PROTECTIVE DEVICE

• US 20110058295A1
• Filed: 09/03/2010
• Published: 03/10/2011
• Est. Priority Date: 09/04/2009
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chiang, Lang-Yi, Chen, Kuo-Shu, Lin, Hung-Ming, Wang, Chung-Hsiung, Luo, Wen-Shiang
• Granted Patent: US 8,472,158 B2
• Time in Patent Office: Days
• US Class Current: 361/79
• CPC Class Codes: H01H 2085/466 with remote controlled forced fusing
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/0047 Heating means
• CPC Class Codes: H01H 85/0065 Heat reflective or insulating layer on the fusible element
• CPC Class Codes: H01H 85/0411 Miniature fuses
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01H 85/048 Fuse resistors
• CPC Class Codes: H01H 85/11 with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
• CPC Class Codes: H02H 5/00 Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection using simulators of the apparatus being protected H02H6/00; specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems H02H7/00

Abstract

A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.

Claims

1. A protective device, comprising:

a substrate,

a conductive section supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes, wherein the metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes; and

a first auxiliary medium disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element, and

wherein the first auxiliary medium facilitates breaking of the metal element upon melting.

2. The protective device as in claim 1, further comprising a heat-generating element supported by the substrate, providing heat to at least the first auxiliary medium.

3. The protective device as in claim 2, wherein the heat-generating element is supported between the metal element and the substrate.

4. The protective device as in claim 2, wherein the heat-generating element is supported by a side of the substrate away from the metal element.

5. The protective device as in claim 1, further comprising an intermediate support disposed between the metal element and the substrate, wherein the first auxiliary medium is disposed on either side of the intermediate support.

6. The protective device as in claim 5, further comprising a first intermediate layer between the metal element and the intermediate support, wherein the first intermediate layer has a first fusing temperature lower than the melting temperature of the metal element.

7. The protective device as in claim 6, further comprising a second intermediate layer between the metal element and the first and second electrodes, wherein the second intermediate layer has a second fusing temperature higher than the first fusing temperature of the first intermediate layer.

8. The protective device as in claim 7, wherein the first intermediate layer comprises a first solder material having the first fusing temperature and the second intermediate layer comprises a second solder material having the second fusing temperature.

9. The protective device as in claim 5, further comprising a heat-generating element supported by the substrate, providing heat to at least the intermediate support.

10. The protective device as in claim 9, wherein the heat-generating element is supported between the metal element and the substrate.

11. The protective device as in claim 9, wherein the heat-generating element is supported by a side of the substrate away from the metal element.

12. The protective device as in claim 9, further comprising a heat insulation portion between the heating element and the first and second electrodes, wherein heat transfer to the intermediate support is at a higher rate than that to the first and second electrodes.

13. The protective device as in claim 5, wherein at least the first electrode comprises a protrusion extending towards the metal element, wherein the protrusion provides additional contact for melted metal element.

14. The protective device as in claim 5, wherein the intermediate support comprises an extension of an electrode coupled to a heat-generating element.

15. The protective device as in claim 5, wherein the intermediate support comprises a notch structure contacting to the metal element.

16. The protective device as in claim 1, wherein the substrate comprises a first insulating block and a second insulating block under the first and second electrodes, wherein a thermal conductivity coefficient of the first insulating bock is greater than that of the second insulating block.