnetically couple the first coupling element and the second coupling element with a coupling coefficient of at least 0.01.

82. The method of claim 80, wherein the modulated RF carrier wave has a frequency, or the ultra-wideband pulse has a frequency content, sufficient to electromagnetically couple the first coupling element and the second coupling element with a coupling coefficient of at least 0.1.

83. The method of claim 80, wherein the modulated RF carrier wave has a frequency, or the ultra-wideband pulse has a frequency content, sufficient to electromagnetically couple the first coupling element and the second coupling element with a coupling coefficient of at least 0.3.

84. The method of claim 80, wherein the coupling device is a signal converter.

85. The method of claim 80, wherein the coupling device is a modulator.

86. The method of claim 80, wherein the second electronic device comprises a coupling device electrically connected to the second coupling element, and the first coupling element and the second coupling elements are connected to components in the corresponding integrated circuit that permit bi-directional communication.

87. The method of claim 80, wherein at least one of the first coupling element and the second coupling element is monolithically formed on the corresponding electronic device.

88. The method of claim 80, wherein the dielectric barrier comprises at least one of a solid dielectric material or air.

89. The method of claim 80, wherein the dielectric barrier comprises a shield component for shielding against external signals.

90. The method of claim 80, wherein at least one of the first coupling element and the second coupling element is embedded in the corresponding electronic device.

91. The method of claim 80, wherein at least one of the first coupling element and the second coupling element are connected to a differential input or a differential output in the corresponding integrated circuit.

92. The method of claim 80, further comprising a third coupling element electromagnetically coupled to, and immediately juxtaposed to, a fourth coupling element, the third coupling element being electrically connected to the second coupling element, such that the second and the third coupling elements are interstitial elements.

93. The method of claim 80, wherein the first coupling element and the second coupling element are connected by a resistance of more than 100,000 ohms to provide DC restoration.

94. The method of claim 80, wherein the first electronic device and the second electronic device are mounted on a common substrate.

95. The method of claim 80, wherein at least one of the first electronic device and the second electronic device are mounted to a movable substrate.

96. The method of claim 95, further comprising the steps of:

moving the movable substrate such that at least one of the first coupling element and the second coupling element is immediately juxtaposed to an additional coupling element of an additional electronic device; and

electromagnetically coupling the at least one of the first coupling element and the second coupling element to the additional coupling element.

97. An interconnect for transmitting an electric signal between electronic devices, comprising:

a first coupling element electromagnetically coupled to, and immediately juxtaposed to, a second coupling element;

the first coupling element being embedded within and electrically connected to a first electronic device having a first integrated circuit, and the second coupling element being embedded within and electrically connected to a second electronic device having a second integrated circuit; and

a coupling device electrically connected to the first coupling element, the coupling device comprising one of a digital to ultra-wideband pulse converter and a RF modulator, such that in operation, the coupling device drives the first coupling element with one of an ultra-wideband pulse and a modulated RF signal to electromagnetically couple the first coupling element and the second coupling element.

98. The interconnect of claim 97, wherein the second electronic device comprises a coupling device electrically connected to the second coupling element, the coupling device comprising one of an ultra-wideband pulse to digital converter and a RF demodulator.

99. The interconnect of claim 98, wherein the coupling device of the first electronic device comprises a RF modulator and a RF demodulator, and the coupling device of the second electronic device comprises a RF modulator and a RF demodulator, such that the first coupling element and the second coupling elements permit bi-directional communication.

100. The interconnect of claim 98, wherein the coupling device of the first electronic device comprises a digital to ultra-wideband pulse converter and an ultra-wideband pulse to digital converter, and the coupling device of the second electronic device comprises a digital to ultra-wideband pulse converter and an ultra-wideband pulse to digital converter, such that the first coupling element and the second coupling elements permit bi-directional communication.

101. The interconnect of claim 97, wherein at least one of the first coupling element and the second coupling element is monolithically formed on the corresponding electronic device.

102. The interconnect of claim 97, wherein the dielectric barrier comprises at least one of a solid dielectric material or air.

103. The interconnect of claim 97, wherein the dielectric barrier comprises a shield component for shielding against external signals.

104. The interconnect of claim 97, wherein at least one of the first coupling element and the second coupling element is embedded in the corresponding electronic device.

105. The interconnect of claim 97, wherein at least one of the first coupling element and the second coupling element are connected to a differential input or a differential output in the corresponding integrated circuit.

106. The interconnect of claim 97, further comprising a third coupling element electromagnetically coupled to, and immediately juxtaposed to, a fourth coupling element, the third coupling element being electrically connected to the second coupling element, such that the second and the third coupling elements are interstitial elements.

107. The interconnect of claim 97, wherein the first coupling element and the second coupling element are connected by a resistance of more than 100,000 ohms to provide DC restoration.

108. The interconnect of claim 97, wherein the integrated circuit of at least one of the electronic devices is positioned at least partially between the second face and the corresponding coupling element.

109. The interconnect of claim 97, further comprising more than one additional electronic devices, each additional electronic device comprising a third coupling element and a fourth coupling element, the fourth coupling element being electrically connected to an integrated circuit of the second electronic device, the third coupling element being immediately juxtaposed to the fourth coupling element, the third coupling element and the fourth coupling element being separated by a dielectric barrier, the second coupling element of the first electronic device being electrically connected to more than one third coupling element.

