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METHOD OF FORMING A MULTILAYER SUBSTRATE CORE STRUCTURE USING SEQUENTIAL MICROVIA LASER DRILLING AND SUBSTRATE CORE STRUCTURE FORMED ACCORDING TO THE METHOD

  • US 20110058340A1
  • Filed: 11/08/2010
  • Published: 03/10/2011
  • Est. Priority Date: 06/28/2007
  • Status: Abandoned Application
First Claim
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1. An assembly comprising:

  • a package substrate, the package substrate includinga starting insulating layer having a first side and an opposing second side, the starting insulating layer including a number of vias extending from the first side to the second side, each of the vias in the starting insulating layer including a conical shape and filled with a material including copper;

    a first patterned conductive layer disposed on the first side of the starting insulating layer, the first patterned conductive layer comprised of a material including copper, at least one of the vias in the starting insulating layer contacting the first patterned conductive layer;

    a second patterned conductive layer disposed on the second side of the starting insulating layer, the second patterned conductive layer comprised of a material including copper, at least one of the vias in the starting insulating layer contacting the second patterned conductive layer;

    a first insulating layer disposed on the first patterned conductive layer and exposed portions of the first side of the starting insulating layer, the first insulating layer including a first set of vias, each via of the first set having a conical shape and filled with a material including copper;

    a third patterned conductive layer disposed on the first insulating layer, the third patterned conductive layer comprised of a material including copper, wherein at least one via of the first set contacts the first and third patterned conductive layers;

    a second insulating layer disposed on the second patterned conductive layer and exposed portions of the second side of the starting insulating layer, the second insulating layer including a second set of vias, each via of the second set having a conical shape and filled with a material including copper; and

    a fourth patterned conductive layer disposed on the second insulating layer, the fourth patterned conductive layer comprised of a material including copper, wherein at least one via of the second set contacts the second and fourth patterned conductive layers; and

    an integrated circuit (IC) device coupled with the package substrate.

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