COMPUTER CHASSIS

• US 20110058330A1
• Filed: 05/23/2008
• Published: 03/10/2011
• Est. Priority Date: 05/23/2008
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Briden, John J., Abraham, Benjamin
• Granted Patent: US 8,553,411 B2
• Time in Patent Office: Days
• US Class Current: 361/679.47
• CPC Class Codes: G06F 1/20 Cooling means

Abstract

A computer chassis is provided. The computer chassis includes a housing having a first closed compartment with a first heat sink having a first heat dissipating surface formed on one side of the first closed compartment; and a second closed compartment having a second heat sink with a second heat dissipating surface formed on one side of the second closed compartment. The first and second compartments are substantially isolated from air flow within the housing. The housing, the first closed compartment and the second closed compartment are configured to define an air passage way between the housing, the first heat dissipating surface and the second heat dissipating surface. This air passage way forms a chimney effect that aids in cooling and promotes natural air convection.

Claims

1. A computer chassis comprising:

a first closed compartment having a first heat sink with a first heat dissipating surface formed on one side of said first closed compartment; and

a second closed compartment having a second heat sink with a second heat dissipating surface formed on one side of said second closed compartment,

wherein said computer chassis, said first closed compartment and said second closed compartment are configured to define an air passage way between said computer chassis, said first heat dissipating surface and said second heat dissipating surface and to create a chimney effect in said air passage way.

2. The computer chassis of claim 1, wherein said first closed compartment is adapted to house a computer motherboard.

3. The computer chassis of claim 2, wherein said second closed compartment is adapted to house one or more computer drives.

4. The computer chassis of claim 3, wherein said computer drives include hard disk drives, optical disk drives and multi-media drives.

5. The computer chassis of claim 1, wherein said first and said second heat dissipating surfaces each comprises heat dissipating fins arranged in parallel to the direction of airflow.

6. The computer chassis of claim 1, wherein said first closed compartment and said second closed compartment each comprises a grommet.

7. The computer chassis of claim 1, wherein said first compartment further comprises a heat pipe connecting a component of said motherboard to said first heat sink.

8. The computer chassis of claim 7, wherein said component is a CPU or a CHIPSET.

9. The computer chassis of claim 1, further comprising two side panels, a bottom panel, a top panel, a removable front panel and a back panel.

10. The computer chassis of claim 9, wherein said bottom panel, said top panel and said back panel each comprises two subpanels, wherein said subpanels in said back panel are connected to each other by one or more hinges, and wherein said computer chassis can be pivoted open along the hinges to allow aces to said heat dissipating surfaces.

11. The computer chassis of claim 1, further comprising an air inlet and an air outlet.

12. The computer chassis of claim 11, further comprising a fan.

13. The computer chassis of claim 12, wherein said fan is controlled by a thermostat.

14. A computer chassis comprising:

a first compartment adapted to house a computer motherboard;

said first compartment having a first heat sink with a first heat dissipating surface formed on one side of said first compartment;

a second compartment adapted to house a first computer drive, said second compartment having, a second heat sink with a second heat dissipating surface formed on one side of said second compartment; and

a third compartment adapted to house a second computer drive, said third compartment having a third heat sink with a third heat dissipating surface formed on one side of said third compartment,

wherein said first, second and third compartments are substantially closed to air circulation within said computer chassis, and wherein said computer chassis is configured to define an air passage way between said computer chassis, said first heat dissipating surface, said second heat dissipating surface, and said third heat dissipating surface.

15. The computer chassis of claim 14, wherein, said air passage way is configured to create a chimney effect.

16. The computer chassis of claim 14, wherein said first computer drive is a hard disk drive and wherein said second computer drive is an optical disk drive or a multi-media drive.

17. The computer chassis of claim 14, wherein each of said first, second and third closed compartments comprises a grommet.

18. A method for configuring a computer chassis, comprising:

providing a first closed compartment within said computer chassis, said first closed compartment having a first heat sink with a first heat dissipating surface formed on one side of said first closed compartment;

providing a second closed compartment within said computer chassis, said second closed compartment having a second heat sink with a second heat dissipating surface formed on one side of said second closed compartment; and

arranging said first closed, compartment and said second closed compartment to define an air passage way between said computer chassis, said first heat dissipating surface and said second heat dissipating surface.

19. The method of claim 18, wherein said air passage way is configured to create a chimney effect.

20. The method of claim 19, further comprising:

providing a fan to accelerate airflow through said air passage way.