110. A method of transmitting an electrical signal between a first electronic device and a second electronic device, each electronic device having an integrated circuit, the method comprising the steps of:

providing a first coupling element and a second coupling element on the first electronic device, the first coupling element being electrically connected to the integrated circuit of the first electronic device, the first coupling element being immediately juxtaposed to the second coupling element, the first coupling element and the second coupling element being separated by a dielectric barrier;

providing a third coupling element and a fourth coupling element on the second electronic device, the fourth coupling element being electrically connected to the integrated circuit of the second electronic device, the third coupling element being immediately juxtaposed to the fourth coupling element, the third coupling element and the fourth coupling element being separated by a dielectric barrier, the third coupling element being electrically connected to the second coupling element;

providing the integrated circuit of the first electronic device with a coupling device electrically connected to the first coupling element;

driving the first coupling element with the coupling device such that an ultra-wideband pulse is electromagnetically coupled from the first coupling element to the second coupling element, electrically coupled from the second coupling element to the third coupling element, and electromagnetically coupled from the third coupling element to the fourth coupling element.

111. The method of claim 110, wherein the coupling device of the first electronic device comprises a digital to ultra-wideband pulse signal converter or an RF carrier wave modulator.

112. The method of claim 111, wherein the second electronic device comprises a coupling device comprising an ultra-wideband pulse signal to digital converter or an RF carrier wave demodulator.

113. The method of claim 112, wherein the coupling device of the first electronic device comprises a digital to ultra-wideband pulse converter and an ultra-wideband pulse to digital converter or a RF carrier wave modulator and a RF carrier wave demodulator, and the coupling element of the second electronic device comprises a digital to ultra-wideband pulse converter and an ultra-wideband pulse to digital converter or a RF carrier wave modulator and a RF carrier wave demodulator, such that the first coupling element and the second coupling elements permit bi-directional communication.

114. The method of claim 110, wherein the second electronic device comprises a coupling device electrically connected to the fourth coupling element, and each of the first coupling element and the fourth coupling element are connected to components in the corresponding integrated circuits that permit bi-directional communication.

115. The method of claim 110, wherein at least one of the coupling elements is monolithically formed on the corresponding electronic device.

116. The method of claim 110, wherein the dielectric barrier comprises a solid dielectric material or air.

117. The method of claim 110, wherein the dielectric barrier comprises a shield component for shielding against external signals.

118. The method of claim 110, wherein at least one of the first coupling element and the fourth coupling element are connected to a differential input or a differential output in the corresponding integrated circuit.

119. The method of claim 110, further comprising more than one second electronic device, the second coupling element of the first electronic device being electrically connected to more than one third coupling element.

120. An interconnect for transmitting an electrical signal between a first electronic device and a second electronic device, each electronic device having an integrated circuit, the interconnect comprising:

a first coupling element and a second coupling element on the first electronic device, the first coupling element being electrically connected to the integrated circuit of the first electronic device, the first coupling element being immediately juxtaposed to the second coupling element, the first coupling element and the second coupling element being separated by a dielectric barrier;

a third coupling element and a fourth coupling element on the second electronic device, the fourth coupling element being electrically connected to the integrated circuit of the second electronic device, the third coupling element being immediately juxtaposed to the fourth coupling element, the third coupling element and the fourth coupling element being separated by a dielectric barrier, the third coupling element being electrically connected to the second coupling element;

a coupling device comprising a digital to ultra-wideband pulse signal converter, the coupling device being electrically connected to the first coupling element, such that in operation, the coupling device drives the first coupling element with an ultra-wideband pulse or a modulated RF carrier wave to electromagnetically couple the first coupling element and the second coupling element.

121. The interconnect of claim 120, wherein the second electronic device comprises a coupling device, the coupling device comprising a digital to ultra-wideband pulse signal converter or a RF carrier wave modulator electrically connected to the fourth coupling element, and each of the first coupling element and the fourth coupling element are connected to components in the corresponding integrated circuits that permit bi-directional communication.

122. The interconnect of claim 120, wherein the second electronic device comprises a coupling device electrically connected to the fourth coupling element, the coupling device comprising an ultra-wideband pulse to digital converter or a RF carrier wave demodulator.

123. The interconnect of claim 122, wherein the coupling device of the first electronic device comprises a digital to ultra-wideband pulse converter and an ultra-wideband pulse to digital converter or a RF carrier wave modulator and a RF carrier wave demodulator, and the coupling device of the second electronic device comprises a digital to ultra-wideband pulse converter and an ultra-wideband pulse to digital converter or a RF carrier wave modulator and a RF carrier wave demodulator, such that the first coupling element and the second coupling elements permit bi-directional communication.

124. The interconnect of claim 120, wherein at least one of the coupling elements is monolithically formed on the corresponding electronic device.

125. The interconnect of claim 120, wherein the dielectric barrier comprises a solid dielectric material or air.

126. The interconnect of claim 120, wherein the dielectric barrier comprises a shield component for shielding against external signals.

127. The interconnect of claim 120, wherein at least one of the first coupling element and the fourth coupling element are connected to a differential input or a differential output in the corresponding integrated circuit.

128. The interconnect of claim 120, further comprising more than one second electronic device, the second coupling element of the first electronic device being electrically connected to more than one third coupling element.