IMAGE-CAPTURING MODULE FOR SIMPLIFYING OPTICAL COMPONENT

• US 20110058092A1
• Filed: 01/13/2010
• Published: 03/10/2011
• Est. Priority Date: 09/09/2009
• Status: Active Grant

• Current Assignee: Azurewave Technologies, Inc.
• Original Assignee: Azurewave Technologies, Inc.
• Inventors: Chen, Chih-Chien, HSU, Chi-Hsing
• Granted Patent: US 8,274,594 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: G06V 40/1324 by using geometrical optics, e.g. using prisms G06V40/1312 takes precedence
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An image-capturing module for simplifying optical component includes a first substrate unit, an image-capturing unit, an optical imaging unit, a second substrate unit, a light-emitting unit and a cover unit. The second substrate unit is disposed on the outer surface of the optical imaging unit and electrically connected to the first substrate unit. The light-emitting unit has a light-emitting element electrically disposed on the second substrate unit. The cover unit has a reflective layer formed on an inner surface thereof. Therefore, the light beams generated by the light-emitting element are reflected by the reflective layer to form first reflected light beams projected onto the object, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the optical imaging unit, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

Claims

1. An image-capturing module for simplifying optical component, comprising:

a first substrate unit;

an image-capturing unit having at least one image-capturing element electrically disposed on the first substrate unit;

an optical imaging unit disposed on the first substrate unit and covering the image-capturing unit, wherein the optical imaging unit has at least one insulative layer formed on an outer surface thereof;

a cover unit disposed on the first substrate unit and covering the optical imaging unit, wherein the cover unit has at least one inclined surface formed on an inner surface thereof and a light-transmitting element disposed on a top surface thereof and above the optical imaging unit, and an object is disposed on the light-transmitting element;

a second substrate unit disposed on the inclined surface of the cover unit and electrically connected to the first substrate unit; and

a light-emitting unit having at least one light-emitting element electrically disposed on the second substrate unit;

whereby, light beams generated by the at least one light-emitting element are reflected by the at least one reflective layer to form first reflected light beams projected onto the object on the light-transmitting element, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the light-condensing element, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

2. The image-capturing module according to claim 1, wherein the first substrate unit and the second substrate unit are printed circuit boards, and the image-capturing element is an image sensor.

3. The image-capturing module according to claim 1, wherein the light-emitting element is a light emitting diode.

4. The image-capturing module according to claim 1, wherein the reflective layer is a reflective element adhered to the inner surface of the cover unit or a reflective coated film coated on the inner surface of the cover unit.

5. An image-capturing module for simplifying optical component, comprising:

a substrate unit;

an image-capturing unit having at least one image-capturing element electrically disposed on the substrate unit;

an optical imaging unit disposed on the substrate unit and covering the image-capturing unit, wherein the optical imaging unit has at least one inclined surface formed on an outer surface thereof, and one end of the substrate is electrically disposed on the at least one inclined surface;

a light-emitting unit having at least one light-emitting element electrically disposed on the end of the substrate unit and above the at least one inclined surface; and

a cover unit disposed on the substrate unit and covering the optical imaging unit and the light-emitting unit, wherein the cover unit has at least one reflective layer formed on an inner surface thereof and a light-transmitting element disposed on a top surface thereof and above the optical imaging unit, and an object is disposed on the light-transmitting element;

whereby, light beams generated by the at least one light-emitting element are reflected by the at least one reflective layer to form first reflected light beams projected onto the object on the light-transmitting element, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the light-condensing element, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

6. The image-capturing module according to claim 5, wherein the substrate unit is a printed circuit board, and the image-capturing element is an image sensor.

7. The image-capturing module according to claim 5, wherein the light-emitting element is a light emitting diode.

8. The image-capturing module according to claim 5, wherein the reflective layer is a reflective element adhered to the inner surface of the cover unit or a reflective coated film coated on the inner surface of the cover unit.

9. An image-capturing module for simplifying optical component, comprising:

a substrate unit;

an image-capturing unit having at least one image-capturing element electrically disposed on the substrate unit;

an optical imaging unit disposed on the substrate unit and covering the image-capturing unit, wherein the optical imaging unit has at least one inclined surface formed on an outer surface thereof, and one end of the substrate is electrically disposed on the at least one inclined surface;

a light-emitting unit having at least one light-emitting element electrically disposed on the end of the substrate unit and above the at least one inclined surface; and

a cover unit disposed on the substrate unit and covering the optical imaging unit and the light-emitting unit, wherein the cover unit has a light-transmitting element disposed on a top surface thereof and above the optical imaging unit and an object is disposed on the light-transmitting element, and light beams generated by the at least one light-emitting element is projected directly onto the light-transmitting element;

whereby, the light beams are reflected by the object to form reflected light beams projected onto the optical imaging unit, and then the reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

10. The image-capturing module according to claim 9, wherein the substrate unit is a printed circuit board, and the image-capturing element is an image sensor.

11. The image-capturing module according to claim 9, wherein the light-emitting element is a light emitting diode.