PATCH ANTENNA WITH WIDE BANDWIDTH AT MILLIMETER WAVE BAND

• US 20110057853A1
• Filed: 12/08/2009
• Published: 03/10/2011
• Est. Priority Date: 09/08/2009
• Status: Active Grant

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Kim, Hae Cheon, KIM, Dong-Young
• Granted Patent: US 8,319,689 B2
• Time in Patent Office: Days
• US Class Current: 343/843
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0442 with particular tuning means

Abstract

Provided is a millimeter wave band patch antenna. The patch antenna includes a multi-layer substrate, at least one metal pattern layer, an antenna patch, a ground layer, and a plurality of vias. In the multi-layer substrate, a plurality of dielectric layers are stacked. The metal pattern layer is disposed between the dielectric layers except for a center region of the multi-layer substrate. The antenna patch is disposed on an upper surface of the multi-layer substrate in the center region. The ground layer is disposed on a lower surface of the multi-layer substrate opposing to the upper surface. The vias is disposed around the center region through the dielectric layers for electrically connecting the metal pattern layer to the ground layer. The center region, which is surrounded by the ground layer and the vias, functions as a resonator.

Claims

1. A patch antenna comprising:

a multi-layer substrate in which a plurality of dielectric layers are stacked;

at least one metal pattern layer disposed between the dielectric layers except for a center region of the multi-layer substrate;

an antenna patch disposed on a first surface of the multi-layer substrate in the center region of the multi-layer substrate;

a ground layer disposed on a second surface of the multi-layer substrate opposing to the first surface of the multi-layer substrate; and

a plurality of vias disposed around the center region through the dielectric layers for electrically connecting the metal pattern layer to the ground layer,

wherein the center region of the multi-layer substrate, surrounded by the ground layer and the vias, functions as a resonator.

2. The patch antenna of claim 1, wherein the vias are spaced from each other by a distance equal to or shorter than about half the wavelength of radiation of the antenna patch.

3. The patch antenna of claim 1, wherein the vias function as a metal wall suppressing leakage of a signal accumulated in the center region.

4. The patch antenna of claim 1, wherein the vias comprise at least one additional via disposed radially to the center region.

5. The patch antenna of claim 1, wherein transmission of surface waves is suppressed as a distance between the first surface of the multi-layer substrate and the ground layer is reduced owing to the vias.

6. The patch antenna of claim 1, wherein the center region is sized so that resonance occurs in a design frequency band.

7. The patch antenna of claim 6, wherein the center region surrounded by the vias acts as a dielectric resonator at the design frequency band.

8. The patch antenna of claim 1, wherein bandwidth of the patch antenna is widened according to coupling between the antenna patch and the center region.

9. The patch antenna of claim 1, further comprising a transmission line configured to supply a signal to the antenna patch.

10. The patch antenna of claim 9, further comprising additional vias disposed around a lower side of the transmission line.